CN202120823U - Novel packaging thermal fuse - Google Patents
Novel packaging thermal fuse Download PDFInfo
- Publication number
- CN202120823U CN202120823U CN201120236914XU CN201120236914U CN202120823U CN 202120823 U CN202120823 U CN 202120823U CN 201120236914X U CN201120236914X U CN 201120236914XU CN 201120236914 U CN201120236914 U CN 201120236914U CN 202120823 U CN202120823 U CN 202120823U
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- CN
- China
- Prior art keywords
- wire
- thermal cut
- sizing material
- leading
- protector
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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Abstract
The utility model discloses a novel packaging thermal fuse, comprising a ceramic protector(11), a thermal fuse wire(12), an outgoing wire(14), a pouring sealant(13) and an adhesive tape(15). The ceramic protector(11) has box body shape having an opening, the thermal fuse wire(12) is arranged in the interior of the box body of the ceramic protector(11),and a pin(17) of the thermal fuse wire(12) is connected with the outgoing wire(14); the outgoing wire(14) penetrates through the ceramic protector(11), and the interior of the box body of the ceramic protector(11) is poured with the pouring sealant(13), and the side surface and the surface having the opening of the ceramic protector(11) are wrapped with the adhesive tape(15). The novel packaging thermal fuse of the utility model is stable and reliable in performance and convenient in installation, has better stability when used in high temperature for a long time, the fusing temperature range of the thermal fuse is more accurate, reliable and sensitive, so that the thermal fuse can be used in various working environments.
Description
Technical field
The utility model relates to a kind of novel encapsulated thermal cut-off.
Background technology
At present, normally used thermal cut-off, it is made up of insulation crust, hot melt fracture of wire, lead-out wire and embedding sizing material, adopts a thermal cut-off, and its two ends are linked to each other with left and right sides leading-out wire.If the temperature-sensitive effect of thermal cut-off is unstable or upward overproof, in use constantly, be prone to cause the damage of electronic device or product above rated temperature.
The utility model content
The purpose of the utility model is: a kind of novel encapsulated thermal cut-off is provided, and stable and reliable for performance, easy for installation, the scope of the fusing-off temperature of better, the thermal cut-off of stability is more accurate, reliable, sensitive in long term high temperature uses; Can guarantee that thermal cut-off is applied in the various operational environments.
The technical scheme of the utility model is: a kind of novel encapsulated thermal cut-off; It comprises ceramic protector, hot melt fracture of wire, leading-out wire, embedding sizing material, adhesive tape; Said ceramic protector is an opening box body shape; The hot melt fracture of wire is placed in the box body inside of ceramic protector, and the pin of hot melt fracture of wire is connected with leading-out wire, and leading-out wire passes ceramic protector; The inner embedding of the box body of pottery protector has the embedding sizing material, is wrapped with adhesive tape on the side of ceramic protector and the one side of opening.
Further explain in the face of technique scheme down:
Said ceramic protector is the carrier that the hot melt fracture of wire is installed, and has high temperature resistantly, plays good protective effect.
Said ceramic protector side is provided with is convenient to the groove that leading-out wire passes.
The charged position of the pin of said hot melt fracture of wire and leading-out wire welds together.
Said embedding sizing material is with the pin of hot melt fracture of wire and the parts sealing after the leading-out wire charged position welding.
Said embedding sizing material is the organic siliconresin sizing material.
Said embedding sizing material is the epoxy resin sizing material.
Said adhesive tape is the high-temperature heat insulation adhesive tape.
Said adhesive tape is a Kapton Tape.And, protect other heating surface with its side and embedding sizing material one side that is pasted on the encapsulation thermal cut-off, making is heated is transmitted to simultaneously, makes good stability.
The utility model has the advantages that: the novel encapsulated thermal cut-off of the utility model, hot melt fracture of wire and leading-out wire weld assembly are sealed in the ceramic protector, and the side of the thermal cut-off after will sealing and embedding sizing material upper surface attach the high temperature resistant adhesive tape of one deck; Heating surface is just isolated and is come out to have only one side like this, thereby guarantees that temperature is to rise from heating face bottom is stable, and stability better in long term high temperature uses, the scope of the fusing-off temperature of thermal cut-off is more accurate, reliable, sensitive for thermal cut-off like this.The utility model particularly suitable is as the ceramic thermal cut-off on the heater of hair straightener.
Description of drawings
Below in conjunction with accompanying drawing and embodiment the utility model is done further to describe:
Fig. 1 is the structural representation of the utility model embodiment;
Fig. 2 is the side structure sketch map of the utility model embodiment;
Fig. 3 is the decomposing schematic representation of the agent structure installing of the utility model embodiment.
Wherein: 11 ceramic protectors; 12 hot melt fracture of wires; 13 embedding sizing materials; 14 leading-out wires; 15 adhesive tapes; 17 pins.
Embodiment
Embodiment: like Fig. 1, Fig. 2, shown in Figure 3, a kind of novel encapsulated thermal cut-off, it comprises ceramic protector 11, thermal cut 12, leading-out wire 14, embedding sizing material 13, adhesive tape 15.
The pin 17 of hot melt fracture of wire 12 welds together with the charged position of leading-out wire 14.Embedding sizing material 13 is with the pin 17 of hot melt fracture of wire 12 and the weld assembly sealing after the leading-out wire 14 charged positions welding.
Embedding sizing material 13 is the organic siliconresin sizing material.Adhesive tape 15 is the high-temperature heat insulation adhesive tape, Kapton Tape.
Present embodiment adds man-hour; With pin 17 welding of leading-out wire 14 with thermal cut-off 12; To weld good parts again and put into ceramic protector 11; Inject ceramic protector 11 with embedding sizing material 13, will weld back part and expose charged position and seal, and four sides of the thermal cut-off after will sealing and upper surface (one side of embedding sizing material) attach the adhesive tape 15 of one deck high-temperature heat insulation with embedding sizing material 13.
Guaranteeing hot melt fracture of wire 12 effectively under the situation of work, with hot melt fracture of wire 12 with suitable sizing material sealing after, the adhesive tape 15 that attaches one deck high-temperature heat insulation at four sides and the upper surface of encapsulation thermal cut-off.Heating surface is just isolated and is come out to have only one side like this, thereby guarantees that temperature is to rise from heating face bottom is stable, and stability better in long term high temperature uses, the scope of the fusing-off temperature of thermal cut-off is more accurate, reliable, sensitive for thermal cut-off like this.
Should be pointed out that for the utility model also to have the embodiment of multiple conversion and remodeling, be not limited to the specific embodiment of above-mentioned execution mode through proving absolutely.The foregoing description is as just the explanation of the utility model, rather than restriction.In a word, the protection range of the utility model should comprise those conspicuous to those skilled in the art conversion or substitute and remodeling.
Claims (8)
1. novel encapsulated thermal cut-off; It is characterized in that: it comprises ceramic protector (11), hot melt fracture of wire (12), leading-out wire (14), embedding sizing material (13), adhesive tape (15); Said ceramic protector (11) is an opening box body shape; Hot melt fracture of wire (12) is placed in the box body inside of ceramic protector (11), and the pin (17) of hot melt fracture of wire (12) is connected with leading-out wire (14), and leading-out wire (14) passes ceramic protector (11); The inner embedding of the box body of pottery protector (11) has embedding sizing material (13), is wrapped with adhesive tape (15) on the side of ceramic protector (11) and the one side of opening.
2. novel encapsulated thermal cut-off according to claim 1 is characterized in that: said ceramic protector (11) side is provided with is convenient to the groove that leading-out wire (14) passes.
3. novel encapsulated thermal cut-off according to claim 1 is characterized in that: the pin (17) of said hot melt fracture of wire (12) welds together with the charged position of leading-out wire (14).
4. novel encapsulated thermal cut-off according to claim 3 is characterized in that: said embedding sizing material (13) is with the pin (17) of hot melt fracture of wire (12) and the weld assembly sealing after leading-out wire (14) the charged position welding.
5. according to claim 1 or 4 described novel encapsulated thermal cut-ofves, it is characterized in that: said embedding sizing material (13) is the organic siliconresin sizing material.
6. according to claim 1 or 4 described novel encapsulated thermal cut-ofves, it is characterized in that: said embedding sizing material (13) is the epoxy resin sizing material.
7. novel encapsulated thermal cut-off according to claim 1 is characterized in that: said adhesive tape (15) is the high-temperature heat insulation adhesive tape.
8. novel encapsulated thermal cut-off according to claim 1 is characterized in that: said adhesive tape (15) is a Kapton Tape.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201120236914XU CN202120823U (en) | 2011-07-07 | 2011-07-07 | Novel packaging thermal fuse |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201120236914XU CN202120823U (en) | 2011-07-07 | 2011-07-07 | Novel packaging thermal fuse |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202120823U true CN202120823U (en) | 2012-01-18 |
Family
ID=45461865
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201120236914XU Expired - Lifetime CN202120823U (en) | 2011-07-07 | 2011-07-07 | Novel packaging thermal fuse |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202120823U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105784180A (en) * | 2016-04-18 | 2016-07-20 | 佛山市川东磁电股份有限公司 | Sensor insulation adapting structure |
-
2011
- 2011-07-07 CN CN201120236914XU patent/CN202120823U/en not_active Expired - Lifetime
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105784180A (en) * | 2016-04-18 | 2016-07-20 | 佛山市川东磁电股份有限公司 | Sensor insulation adapting structure |
| CN105784180B (en) * | 2016-04-18 | 2019-04-02 | 佛山市川东磁电股份有限公司 | A kind of sensor insulation adapter structure |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term |
Granted publication date: 20120118 |
|
| CX01 | Expiry of patent term |