CN202064468U - Polyphenyl composite thermal insulation board - Google Patents
Polyphenyl composite thermal insulation board Download PDFInfo
- Publication number
- CN202064468U CN202064468U CN2011200886508U CN201120088650U CN202064468U CN 202064468 U CN202064468 U CN 202064468U CN 2011200886508 U CN2011200886508 U CN 2011200886508U CN 201120088650 U CN201120088650 U CN 201120088650U CN 202064468 U CN202064468 U CN 202064468U
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- CN
- China
- Prior art keywords
- thermal insulation
- polyphenyl
- insulation board
- layer
- polyphenyl composite
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Abstract
The utility model relates to a wall body thermal insulation material which can be applied to civil buildings, in particular to a polyphenyl composite thermal insulation board. The polyphenyl composite thermal insulation board has a double-side enhanced structure and consists of a polyphenyl board thermal insulation layer, adhesive cement layers, alkali-resisting mesh cloth layers and a decorative surface coating, wherein three adhesive cement layers are arranged on the two sides of the intermediate polyphenyl board thermal insulation layer respectively; the alkali-resisting mesh cloth layers are arranged between every two adhesive cement layers; and the decorative surface coating is arranged on the outer side. The polyphenyl composite thermal insulation board has the characteristics of high thermal insulation performance, light buildings, high strength, corrosion resistance, high construction speed and the like and is integrally and firmly adhered to concrete. As a novel building material, the polyphenyl composite thermal insulation board can be used for building public toilets, warehouses, movable houses or light buildings.
Description
Technical field
The utility model relates to a kind of wall heat insulation material that can be applicable to civilian construction, particularly a kind of polyphenyl composite insulation board of building public lavatory, warehouse, prefabricated house or light body building that is applicable to.
Background technology
At present, domestic in building field External Walls Heating Insulation also not really perfect, traditional building adopts brick body of wall and outer decorative layer, this body of wall is not incubated, and has problems such as weak point in application life, poor corrosion resistance.
Summary of the invention
The utility model has overcome the defective of above-mentioned existence, and purpose provides a kind of polyphenyl composite insulation board.
The utility model polyphenyl composite insulation board content Description:
The utility model polyphenyl composite insulation board, it is characterized in that: polyphenyl composite insulation board is two-sided Enhanced Configuration, form by polyphenyl plate heat preserving layer, mucilage layer, alkaline-resisting scrim layer and decorative cover coating, both sides at the polyphenyl plate heat preserving layer of centre respectively are provided with 3 layers of mucilage layer, be provided with alkaline-resisting scrim layer between two-layer mucilage layer, the outside is one deck decorative cover coating.
The utility model polyphenyl composite insulation board has good heat insulating, buildings is light, intensity is high, corrosion-resistant, characteristics such as speed of application is fast, and to combine integral body firm with concrete binding.As a kind of New Building Materials, can be used for building public lavatory, warehouse, prefabricated house or light body building.
Description of drawings
Fig. 1 is the polyphenyl composite insulation board structural representation
Among the figure: the 1st, polyphenyl plate heat preserving layer, the 2nd, mucilage layer, the 3rd, alkaline-resisting scrim layer, the 4th, decorative cover coating.
The specific embodiment
The utility model polyphenyl composite insulation board is achieved in that below in conjunction with accompanying drawing and specifies.See Fig. 1, the utility model polyphenyl composite insulation board is two-sided Enhanced Configuration, form by polyphenyl plate heat preserving layer 1, mucilage layer 2, alkaline-resisting scrim layer 3 and decorative cover coating 4, both sides at the polyphenyl plate heat preserving layer 1 of centre respectively are provided with 3 layers of mucilage layer 2, be provided with alkaline-resisting scrim layer 3 between two-layer mucilage layer 2, the outside is one deck decorative cover coating 4.
The utility model polyphenyl composite insulation board can reach through Performance Detection: Xi Shui Liang ∕ (g ∕ m
2) immersion 24 h≤500; Kang Chong Ji Qiang Du ∕ J 28; Freeze-thaw resistance: surperficial flawless, hollowing, bubble, peel off phenomenon; Weatherability: surperficial flawless, efflorescence, peeling phenomenon.Have good heat insulating, buildings is light, intensity is high, corrosion-resistant, characteristics such as speed of application is fast, to combine integral body firm with concrete binding.
Claims (1)
1. polyphenyl composite insulation board, it is characterized in that: polyphenyl composite insulation board is two-sided Enhanced Configuration, form by polyphenyl plate heat preserving layer (1), mucilage layer (2), alkaline-resisting scrim layer (3) and decorative cover coating (4), both sides at the polyphenyl plate heat preserving layer (1) of centre respectively are provided with 3 layers of mucilage layer (2), be provided with alkaline-resisting scrim layer (3) between two-layer mucilage layer (2), the outside is one deck decorative cover coating (4).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011200886508U CN202064468U (en) | 2011-03-30 | 2011-03-30 | Polyphenyl composite thermal insulation board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011200886508U CN202064468U (en) | 2011-03-30 | 2011-03-30 | Polyphenyl composite thermal insulation board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202064468U true CN202064468U (en) | 2011-12-07 |
Family
ID=45058334
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011200886508U Expired - Fee Related CN202064468U (en) | 2011-03-30 | 2011-03-30 | Polyphenyl composite thermal insulation board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202064468U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102747807A (en) * | 2012-07-17 | 2012-10-24 | 苏州千瑞机电科技有限公司 | Novel building wallboard, building wall body structure and manufacturing method thereof |
-
2011
- 2011-03-30 CN CN2011200886508U patent/CN202064468U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102747807A (en) * | 2012-07-17 | 2012-10-24 | 苏州千瑞机电科技有限公司 | Novel building wallboard, building wall body structure and manufacturing method thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20111207 Termination date: 20120330 |