CN202102019U - Test probe card - Google Patents
Test probe card Download PDFInfo
- Publication number
- CN202102019U CN202102019U CN2011201361070U CN201120136107U CN202102019U CN 202102019 U CN202102019 U CN 202102019U CN 2011201361070 U CN2011201361070 U CN 2011201361070U CN 201120136107 U CN201120136107 U CN 201120136107U CN 202102019 U CN202102019 U CN 202102019U
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- Prior art keywords
- probe
- interface layer
- vacancy section
- forms
- module
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- Expired - Fee Related
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- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Abstract
The utility model relates to a test probe card, comprising a switching module and a probe module capable of being assembled and disassembled with each other, wherein, the switching module comprises a fixing frame in which a circuit switching plate is arranged, the probe module comprises a frame body in which an interface layer and a probe assembly are arranged. Another fixing frame is arranged on the fixing frame of the switching module to make the circuit switching plate, the interface layer and the probe module in electrical connections. Therefore, operators can replace the parts in the test probe card by disassembling the switching module and the probe module firstly, and replacing the parts in the test probe card, and then assembling the switching module and the probe module again, or employing a mode of replacing the whole switching module or the probe module, and accordingly, by using the test probe card of the utility model, the speed and efficiency of the parts replacement working can be improved effectively without needing to disassemble all the parts one by one.
Description
Technical field
The utility model is a kind of proving installation, is meant a kind of test probe card that is used for the wafer detection applications especially.
Background technology
Wafer test machine system is used to detect the facility of wafer yield, mainly is with the contact on each wafer cell in the probe contact measured wafer, and imposes detection signal so that wafer is carried out functional detection, and then filters out defective products.
Please refer to the probe of an existing wafer test machine shown in Figure 10; This probe mainly is provided with a holder 51 at a wiring substrate 50 downsides; This holder 51 has down an opening 510; These holder 51 inside are provided with an interface layer 52 and a line transfer plate 53 that stacks up and down, and this wiring substrate 50, interface layer 52 all are provided with conductive junction point with this line transfer plate 53 and constitute each other and electrically contact; Again; Be provided with a probe assembly 54 in the opening 510 of this holder 51; This probe assembly 54 is to be pulled in the opening 510 of this holder 51 by the limiting plate that is arranged on these holder 51 downsides 55 tops; And the plural probe on the probe assembly 54 is electrically contacted with the conductive junction point formation of this line transfer plate 53, wherein this holder 51 is to be locked on wiring substrate 50 by bolt 56 with limiting plate 55.
During operation; Probe on the probe assembly 54 is with the contact measured wafer; And can transmit test signal to wafer to be measured by a micro computer, and test signal is sent to be measured wafer via interface layer 52, line transfer plate 53 with probe assembly 54 from distribution substrate 50, and the reaction signal of wafer to be measured passes back to micro computer by probe assembly 54 again; Carry out functional selection by micro computer, carry out the testing goal of wafer by this.
In the time of must changing if interface layer 52, line transfer plate 53 damage with probe assembly 54 member wherein; Because of this holder 51 and this limiting plate 55 are only locked on wiring substrate 50 by bolt 56; Must earlier bolt 56 be separated; This moment holder 51, interface layer 52, line transfer plate 53, probe assembly 54 with limiting plate 55 with separated from one another, thereby the member that damages is replaced with the member that can normally use; Yet; Because of holder 51, interface layer 52, line transfer plate 53, probe assembly 54 have been the aspect of separating with limiting plate 55; Because of what member that can't differentiate in interface layer 52, line transfer plate 53 and the probe assembly 54 damages, cause the operating personnel to detect one by one again, after again the member that damages being changed; Aforementioned all members are reinstalled be combined in wiring substrate 50, cause the loaded down with trivial details inconvenience in the operation.
In addition, when group was established line transfer plate 53 in 52 last times of interface layer, correctly be electrically connected with the conductive junction point system of 54 of probe assemblies for guaranteeing interface layer 52, line transfer plate 53, the conductive junction point that interface layer 52 and line transfer plate are 53 must be through once correction; Again, when group was established probe assembly 54 in 53 last times of line transfer plate, the conductive junction point that probe assembly 54 and line transfer plate are 53 must be again through once proofreading and correct, so aligning step is complicated, causes the inconvenience in the use.
Summary of the invention
The fundamental purpose of the utility model provides a kind of test probe card; When hope improving existing probe and being stuck in the arbitrary member damage in interface layer, line transfer plate and the probe assembly; After all member is disassembled and is detected one by one; The problems such as the loaded down with trivial details inconvenience of operation that again each member re-assemblied, and the complicated problem of aligning step in the assembling process.
Take off purpose for before reaching, the technological means that the utility model adopted provides a kind of test probe card, and it includes:
One switching module includes:
One fixed frame, the position, intermediate portion forms a vacancy section; And
One circuit switching plate is removable group is installed in this fixed frame, and this circuit switching plate is provided with plural transit line in the vacancy section place of respective fixation frame, and each transit line forms contact respectively in the relative two sides of circuit switching plate; And
One probe module includes:
One framework, the position, intermediate portion is formed with a vacancy section;
One interface layer is arranged in this framework, has plural intermediary circuit in this interface layer, and each intermediary's circuit forms contact respectively in the relative two sides of interface layer;
One probe assembly is arranged in this framework, and this probe assembly includes plural probe, and the contact of corresponding intermediary circuit forms electrical the contact in each probe and the interface layer; And
One fixed head; Provide framework, probe assembly and interface layer group to establish wherein; This fixed head forms an opening corresponding to the plural probe place of probe assembly; The probe module is mounted on fixed head on the fixed frame of switching module, and the contact of each intermediary's circuit of interface layer electrically contacts with the contact formation of the corresponding transit line of circuit switching plate.
Described test probe card, wherein this probe assembly is provided with plural peephole, and should the plural number probe be arranged in the zone that this plural number peephole enclosed, and this interface layer is provided with location reference point in the corresponding position of peephole.
By aforementioned test probe card design; It mainly is the structure that utilizes switching module and probe module two individual module to assemble; If when arbitrary in circuit switching plate, interface layer or the probe assembly or more than when situation and the desire replacing of damage arranged; System can separate switching module and probe module earlier each other, and then independent alternative routing card extender, interface layer or probe assembly, or directly changes with individual modules; Therefore, compared to prior art, the utility model is avoided proving installation integral body is separated fully, and can the modularity mode replace, and can promote speed and the convenience that re-assemblies the utility model, and can effectively promote operating efficiency.
In addition, because of probe assembly and interface series of strata group are located on the framework, probe assembly is provided with plural peephole again; And this interface layer is provided with location reference point in the corresponding position of peephole; During assembling, need only aim at calibration, can guarantee that interface layer correctly is connected with probe assembly between peephole and location reference point; Compared to prior art, be convenient many.
Description of drawings
Fig. 1: a preferred embodiment perspective exploded view of the utility model test probe card;
Fig. 2: the three-dimensional exploded view of a test probe card preferred embodiment shown in Figure 1 and a circuit support plate;
Fig. 3: Fig. 2 makes up stereo appearance figure;
The local floor map of amplifying of Fig. 4: Fig. 2;
The cross-sectional schematic of Fig. 5: Fig. 4;
The local enlarged diagram of Fig. 6: Fig. 5;
Fig. 7: the electric card extender stereo appearance figure in the utility model;
Fig. 8: another stereo appearance figure of electric card extender in the utility model;
Fig. 9: the preferred embodiment user mode synoptic diagram in the utility model;
Figure 10: synoptic diagram is looked by existing wafer tester portion.
The main label declaration of accompanying drawing
1 switching module, 10 circuit support plates
100 contacts, 11 fixed frames
110 vacancy sections, 111 outer grooves
112 are provided with groove 12 circuit switching plates
120 contacts
2 probe modules, 20 frameworks
200 underframes, 01 upper ledge
202 vacancy sections, 203 location indentations
204 locating slots, 205 storage tanks
206 vacancy sections, 207 extensions
21 probe assemblies, 210 ceramic wafers
211 probes, 212 peepholes
213 springs, 22 contact beds
Conductive junction point on 220 location reference point 221
222 times conductive junction point 23 fixed heads
230 openings, 231 tanks
232 breach, 50 wiring substrates
510 openings, 51 holders
The 52 53 times electric card extenders of card extender that power on
54 probe assemblies, 55 limiting plates
56 bolts
Embodiment
Please refer to preferred embodiment shown in Figure 1, the utility model test probe card includes a switching module 1 and a probe module 2.
This switching module 1 includes a fixed frame 11 and a circuit switching plate 12.Wherein:
The middle part of this fixed frame 11 forms vacancy section 110, and in this preferred embodiment, this fixed frame 11 extends out in vacancy section 110 upsides again and forms big outer groove 111, still can extend out formation one again in vacancy section 110 downsides groove 112 (as shown in Figure 5) is set.
This circuit switching plate 12 is to be arranged in the vacancy section 110 of this fixed frame 11; Or like this preferred embodiment; Make circuit switching plate 12 be mounted on being provided with in the groove 112 of vacancy section 110; Circuit switching plate 12 is provided with plural transit line in vacancy section 110 places of respective fixation frame 11, and each transit line forms contact 120 respectively in circuit switching plate 12 relative two sides.
This probe module 2 includes a framework 20, a probe assembly 21, an interface layer 22 and a fixed head 23.Wherein:
This framework 20 can be solid memder or for the assembly of plural member, in this preferred embodiment, this framework 20 includes a underframe 200 and a upper ledge 201.This underframe 200 is the ring bodies that forms an ellipse; And the position, intermediate portion forms the vacancy section 202 of a rectangle; Underframe 200 upsides form a location recess 203 respectively in the long relatively periphery, limit of rectangle vacancy section 202, and form locating slot 204 in two relative short edge upsides, and underframe 200 downsides form a storage tank 205 (as shown in Figure 5) again in vacancy section 202 peripheries: this upper ledge 201 is a rectangle framework; The position, intermediate portion is formed with a vacancy section 206; This upper ledge 201 is to be arranged on this underframe 200 upsides, and the position is in the vacancy section 202 of underframe 200, and 201 4 ends of this upper ledge form extension 207 in the locating slot that is arranged on underframe 200 204.
This probe assembly 21 is arranged in this framework 20, and it includes single ceramic wafer 210 and plurality of probes 211.This ceramic wafer 210 is to be arranged on this underframe 200 and upper ledge 201 upsides; And be contained in the location indentations 203 of underframe 200; The outer shroud place of this ceramic wafer 210 is formed with the peephole 212 that plural number vertically runs through, and the thickness at these ceramic wafer 210 outer shroud places forms thinner between adjacent peephole 212; This plural number probe 211 is to distribute to be located in the zone that this plural number peephole 212 enclosed; The top of this plural number probe 211 protrudes from this ceramic wafer 210 top sides; Please refer to shown in Figure 6; Each probe 211 mainly is to connect in a probe to establish a spring 213, make the probe of probe 211 by spring 213 electrical transmission and elastic force are provided, and ceramic wafer 210 moves up and down relatively.
This interface layer 22 is to be arranged on this framework 20 bottom sides; Present embodiment system is arranged in the storage tank 205 of underframe 200; Please refer to like Fig. 7 and shown in Figure 8, these interface layer 22 upper sides form location reference point 220 for these plural number peephole 212 positions, in 220 regions of this plural number location reference point, are provided with a plurality of intermediaries circuit; Each intermediary's circuit forms conductive junction point 221 respectively at interface layer 22 upper sides, and forms down conductive junction point 222 in interface layer 22 downsides.When probe assembly 21 and interface layer 22 are arranged on 20 last times of this framework; Each location reference point 220 all can correspond to the position of each peephole 212 on this probe assembly 21, and conductive junction point 221 electrically contacts corresponding probe 211 bottoms respectively on this interface layer 22 each; Therefore when mounted, need only confirm contraposition between peephole 212 and the location reference point 220, can guarantee that interface layer 22 has constituted correct being electrically connected with probe assembly 21.
This fixed head 23 is to form the ring plate shape; The opening 230 that zone formation one runs through wherein; This fixed head 23 forms a tank 231 (as shown in Figure 5) in opening 230 downsides; This tank 231 supplies the top side system of aforementioned probe assembly 21 to be provided with wherein, and the zone of corresponding probe assembly 21 peepholes 212 of opening 230 peripheries forms breach 232 again, is to make those peepholes 212 and probe 211 can expose to this opening 230 and breach 232.
Please arrange in pairs or groups and be installed on the synoptic diagram of a circuit support plate referring to figs. 2 to the utility model preferred embodiment shown in Figure 5.When the utility model test probe card is applied to wafer detection facility; System makes test probe card upset upside-down mounting; And be locked on its circuit support plate 10 of wafer machines with the fixed frame 11 of switching module 1; And corresponding contact 100 is constituted electrically contact; And then the intermediary's circuit through interface layer, make each probe 211 respectively with this circuit support plate 10 on corresponding contact 100 constitute and electrically contact, those contacts 100 of this circuit support plate 10 are electrically connected to the micro computer of wafer detection facility in addition.
Please refer to shown in Figure 9; Carrying out wafer when detecting, is to make wafer detect on the plummer 30 of facility place a wafer 31 to be measured, and the probe 211 that operating personnel can operate in the utility model electrically contacts the corresponding contact on the wafer cell in the wafer 31 to be measured; And see through 211 pairs of those probes by micro computer should wafers 31 transmission test signals to be measured; And receive the signal of wafer to be measured 31 reactions, and whether correct, carry out the test of wafer by this by micro computer if carrying out the function of analysis and judgement wafer cell.
Establishing of mat the utility model is because the utility model system is assembled by removable group switching module 1 and probe module 2, if when circuit switching plate 12 and interface layer 22 have situation and the desire of damage to change; System can separate switching module 1 and probe module 2 each other, and the circuit switching plate 12 on the independent replacement switching module 1, or the interface layer 22 on the replacement probe module 2; Therefore must the proving installation integrated member not removed and separate; In addition, the mode that switching module 1 also capable of using or probe module 2 take entire module to change is carried out, so; The utility model promotes and re-assemblies the speed and the convenience of the utility model, and can effectively promote operating efficiency.
Claims (5)
1. test probe card is characterized in that it includes:
One switching module includes:
One fixed frame, the position, intermediate portion forms a vacancy section; And
One circuit switching plate is removable group is installed in this fixed frame, and this circuit switching plate is provided with plural transit line in the vacancy section place of respective fixation frame, and each transit line forms contact respectively in the relative two sides of circuit switching plate; And
One probe module includes:
Framework, the position, intermediate portion is formed with a vacancy section;
One interface layer is arranged in this framework, has plural intermediary circuit in this interface layer, and each intermediary's circuit forms contact respectively in the relative two sides of interface layer;
One probe assembly is arranged in this framework, and this probe assembly includes plural probe, and the contact of corresponding intermediary circuit forms electrical the contact in each probe and the interface layer; And
One fixed head; Provide framework, probe assembly and interface layer group to establish wherein; This fixed head forms an opening corresponding to the plural probe place of probe assembly; The probe module is mounted on fixed head on the fixed frame of switching module, and the contact of each intermediary's circuit of interface layer electrically contacts with the contact formation of the corresponding transit line of circuit switching plate.
2. test probe card according to claim 1 is characterized in that wherein this probe assembly is provided with plural peephole, and should the plural number probe be arranged in the zone that this plural number peephole enclosed, and this interface layer is provided with location reference point in the corresponding position of peephole.
3. test probe card according to claim 2 is characterized in that, this probe assembly system includes a ceramic wafer, and this plural number probe system distributes and is located in this ceramic wafer, and aforementioned peephole is formed on this ceramic wafer outer shroud place.
4. according to each described test probe card in the claim 1 to 3; It is characterized in that; This fixed frame extends out in its vacancy section upside again and forms an outer groove for this fixed head setting wherein, and extends out in its vacancy section downside again and to form one and groove is set for this circuit switching plate setting wherein.
5. test probe card according to claim 4 is characterized in that, this framework includes:
One underframe; The position, intermediate portion forms a rectangle vacancy section; The underframe upside forms a location recess respectively in the long relatively periphery, limit of rectangle vacancy section, form locating slot in two relative short edge upsides, and the underframe downside forms a storage tank for this interface layer setting wherein again in the vacancy section periphery; And
One upper ledge is a rectangle framework, and the position, intermediate portion is formed with a vacancy section, and this upper ledge system is arranged on this underframe upside, and the position is in the vacancy section of underframe, and four ends of this upper ledge form extension in the locating slot that is arranged on underframe.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011201361070U CN202102019U (en) | 2011-05-03 | 2011-05-03 | Test probe card |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011201361070U CN202102019U (en) | 2011-05-03 | 2011-05-03 | Test probe card |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202102019U true CN202102019U (en) | 2012-01-04 |
Family
ID=45388024
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011201361070U Expired - Fee Related CN202102019U (en) | 2011-05-03 | 2011-05-03 | Test probe card |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202102019U (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103645356A (en) * | 2013-11-26 | 2014-03-19 | 上海华力微电子有限公司 | Arrangement method of WAT test head |
| TWI479158B (en) * | 2013-01-28 | 2015-04-01 | Mpi Corp | Wafer testing probe card |
| CN106568992A (en) * | 2015-10-07 | 2017-04-19 | 三菱电机株式会社 | Probe position inspection apparatus, semiconductor device inspection apparatus and semiconductor device inspection method |
| TWI610081B (en) * | 2016-05-27 | 2018-01-01 | 蘇州明皜傳感科技有限公司 | Probe card for measuring micro-capacitance |
| TWI767803B (en) * | 2021-07-26 | 2022-06-11 | 旭光科國際有限公司 | The method of implanting needles of IC test socket and its fixture |
-
2011
- 2011-05-03 CN CN2011201361070U patent/CN202102019U/en not_active Expired - Fee Related
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI479158B (en) * | 2013-01-28 | 2015-04-01 | Mpi Corp | Wafer testing probe card |
| US9823272B2 (en) | 2013-01-28 | 2017-11-21 | Mpi Corporation | Wafer testing probe card |
| CN103645356A (en) * | 2013-11-26 | 2014-03-19 | 上海华力微电子有限公司 | Arrangement method of WAT test head |
| CN106568992A (en) * | 2015-10-07 | 2017-04-19 | 三菱电机株式会社 | Probe position inspection apparatus, semiconductor device inspection apparatus and semiconductor device inspection method |
| US10209273B2 (en) | 2015-10-07 | 2019-02-19 | Mitsubishi Electric Corporation | Probe position inspection apparatus, semiconductor device inspection apparatus and semiconductor device inspection method |
| CN106568992B (en) * | 2015-10-07 | 2019-10-25 | 三菱电机株式会社 | The inspection method of probe location check device, the check device of semiconductor device and semiconductor device |
| TWI610081B (en) * | 2016-05-27 | 2018-01-01 | 蘇州明皜傳感科技有限公司 | Probe card for measuring micro-capacitance |
| TWI767803B (en) * | 2021-07-26 | 2022-06-11 | 旭光科國際有限公司 | The method of implanting needles of IC test socket and its fixture |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C53 | Correction of patent for invention or patent application | ||
| CB03 | Change of inventor or designer information |
Inventor after: Wang Jiahuang Inventor after: Lu Xinjie Inventor after: Li Rongfu Inventor before: Wang Jiayu Inventor before: Lu Xinjie Inventor before: Li Rongfu |
|
| COR | Change of bibliographic data |
Free format text: CORRECT: INVENTOR; FROM: WANG JIAYU LU XINJIE LI RONGFU TO: WANG JIAHUANG LU XINJIE LI RONGFU |
|
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20120104 Termination date: 20190503 |