CN202072785U

CN202072785U - Wafer electroplating fixture

Info

Publication number: CN202072785U
Application number: CN2011201089160U
Authority: CN
Inventors: 谢浩; 刘建炜
Original assignee: Chipmore Technology Corp Ltd
Current assignee: Chipmore Technology Corp Ltd
Priority date: 2011-04-14
Filing date: 2011-04-14
Publication date: 2011-12-14
Anticipated expiration: 2021-04-14

Abstract

The utility model discloses a wafer electroplating fixture which comprises a wafer electroplating fixture side plate and a conductive spring plate arranged on the wafer electroplating fixture side plate, wherein the conductive spring plate comprises a fixed surface, a side surface, a bottom surface, a contact surface and an extending surface which are sequentially connected; and a connecting part between the contact surface and the extending surface is a convex cambered surface structure. in the wafer electroplating fixture, the connecting part between the contact surface and the extending surface is designed to be the convex cambered surface structure so that the contact area between the conductive spring plate and a water is increased, the bad contact between the conductive spring plate and the wafer is avoided; and therefore, the electrical conductivity of the wafer is enhanced and a powerful guarantee is supplied to the formation of following coating layers and metal lugs with the good quality.

Description

The wafer electroplating clamp

Technical field

The utility model relates to the semiconductor device processing technology field, more particularly, relates to a kind of wafer electroplating clamp.

Background technology

In fabrication of semiconductor device, the metal coupling on the device is used as point of contact and connects each bar circuit, each drive IC or flexible circuit board (FPC).The forming process of described metal coupling comprises: processing steps such as depositing metal films, photoetching, etching, plating.Wherein, the quality of electroplating process directly influences the quality of the final metal coupling that forms.

In the electroplating technology process, often wafer need be positioned on the wafer electroplating clamp, the wafer electroplating clamp is provided with a plurality of electroconductive elastic sheets, and these electroconductive elastic sheets contact with wafer on the wafer electroplating clamp.Because electroconductive elastic sheet can link to each other with external power source by coupled lead, therefore, the wafer on the wafer electroplating clamp can link to each other with external power source in electroplating technology again, and then can form required coating on its surface by the decomposition of electroplate liquid.

Owing to for being electrically connected,, and then influence the quality of follow-up formed metal coupling between the wafer on the wafer electroplating clamp and the electroconductive elastic sheet so whether contact the good quality that directly influences coating on the wafer between the two.With reference to figure 1, Fig. 1 is the side structure synoptic diagram of electroconductive elastic sheet on the existing wafer electroplating clamp, after wafer being placed on the wafer electroplating clamp, the wafer side will contact with the side 1 of electroconductive elastic sheet, and 3 positions, turning that close electroconductive elastic sheet side 1 of point of contact and side 2 are constituted, because the wafer side is convex structure, so contacting between wafer and the electroconductive elastic sheet only is that line contacts.In the electroplating technology process, because electroconductive elastic sheet duration of service is long or the factors such as vibration of electroplate liquid, it is loosening often to make that electroconductive elastic sheet takes place, and this just makes and very easily come in contact bad phenomenon between wafer and the electroconductive elastic sheet, and then influences electroplating effect.

The utility model content

In view of this, the utility model provides a kind of wafer electroplating clamp, and this wafer electroplating clamp can make to have excellent contact between wafer and the electroconductive elastic sheet, and then guarantees normally carrying out of electroplating technology.

For achieving the above object, the utility model provides following technical scheme:

A kind of wafer electroplating clamp, this wafer electroplating clamp comprises: wafer electroplating clamp side plate and position electroconductive elastic sheet thereon; Wherein, described electroconductive elastic sheet comprises: the fixed face of Xiang Lianing, side, bottom surface, contact surface and extended surface successively; The junction of described contact surface and extended surface is the globoidal structure of evagination.

Preferably, in the above-mentioned wafer electroplating clamp, the radian of the globoidal structure of described evagination is 120 °.

Preferably, in the above-mentioned wafer electroplating clamp, the radius of the globoidal structure of described evagination is 0.3mm.

Preferably, in the above-mentioned wafer electroplating clamp, the angle between described contact surface and the extended surface is 120 °.

Preferably, in the above-mentioned wafer electroplating clamp, described electroconductive elastic sheet is the stainless steel electroconductive elastic sheet.

From technique scheme as can be seen, wafer electroplating clamp provided by the utility model, the electroconductive elastic sheet on it comprises: the fixed face of Xiang Lianing, side, bottom surface, contact surface and extended surface successively; Wherein, the junction of described contact surface and extended surface is the globoidal structure of evagination.After wafer being placed on the wafer electroplating clamp, the side of wafer contacts with the contact surface of electroconductive elastic sheet, the upper surface of wafer is pushed down by the globoidal structure of the formed evagination of contact surface on the electroconductive elastic sheet and extended surface junction, this just makes the upper surface of wafer contact with globoidal structure on the electroconductive elastic sheet, thereby has greatly increased the contact area of wafer and electroconductive elastic sheet.Therefore, wafer electroplating clamp provided by the utility model, shape by contact surface and extended surface junction on the change electroconductive elastic sheet, can greatly increase the contact area of electroconductive elastic sheet and wafer, thereby in electroplating process, guarantee to have excellent contact between electroconductive elastic sheet and the wafer, on wafer for the follow-up higher coating of quality that forms provides assurance.

Description of drawings

In order to be illustrated more clearly in the utility model embodiment or technical scheme of the prior art, to do to introduce simply to the accompanying drawing of required use in embodiment or the description of the Prior Art below, apparently, accompanying drawing in describing below only is embodiment more of the present utility model, for those of ordinary skills, under the prerequisite of not paying creative work, can also obtain other accompanying drawing according to these accompanying drawings.

Fig. 1 is the side structure synoptic diagram of electroconductive elastic sheet on the existing wafer electroplating clamp;

The side structure synoptic diagram of electroconductive elastic sheet on a kind of wafer electroplating clamp that Fig. 2 provides for the utility model embodiment;

The vertical view of electroconductive elastic sheet on a kind of wafer electroplating clamp that Fig. 3 provides for the utility model embodiment;

The front view of electroconductive elastic sheet on a kind of wafer electroplating clamp that Fig. 4 provides for the utility model embodiment.

Embodiment

Below in conjunction with the accompanying drawing among the utility model embodiment, the technical scheme among the utility model embodiment is clearly and completely described, obviously, described embodiment only is the utility model part embodiment, rather than whole embodiment.Based on the embodiment in the utility model, those of ordinary skills are not making the every other embodiment that is obtained under the creative work prerequisite, all belong to the scope of the utility model protection.

Wafer electroplating clamp used in the electroplating technology generally comprises: plate in the wafer electroplating clamp; Be arranged in the wafer electroplating clamp side plate on the wafer electroplating clamp plate; Be positioned at a plurality of (being generally 6) electroconductive elastic sheets and a plurality of (being generally 2) loam cake steady brace on the wafer electroplating clamp side plate.Connect lead on the described electroconductive elastic sheet, electroconductive elastic sheet can link to each other with external power source by described lead, in the time of on wafer being placed described wafer electroplating clamp side plate, the wafer side will contact with electroconductive elastic sheet, so described wafer can link to each other with external power source by electroconductive elastic sheet; After wafer being placed on the described wafer electroplating clamp side plate, described loam cake steady brace plays the effect of location electroplating clamp loam cake.Certainly, also be provided with notched wafer (Notch) steady brace on the described wafer electroplating clamp side plate.

With reference to figure 2, Fig. 3 and Fig. 4, the side structure synoptic diagram of electroconductive elastic sheet on a kind of wafer electroplating clamp that Fig. 2 is provided for the utility model embodiment, Fig. 3 and Fig. 4 are respectively the vertical view and the front view of electroconductive elastic sheet among Fig. 2.Wafer electroplating clamp provided by the utility model, the electroconductive elastic sheet on it comprises: the fixed face 11 of Xiang Lianing, side 12, bottom surface 13, contact surface 14 and extended surface 15 successively; Wherein, the junction 16 of described contact surface 14 and extended surface 15 is the globoidal structure 16 of evagination.

The fixed face 11 of electroconductive elastic sheet is provided with two pilot hole 11a, and steady brace is installed in described pilot hole 11a can be fixed on electroconductive elastic sheet on the wafer electroplating clamp side plate.Contact surface 14 on the electroconductive elastic sheet promptly is: after wafer being placed on the described wafer electroplating clamp side plate, the wafer side touches the face on the electroconductive elastic sheet, and the junction 16 of close contact surface 14 of wafer side and the contacted position of electroconductive elastic sheet and extended surface 15.

In the utility model owing to the contact surface on the electroconductive elastic sheet 14 and the junction 16 of extended surface 15 are arranged to have the globoidal structure 16 of the evagination of certain radian, therefore, after wafer being placed on the described wafer electroplating clamp side plate, described globoidal structure 16 with evagination of certain radian can be pushed down the wafer on the wafer electroplating clamp side plate, this can play the fixedly effect of wafer on the one hand, on the other hand, because the globoidal structure 16 and the wafer upper surface of described evagination contact, so described electroconductive elastic sheet is fully contacted with wafer, thereby increased the contact area of electroconductive elastic sheet and wafer, avoided occurring between the electroconductive elastic sheet and wafer in the electroplating technology process phenomenon of loose contact.

The radian that the globoidal structure 16 of evagination on the electroconductive elastic sheet is set among the utility model embodiment is that 120 °, radius are 0.3mm; Be provided with that the angle between the contact surface 14 and extended surface 15 is 120 ° on the electroconductive elastic sheet.

The wafer that the utility model embodiment is provided is electroplated angle, and the material of the electroconductive elastic sheet on it is a stainless material.Electroconductive elastic sheet of the prior art is generally copper product, because the antioxidant property of copper is relatively poor, and the electroconductibility variation of the copper after the oxidation, this will directly influence the quality of coating in the electroplating technology; In order to make the electroconductive elastic sheet works better, therefore, must in time change oxidized electroconductive elastic sheet, so the work-ing life of the electroconductive elastic sheet that the employing copper material is made is shorter.Adopted stainless steel to make electroconductive elastic sheet among the utility model embodiment, and the antioxidant property of stainless steel is stronger,, and then can prolongs duration of service of electroconductive elastic sheet so stainless electroconductive elastic sheet can prevent that the short period of time internal surface is oxidized.

As from the foregoing, the wafer electroplating clamp that the utility model embodiment is provided, by the globoidal structure that contact surface and extended surface junction on the electroconductive elastic sheet are evagination is set, this makes after wafer being placed on the described wafer electroplating clamp, contacting between wafer and the electroconductive elastic sheet not only comprises the contacting of contact surface of wafer side and electroconductive elastic sheet, but also comprise the contacting of globoidal structure of evagination on wafer upper surface and the electroconductive elastic sheet, therefore, relative to existing technologies, wafer electroplating clamp provided by the utility model, greatly increased the contact area of electroconductive elastic sheet and wafer, avoid occurring between electroconductive elastic sheet and the wafer phenomenon of loose contact, make wafer in the electroplating technology process, have good electrical conductivity, on wafer, form good coating and lay the foundation for follow-up, also provide strong guarantee for follow-up formation quality good metal projection.

In addition, the material that electroconductive elastic sheet on the wafer electroplating clamp is set among the utility model embodiment is a stainless steel, adopt the stronger stainless steel of antioxidant property to replace being easy to oxidized copper product in the traditional technology, can increase the work-ing life of described electroconductive elastic sheet like this, avoid frequent replacing electroconductive elastic sheet and cause the cost problem of higher.

To the above-mentioned explanation of the disclosed embodiments, make this area professional and technical personnel can realize or use the utility model.Multiple modification to these embodiment will be conspicuous concerning those skilled in the art, and defined herein General Principle can realize under the situation that does not break away from spirit or scope of the present utility model in other embodiments.Therefore, the utility model will can not be restricted to these embodiment shown in this article, but will meet and principle disclosed herein and features of novelty the wideest corresponding to scope.

Claims

1. wafer electroplating clamp comprises: wafer electroplating clamp side plate and position electroconductive elastic sheet thereon is characterized in that described electroconductive elastic sheet comprises: the fixed face of Xiang Lianing, side, bottom surface, contact surface and extended surface successively; Wherein, the junction of described contact surface and extended surface is the globoidal structure of evagination.

2. wafer electroplating clamp according to claim 1 is characterized in that, the radian of the globoidal structure of described evagination is 120 °.

3. wafer electroplating clamp according to claim 1 is characterized in that, the radius of the globoidal structure of described evagination is 0.3mm.

4. wafer electroplating clamp according to claim 1 is characterized in that, the angle between described contact surface and the extended surface is 120 °.

5. wafer electroplating clamp according to claim 1 is characterized in that, described electroconductive elastic sheet is the stainless steel electroconductive elastic sheet.