CN202091927U - Thin backlight source device - Google Patents

Thin backlight source device Download PDF

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Publication number
CN202091927U
CN202091927U CN201120184156.1U CN201120184156U CN202091927U CN 202091927 U CN202091927 U CN 202091927U CN 201120184156 U CN201120184156 U CN 201120184156U CN 202091927 U CN202091927 U CN 202091927U
Authority
CN
China
Prior art keywords
circuit board
lamp group
lgp
led lamp
thin backlight
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201120184156.1U
Other languages
Chinese (zh)
Inventor
张媛
肖瑀
张丽
毕磊
林雨
李东
蔡放
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ANSHAN YES OPTOELECTRONICS DISPLAY Co Ltd
Original Assignee
ANSHAN YES OPTOELECTRONICS DISPLAY Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ANSHAN YES OPTOELECTRONICS DISPLAY Co Ltd filed Critical ANSHAN YES OPTOELECTRONICS DISPLAY Co Ltd
Priority to CN201120184156.1U priority Critical patent/CN202091927U/en
Application granted granted Critical
Publication of CN202091927U publication Critical patent/CN202091927U/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Abstract

The utility model relates to a thin backlight source device which comprises a light guiding board, an LED (light-emitting diode) lamp group, a circuit board and a light shading film, wherein the LED lamp group is a lamp array formed by a plurality of LED lamps; the light emitting surface of the LED lamp group is arranged with one side surface of the light guiding board face to face; the LED lamp group and the light guiding board are arranged on the circuit board together; the light shading film is surrounded on other three side surfaces on which the LED lamp group is not arranged outside the light guiding board and the circuit board; the circuit board is an LCM (liquid crystal module) printed circuit board, and white light reflecting solder resist ink is brushed on one surface of the circuit board in contact with the light guiding board; staggered array-shaped dots are arranged on one surface of the light guiding board in contact with the circuit board; the dots of the light guiding board is formed by injection molding by a laser mould; the back surface of the light guiding board provided with the dots is treated in a sand milling or discharging manner, and the haze range is 70-85%. The thin backlight source device has reliable performance and simple structure, is easy to manufacture, further saves the materials and the labors and reduces the cost. Therefore, the market competitiveness of the thin backlight source device is improved.

Description

A kind of thin backlight device
Technical field
The utility model relates to a kind of backlight arrangement, particularly a kind of thin backlight device.
Background technology
Backlight is a kind of for the assembly of LCD screen background light source can be provided.LCD screen itself is not luminous, and is backlight for display provides background light source, and displaying contents also can be high-visible under dark attitude environment to make the LCD screen.At present, most widely used in many products such as mobile phone, all kinds of instrument and meter, household electrical appliances display screen in the electronic product with the LED-backlit technology.The difference of color according to demand, backlight can provide polychrome bias light such as red, orange, yellow, green, blue, white, make LCD screen displaying contents abundant, and visual effect has obtained qualitative leap.
Backlight can be divided into two types of straight lower bottom part light and side lights according to the difference of lamp source position.The main element of conventional side light backlight arrangement has: LGP, LED lamp group, LCM printed circuit board (PCB), photomask, LED printed circuit board (PCB), reflectance coating, diffusion barrier, aggravation along with market competition, improving constantly of customer requirement, the pressure of Costco Wholesale day by day manifests, following some drawback has appearred in this backlight: 1) use element many, cause the backlight overall structure blocked up, and then thickened the thickness of whole vision product; 2) backlight self cost that causes of element higher relatively more, and price competitiveness is relatively poor; 3) technology relative complex, production process is many, causes labour's waste and inefficiency.
Therefore, need a kind of dependable performance in the production of backlight, simple in structure, make to be easy to, save material and labour, slim backlight arrangement, and then reduce cost, improve the product market competition ability.
The utility model content
The purpose of this utility model provides a kind of thin backlight device, and this device performance is reliable, simple in structure, making is easy and then saved material and labour, and has reduced cost, has improved the competitiveness of product in market.
For achieving the above object, the utility model is realized by the following technical solutions:
A kind of thin backlight device, comprise LGP, LED lamp group, circuit board, photomask, described LED lamp group is the lamp row that several LED lamps are formed, a side of the exiting surface of LED lamp group and LGP is provided with face-to-face, LED lamp group and LGP together are arranged on the circuit board, and described photomask is enclosed in LGP and outer the removing of circuit board is provided with on its excess-three side of LED lamp group.
Described circuit board is the LCM printed circuit board (PCB), and is brushed with white reflection welding resistance printing ink in the one side that contacts with LGP.
Described white reflection welding resistance printing ink reflector efficiency scope is more than 85%, and at the not xanthochromia of ringing that is heated below 80 ℃, does not come off.
The one side that described LGP contacts with circuit board is provided with staggered shape site, and the diameter range of site is 0.03mm-0.035mm, and depth bounds is 0.02mm-0.025mm.
Described light guide plate mesh point adopts the laser die injection moulding to make, and LGP is provided with the back side of site and adopts frosted or discharge mode to handle, and the mist degree scope is 70%-85%.
Described LED lamp group adopts the mode of welding to be connected with circuit board.
Described LGP adopts bonding with circuit board or the rivet hot mode is connected.
Compared with prior art, the beneficial effects of the utility model are: 1) removed the printed circuit board (PCB) of the LED of traditional backlight source apparatus, LED lamp group is accurately located, directly be welded on the printed circuit board (PCB) of liquid crystal module, reduce the space of backlight arrangement, saved cost; 2) dependable performance, adopt laser die injection moulding light guide plate mesh point, make the more traditional site of light guide plate mesh point of this utility model littler, arrange more intensive, adopting littler more intensive site to cooperate with the frosted or the discharge mode of LGP handles, effectively replaced diffusion barrier, the backlight arrangement element is simplified; 3) the green welding resistance printing ink on the removal traditional circuit-board adopts white reflection welding resistance printing ink, has effectively replaced reflectance coating, has also reached the purpose that the backlight arrangement element is simplified; 4) simple in structure, composed component is few, and then has reduced making flow process and labour's investment, has reduced Material Cost and labor cost, has strengthened the price competitiveness of product self; 5) the backlight general thickness is little, can be applied in the thin vision product, makes the vision product design more attractive in appearance, has improved the competitiveness of product in market, has promotional value widely.
Description of drawings
Fig. 1 is a structural representation of the present utility model.
Fig. 2 is a structural representation front view of the present utility model.
Fig. 3 is the schematic diagram of site on the LGP of the present utility model.
Among the figure: the 6-white reflection welding resistance printing ink of 1-LGP 2-LED lamp group 3-circuit board 4-photomask 5-site
The specific embodiment
Below in conjunction with accompanying drawing the specific embodiment of the present utility model is described in further detail.
See Fig. 1, Fig. 2, Fig. 3, a kind of thin backlight device, comprise LGP 1, LED lamp group 2, circuit board 3, photomask 4, LED lamp group 2 is the lamp row that several LED lamps are formed, a side of the exiting surface of LED lamp group 2 and LGP 1 is provided with face-to-face, LED lamp group 2 together is arranged on the circuit board 3 with LGP 1, photomask 4 is enclosed in LGP 1 and circuit board 3 outer removing are provided with on its excess-three side of LED lamp group 2, circuit board 3 is brushed with white reflection welding resistance printing ink 6 for the LCM printed circuit board (PCB) and in the one side that contacts with LGP 1, white reflection welding resistance printing ink 6 reflector efficiency scopes are more than 85%, and at the not xanthochromia of ringing that is heated below 80 ℃, do not come off, the one side that LGP 1 contacts with circuit board 3 is provided with staggered shape site 5, the diameter range of site 5 is 0.03mm-0.035mm, depth bounds is 0.02mm-0.025mm, LGP 1 site adopts the laser die injection moulding to make, LGP 1 is provided with the back side of site 5 and adopts frosted or discharge mode to handle, the mist degree scope is 70%-85%, LED lamp group 2 adopts the mode of welding to be connected with circuit board 3, and LGP 1 adopts bonding with circuit board 3 or the rivet hot mode is connected.
Among the embodiment, LED lamp group 2 is luminous, light source directly enters in the LGP 1 and propagates, when light is mapped on the LGP 1 site 5, reverberation can be toward all angles diffusion, then by LGP 1 positive the ejaculation, as Fig. 3, utilize various densitys, site 5 not of uniform size to cooperate the frosted in LGP 1 front to handle, can make LGP 1 uniformly light-emitting, in the even reflected back LGP 1 of the light that white reflection welding resistance printing ink 6 can effectively expose the bottom surface, be uniformly distributed in the luminous zone again, improve the front face brightness of LGP 1, offer the LCD light source.

Claims (7)

1. thin backlight device, it is characterized in that, comprise LGP, LED lamp group, circuit board, photomask, described LED lamp group is the lamp row that several LED lamps are formed, a side of the exiting surface of LED lamp group and LGP is provided with face-to-face, LED lamp group and LGP together are arranged on the circuit board, and described photomask is enclosed in LGP and outer the removing of circuit board is provided with on its excess-three side of LED lamp group.
2. a kind of thin backlight device according to claim 1 is characterized in that described circuit board is the LCM printed circuit board (PCB), and is brushed with white reflection welding resistance printing ink in the one side that contacts with LGP.
3. a kind of thin backlight device according to claim 2 is characterized in that, described white reflection welding resistance printing ink reflector efficiency scope is more than 85%, and at the not xanthochromia of ringing that is heated below 80 ℃, does not come off.
4. a kind of thin backlight device according to claim 1 and 2, it is characterized in that, the one side that described LGP contacts with circuit board is provided with staggered shape site, and the diameter range of site is 0.03mm--0.035mm, and depth bounds is 0.02mm--0.025mm.
5. a kind of thin backlight device according to claim 4 is characterized in that, described light guide plate mesh point adopts the laser die injection moulding to make, and LGP is provided with the back side of site and adopts frosted or discharge mode to handle, and the mist degree scope is 70%-85%.
6. a kind of thin backlight device according to claim 1 is characterized in that, described LED lamp group adopts the mode of welding to be connected with circuit board.
7. a kind of thin backlight device according to claim 1 is characterized in that, described LGP adopts bonding with circuit board or the rivet hot mode is connected.
CN201120184156.1U 2011-06-02 2011-06-02 Thin backlight source device Expired - Fee Related CN202091927U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201120184156.1U CN202091927U (en) 2011-06-02 2011-06-02 Thin backlight source device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201120184156.1U CN202091927U (en) 2011-06-02 2011-06-02 Thin backlight source device

Publications (1)

Publication Number Publication Date
CN202091927U true CN202091927U (en) 2011-12-28

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN201120184156.1U Expired - Fee Related CN202091927U (en) 2011-06-02 2011-06-02 Thin backlight source device

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CN (1) CN202091927U (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102278665A (en) * 2011-06-02 2011-12-14 鞍山亚世光电显示有限公司 Thin backlight source device
CN105372740A (en) * 2015-11-13 2016-03-02 重庆鑫翎创福光电科技股份有限公司 PMMA light guide plate with light-out microprism structure
CN105372748A (en) * 2015-11-13 2016-03-02 重庆鑫翎创福光电科技股份有限公司 MS light guide plate with light-out microprism structure
CN105551400A (en) * 2015-12-07 2016-05-04 联想(北京)有限公司 Light emitting module of electronic equipment and manufacturing method of light emitting module

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102278665A (en) * 2011-06-02 2011-12-14 鞍山亚世光电显示有限公司 Thin backlight source device
CN105372740A (en) * 2015-11-13 2016-03-02 重庆鑫翎创福光电科技股份有限公司 PMMA light guide plate with light-out microprism structure
CN105372748A (en) * 2015-11-13 2016-03-02 重庆鑫翎创福光电科技股份有限公司 MS light guide plate with light-out microprism structure
CN105551400A (en) * 2015-12-07 2016-05-04 联想(北京)有限公司 Light emitting module of electronic equipment and manufacturing method of light emitting module
CN105551400B (en) * 2015-12-07 2018-06-01 联想(北京)有限公司 Illuminating module of a kind of electronic equipment and preparation method thereof

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Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20111228

Termination date: 20150602

EXPY Termination of patent right or utility model