CN202061977U - Stamping die pace regulating structure of semiconductor hard alloy lead frame - Google Patents
Stamping die pace regulating structure of semiconductor hard alloy lead frame Download PDFInfo
- Publication number
- CN202061977U CN202061977U CN2011201072969U CN201120107296U CN202061977U CN 202061977 U CN202061977 U CN 202061977U CN 2011201072969 U CN2011201072969 U CN 2011201072969U CN 201120107296 U CN201120107296 U CN 201120107296U CN 202061977 U CN202061977 U CN 202061977U
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- step pitch
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- screw
- pace
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Abstract
The utility model discloses a stamping die pace regulating structure of a semiconductor hard alloy lead frame, which comprises a lower die seat, a concave template seat and a concave template. The stamping die pace regulating structure of the semiconductor hard alloy lead frame is characterized by further comprising a pace regulating mechanism consisting of a pace correcting regulating block cushion block, a pace correcting regulating block, a pace correcting screw, a pace correcting screw chock block and a pace correcting screw fixing block, a correcting mechanism consisting of a pace regulating block, the pace correcting regulating block and a regulating screw, and a pace regulating block returning mechanism consisting of the pace regulating block, the pace correcting regulating block, the pace correcting regulating block cushion block and a returning screw. By using the stamping die pace regulating structure, the length of the lead frame can be adjusted automatically according to a pace length needed by the lead frame; the stamping die pace regulating structure is used for treating the requirements on different lengths existing in actual use; and different use requirements of a user on the lead frame are met. Simultaneously, the adjustment of various factors of a strip of the lead frame which influence the pace of the lead frame due to materials, the die performance and the like in actual production can be carried out, and the quality of the lead frame is ensured.
Description
Technical field
The utility model relates to semiconductor carbide alloy lead frame processing technique field, is specifically related to a kind of step pitch adjustment structure of proofreading and correct the leadframe strip strip length in the stamping-out process.
Background technology
The lead frame punch die belongs to high-accuracy progressive die, in progressive die, because the factor of length variations in the restriction lead frame band actual production process such as material, Mould Machining, and different client is to the demand of lead frame band different length.Existing lead frame punch die has been difficult to meet the demands.
For solving existing the problems referred to above in the prior art, this patent provides a kind of new solution.
Summary of the invention
Problem to be solved in the utility model is how a kind of semiconductor carbide alloy lead frame punch die step pitch adjustment structure is provided, this semiconductor carbide alloy lead frame punch die step pitch adjustment structure can be adjusted the length of lead frame according to the change of stride that produces in the lead frame band actual production process, and this kind structure that is provided with for the band that reaches different length.
To achieve the above object of the invention, the technical scheme that the utility model adopted is: a kind of semiconductor carbide alloy lead frame punch die step pitch adjustment structure is provided, comprises die shoe, die panel seat and concave template; It is characterized in that: also comprise school step pitch adjusting cushion block, school step pitch regulating block, step pitch regulating block, concave template, school step pitch screw fixed block, school step pitch screw block, screw, school step pitch screw, return spring, packing ring and return screw; Wherein
Described school step pitch is regulated cushion block, school step pitch regulating block, school step pitch screw, school step pitch screw block and school step pitch screw fixed block and is formed the step pitch governor motion; Described step pitch regulating block, school step pitch regulating block and school step pitch screw constitute aligning gear; Described step pitch regulating block, school step pitch regulating block, school step pitch are regulated cushion block, return screw, packing ring and return spring and are constituted step pitch adjusting return mechanism;
Described school step pitch regulating block and school step pitch are regulated between the cushion block and are provided with the inclined-plane that is used to regulate the position of step pitch regulating block in concave template; Described screw passes school step pitch screw block and school step pitch screw fixed block is fixed on the die panel seat; Described return screw passes successively that packing ring, return spring, die shoe, school step pitch are regulated cushion block, school step pitch regulating block links to each other with the step pitch regulating block; Described school step pitch screw passes school step pitch screw fixed block successively, the die panel seat links to each other with the step pitch regulating block; Described school step pitch screw block is pressed the head of school step pitch screw by the groove of centre and is clipped between school step pitch screw block and the school step pitch screw fixed block; Described step pitch regulating block is provided with the projection that is used to regulate lead frame band step pitch.
In sum, semiconductor carbide alloy lead frame punch die step pitch adjustment structure provided by the utility model has following advantage: 1, simple in structure, compact, reasonable; 2, owing to adopted micro-governor motion, can adjust the step pitch adjustment screw so that the length that the variation of the degree of depth of lead frame band changes lead frame is gone in step pitch regulating block school according to the variation of lead frame punch die step pitch length in the stamping-out process of reality; 3, at punch die band is carried out step pitch and proofread and correct, reached and revised the defective that the lead frame band length changes, can produce the lead frame of different length step pitch simultaneously according to different demands.
Description of drawings
Fig. 1 is the structural representation of semiconductor carbide alloy lead frame punch die step pitch adjustment structure.
Wherein, 1, die shoe; 2, die panel seat; 3, the school step pitch is regulated cushion block; 4, school step pitch regulating block; 5, step pitch regulating block; 6, concave template; 7, school step pitch screw fixed block; 8, school step pitch screw block; 9, screw; 10, school step pitch screw; 11, return spring; 12, packing ring; 13, return screw; 14, lead frame band.
The specific embodiment
Below in conjunction with accompanying drawing the specific embodiment of the present utility model is described in further detail.
As shown in Figure 1, this semiconductor carbide alloy lead frame punch die step pitch adjustment structure comprises die shoe 1, die panel seat 2 and concave template 6; It is characterized in that: also comprise school step pitch adjusting cushion block 3, school step pitch regulating block 4, step pitch regulating block 5, concave template 6, school step pitch screw fixed block 7, school step pitch screw block 8, screw 9, school step pitch screw 10, return spring 11, packing ring 12 and return screw 13; Wherein
Described school step pitch is regulated cushion block 3, school step pitch regulating block 4, school step pitch screw 10, school step pitch screw block 8 and school step pitch screw fixed block 7 and is formed the step pitch governor motion; Described step pitch regulating block 5, school step pitch regulating block 4 and school step pitch screw 10 constitute aligning gear; Described step pitch regulating block 5, school step pitch regulating block 4, school step pitch are regulated cushion block 3, return screw 13, packing ring 12 and return spring 11 and are constituted step pitch adjusting return mechanism;
Described school step pitch regulating block 4 and school step pitch are regulated to be provided with between the cushion block 3 and are used to regulate the inclined-plane of step pitch regulating block 5 in the position of 6 li of concave templates; Described screw 9 passes school step pitch screw block 8 and school step pitch screw fixed block 7 is fixed on the die panel seat 2; Described return screw 13 passes successively that packing ring 12, return spring 11, die shoe 1, school step pitch are regulated cushion block 3, school step pitch regulating block 4 links to each other with step pitch regulating block 5; Described school step pitch screw 10 passes school step pitch screw fixed block 7 successively, die panel seat 2 links to each other with step pitch regulating block 5; Described school step pitch screw block 8 is pressed the head of school step pitch screw 10 by the groove of centre and is clipped between school step pitch screw block 8 and the school step pitch screw fixed block 7; Described step pitch regulating block 5 is provided with the projection that is used to regulate lead frame band 14 step pitches.
During use, can make 4 horizontal movements in die panel seat 2 of school step pitch regulating block by regulating school step pitch screw 10; Return function by school step pitch screw 10 and return spring 11 can make school step pitch regulating block 4 and the school step pitch regulate on the inclined-plane between the cushion block 3 and move, driving step pitch regulating block 5 moves up and down for 6 li at concave template, and by the projection on the step pitch regulating block 5 lead frame band 14 is proofreaied and correct, to reach the purpose of regulating lead frame band 14 length step pitches.
Though in conjunction with the accompanying drawings the specific embodiment of the present utility model is described, in the claim institute restricted portion of this patent, the protection that those skilled in the art do not need various modifications that creative work can make or distortion still to be subjected to this patent.
Claims (1)
1. a semiconductor carbide alloy lead frame punch die step pitch adjustment structure comprises die shoe (1), die panel seat (2) and concave template (6); It is characterized in that: also comprise school step pitch adjusting cushion block (3), school step pitch regulating block (4), step pitch regulating block (5), concave template (6), school step pitch screw fixed block (7), school step pitch screw block (8), screw (9), school step pitch screw (10), return spring (11), packing ring (12) and return screw (13); Wherein
Described school step pitch is regulated cushion block (3), school step pitch regulating block (4), school step pitch screw (10), school step pitch screw block (8) and school step pitch screw fixed block (7) and is formed the step pitch governor motion; Described step pitch regulating block (5), school step pitch regulating block (4) and school step pitch screw (10) constitute aligning gear; Described step pitch regulating block (5), school step pitch regulating block (4), school step pitch are regulated cushion block (3), return screw (13), packing ring (12) and return spring (11) and are constituted step pitch adjusting return mechanism;
Described school step pitch regulating block (4) and school step pitch are regulated to be provided with between the cushion block (3) and are used to regulate the inclined-plane of step pitch regulating block (5) in the position of concave template (6) lining; Described screw (9) passes school step pitch screw block (8) and school step pitch screw fixed block (7) is fixed on the die panel seat (2); Described return screw (13) passes successively that packing ring (12), return spring (11), die shoe (1), school step pitch are regulated cushion block (3), school step pitch regulating block (4) links to each other with step pitch regulating block (5); Described school step pitch screw (10) passes school step pitch screw fixed block (7) successively, die panel seat (2) links to each other with step pitch regulating block (5); Described school step pitch screw block (8) is pressed the head of school step pitch screw (10) by middle groove and is clipped between school step pitch screw block (8) and the school step pitch screw fixed block (7); Described step pitch regulating block (5) is provided with the projection that is used to regulate lead frame band (14) step pitch.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011201072969U CN202061977U (en) | 2011-04-13 | 2011-04-13 | Stamping die pace regulating structure of semiconductor hard alloy lead frame |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011201072969U CN202061977U (en) | 2011-04-13 | 2011-04-13 | Stamping die pace regulating structure of semiconductor hard alloy lead frame |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202061977U true CN202061977U (en) | 2011-12-07 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011201072969U Expired - Fee Related CN202061977U (en) | 2011-04-13 | 2011-04-13 | Stamping die pace regulating structure of semiconductor hard alloy lead frame |
Country Status (1)
| Country | Link |
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| CN (1) | CN202061977U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104942128A (en) * | 2015-06-30 | 2015-09-30 | 歌尔声学股份有限公司 | Blanking die and reel insert blanking device |
| CN107983834A (en) * | 2017-11-24 | 2018-05-04 | 中山复盛机电有限公司 | The overall length modification method of stamping products |
| CN109500241A (en) * | 2018-11-20 | 2019-03-22 | 江阴康强电子有限公司 | A kind of lead frame production adjustable aligning gear of lower die |
-
2011
- 2011-04-13 CN CN2011201072969U patent/CN202061977U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104942128A (en) * | 2015-06-30 | 2015-09-30 | 歌尔声学股份有限公司 | Blanking die and reel insert blanking device |
| CN107983834A (en) * | 2017-11-24 | 2018-05-04 | 中山复盛机电有限公司 | The overall length modification method of stamping products |
| CN109500241A (en) * | 2018-11-20 | 2019-03-22 | 江阴康强电子有限公司 | A kind of lead frame production adjustable aligning gear of lower die |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20111207 Termination date: 20150413 |
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| EXPY | Termination of patent right or utility model |