CN202123304U - Reflow soldering cooling device - Google Patents
Reflow soldering cooling device Download PDFInfo
- Publication number
- CN202123304U CN202123304U CN2010206749656U CN201020674965U CN202123304U CN 202123304 U CN202123304 U CN 202123304U CN 2010206749656 U CN2010206749656 U CN 2010206749656U CN 201020674965 U CN201020674965 U CN 201020674965U CN 202123304 U CN202123304 U CN 202123304U
- Authority
- CN
- China
- Prior art keywords
- cooling
- reflow soldering
- air
- furnace body
- body shell
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000001816 cooling Methods 0.000 title claims abstract description 59
- 238000005476 soldering Methods 0.000 title claims abstract description 13
- 238000009434 installation Methods 0.000 abstract description 3
- 230000000694 effects Effects 0.000 abstract description 2
- 238000004519 manufacturing process Methods 0.000 abstract description 2
- 229910000679 solder Inorganic materials 0.000 description 5
- 239000012141 concentrate Substances 0.000 description 3
- 230000008645 cold stress Effects 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000005219 brazing Methods 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 229910001092 metal group alloy Inorganic materials 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000002028 premature Effects 0.000 description 1
- 238000010079 rubber tapping Methods 0.000 description 1
- 230000035882 stress Effects 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Images
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- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The utility model provides a reflow soldering cooling device which comprises a furnace body shell, a cooling tank and a fan, wherein the furnace body shell is provided with a cooling space; the cooling tank is mounted on the furnace body shell and is communicated with the cooling space; an air cooling tank is mounted on the furnace body shell and is communicated with the cooling space; while an air cooling outlet board is arranged on the position of the inner wall of the cooling space, corresponding to the air cooling tank; and the fan is mounted in the air cooling tank. Relying on the unique structural design, the two cooling modules of the reflow soldering cooling device are independently controlled; the temperature of a cooling area is displayable and adjustable; and various lead-free speed requirements can be satisfied. As each cooling module is independently controlled, the first module and the second module can be set with different temperatures; in the way, not only the high temperature time at the soldering point can be better controlled, but also stress concentration caused by quick cooling can be properly reduced. In addition, the reflow soldering cooling device also has the effects of convenience in installation and simpleness in manufacture.
Description
Technical field
The utility model relates to a kind of cooling device, more specifically is meant the Reflow Soldering cooling device.
Background technology
In the Reflow Soldering technology, cooldown rate is that unleaded reflow soldering process is most important.Increasing for lead-free solder alloy cooling can the refinement microstructure, changes form and the distribution of IMC, improves the mechanical property of brazing filler metal alloy.For the pb-free solder in the actual production, under situation about components and parts not being had a negative impact, the raising of cooldown rate also can reduce defective usually and improve reliability.If cooling rate is too fast, will cause impact to element, cause stress to concentrate; The solder joint that makes product is premature failure in use, but with regard to the cooling capacity of present reflow furnace, for pcb board and all smaller situation of components and parts size; General reflow furnace can meet the demands; For the pcb board of large scale, high density components, the actual measurement cooldown rate of welding is less usually, and promptly the tapping temperature of PCB assembly is low inadequately; Especially time above liquidus control is difficult to, and the accurate control religion between the cooling capacity of reflow furnace and cooling zone is low.
Summary of the invention
It is a kind of easy for installation that the main purpose of the utility model is to provide, and makes simple Reflow Soldering cooling device.
The technical scheme that the utility model adopts is: the Reflow Soldering cooling device; Comprise body of heater shell, cooling casing and blower fan, wherein, this body of heater shell is provided with cooling space; This cooling casing is installed on the body of heater shell and with this cooling space and is connected; This body of heater shell is provided with air-cooled casing and is connected with this cooling space, and this cooling space inwall is to should air-cooled casing being provided with the air-cooled aerofoil that goes out, and this blower fan is installed in this air-cooled casing.
The beneficial effect of the utility model is: the utility model structurally comprises body of heater shell, cooling casing and blower fan; Wherein, This body of heater shell is provided with cooling space, and this cooling casing is installed on the body of heater shell and with this cooling space and is connected, and this body of heater shell is provided with air-cooled casing and is connected with this cooling space; And this cooling space inwall is to should air-cooled casing being provided with the air-cooled aerofoil that goes out, and this blower fan is installed in this air-cooled casing.By its special structure design, two refrigerating modules of the utility model are independent controlled, and the cooling zone temperature shows and be adjustable.Can satisfy various unleaded rate requirement.The cooling of bimodulus piece can realize being provided with first module and the second module different temperatures because each module is independently controlled, and so both can control the solder joint high-temperature time preferably, can suitably reduce the fast cold stress that causes again and concentrate.In addition, the utility model also has easy for installation, makes simple effect.
Description of drawings
Fig. 1 is the sketch map of the utility model.
Fig. 2 is the cross-sectional view of the utility model.
The specific embodiment
Extremely shown in Figure 2 like Fig. 1 is a kind of preferable practical implementation example of the utility model; The Reflow Soldering cooling device; Comprise body of heater shell 10, cooling casing 20 and blower fan 30, wherein, this body of heater shell 10 is provided with cooling space 11; This cooling casing 20 is installed on the body of heater shell 10 and with this cooling space 11 and is connected; This body of heater shell 10 is provided with air-cooled casing 12 and is connected with this cooling space 11, and these cooling space 11 inwalls are to should air-cooled casing 12 being provided with the air-cooled aerofoil 13 that goes out, and this blower fan 30 is installed in this air-cooled casing 12.
20 two refrigerating modules of blower fan 30 and cooling casing are independent controlled, and the cooling zone temperature shows and be adjustable.Can satisfy various unleaded rate requirement.The cooling of bimodulus piece can realize being provided with first module and the second module different temperatures because each module is independently controlled, and so both can control the solder joint high-temperature time preferably, can suitably reduce the fast cold stress that causes again and concentrate.
Can find out that through top narration the purpose of design of the utility model can effectively implement.The part of embodiment has been showed the purpose of the utility model and has been implemented function and structural themes, and comprised other the replacement that is equal to.
Therefore, the right of the utility model constitutes the equivalence that comprises other to be implemented, and the concrete right scope is with reference to claim.
Claims (1)
1. Reflow Soldering cooling device; It is characterized in that: comprise body of heater shell, cooling casing and blower fan, wherein, this body of heater shell is provided with cooling space; This cooling casing is installed on the body of heater shell and with this cooling space and is connected; This body of heater shell is provided with air-cooled casing and is connected with this cooling space, and this cooling space inwall is to should air-cooled casing being provided with the air-cooled aerofoil that goes out, and this blower fan is installed in this air-cooled casing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010206749656U CN202123304U (en) | 2010-12-21 | 2010-12-21 | Reflow soldering cooling device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010206749656U CN202123304U (en) | 2010-12-21 | 2010-12-21 | Reflow soldering cooling device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202123304U true CN202123304U (en) | 2012-01-25 |
Family
ID=45486375
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010206749656U Expired - Lifetime CN202123304U (en) | 2010-12-21 | 2010-12-21 | Reflow soldering cooling device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202123304U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102724817A (en) * | 2012-06-24 | 2012-10-10 | 成都聚合科技有限公司 | Reflow soldering manufacturing process for large-current concentrating photovoltaic photoelectric conversion receivers |
-
2010
- 2010-12-21 CN CN2010206749656U patent/CN202123304U/en not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102724817A (en) * | 2012-06-24 | 2012-10-10 | 成都聚合科技有限公司 | Reflow soldering manufacturing process for large-current concentrating photovoltaic photoelectric conversion receivers |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| ASS | Succession or assignment of patent right |
Owner name: SHENZHEN GUANGSHENGDE TECHNOLOGY DEVELOPMENT CO., Free format text: FORMER OWNER: HU WEN Effective date: 20121128 |
|
| C41 | Transfer of patent application or patent right or utility model | ||
| COR | Change of bibliographic data |
Free format text: CORRECT: ADDRESS; FROM: GUANGDE, ANHUI PROVINCE TO: 518103 SHENZHEN, GUANGDONG PROVINCE |
|
| TR01 | Transfer of patent right |
Effective date of registration: 20121128 Address after: 518103, No. 7, Phoenix industry road, Fenghuang first industrial zone, Fuyong street, Shenzhen, Guangdong, Baoan District Patentee after: SHENZHEN GRANDSEED TECHNOLOGY DEVELOPMENT CO., LTD. Address before: Guangde County, Anhui province oath Jie town streets five groups of streets Patentee before: Hu Wen |
|
| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20120125 |