CN202055757U - Polycrystalline diamond compact with arc-shaped layer interface - Google Patents
Polycrystalline diamond compact with arc-shaped layer interface Download PDFInfo
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- CN202055757U CN202055757U CN2011201255071U CN201120125507U CN202055757U CN 202055757 U CN202055757 U CN 202055757U CN 2011201255071 U CN2011201255071 U CN 2011201255071U CN 201120125507 U CN201120125507 U CN 201120125507U CN 202055757 U CN202055757 U CN 202055757U
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- circumferential recess
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Abstract
The utility model discloses a polycrystalline diamond compact with an arc-shaped layer interface, which comprises a polycrystalline diamond layer and a hard alloy matrix, wherein the joint surface of the hard alloy matrix and the polycrystalline diamond layer is a non-planar surface. The polycrystalline diamond compact is characterized in that the joint surface is an upwardly convex arc-shaped joint surface, and at least one radial groove or one peripheral groove is formed on the arc-shaped joint surface. Since the polycrystalline diamond compact adopts a more reasonable layer interface structure, the firmness between the polycrystalline diamond and the hard alloy matrix is further enhanced, the normal shrinkage of diamond powder during ultra-high pressure sintering is ensured, meanwhile, the shock resistance is improved, and the axial tension stress and shearing stress of the interface are reduced.
Description
Technical field
The utility model relates to a kind of super-hard compound material, and particularly a kind of bed boundary is the composite polycrystal-diamond of arc.
Background technology
Composite polycrystal-diamond is by polycrystalline diamond layer and the hard alloy substrate super-hard compound material that sintering forms under high-temperature and high-pressure conditions.Because it possesses the toughness of high abrasion resistance of polycrystalline diamond layer and hard alloy substrate, it in using, oil drilling, geological drilling and coal mining is used widely.
The diamond compact polycrystalline diamond layer that bores tooth has all adopted nonplanar structure with the bonding surface of hard alloy substrate in the market, replaced fully pass by two-layer between with the structure of plane combination.Adopt on-plane surface in conjunction with the contact area that has increased between two-layer, improved the adhesion between the layer.Interlaced between simultaneously two-layer also played the mechanical engagement effect, improved the anti-shearing force of bonding surface greatly.
But in making nonplanar structure diamond compact brill tooth process, the stepped ramp type nonplanar structure exists weak point.At first, the flowability of diamond dust when the existence of step has influenced ultra-high pressure sintering, the polycrystalline diamond layer that sintering goes out is difficult to guarantee the material uniformity at each position.Annulus polycrystalline diamond part under the polycrystalline diamond on step part and the step particularly, both are in that there is some difference qualitatively.Secondly, though ledge structure has produced favourable tightening force, also stoped the normal contraction of outer ring bortz powder when ultra-high pressure sintering, can produce tangential residual tension behind the sintering, this performance to polycrystalline diamond is disadvantageous.Also have, the varied in thickness of the composite polycrystal-diamond of stepped ramp type interfacial structure is very discontinuous, the stress that produces during work disperses obstructed in the conduction of whole interface, stress converges in the part easily, the stress that causes occurring localization is highly at the interface concentrated, this will make the generation of breaking with catastrophic failure, influence the application life of composite polycrystal-diamond.
Therefore, existing composite polycrystal-diamond is still waiting to improve and improve.
Summary of the invention
In view of above-mentioned the deficiencies in the prior art part, it is the composite polycrystal-diamond of arc that the purpose of this utility model is to provide the bed boundary, and in order to achieve the above object, the utility model has been taked following technical scheme:
A kind of composite polycrystal-diamond, comprise polycrystalline diamond layer and hard alloy substrate, wherein: the bonding surface of described hard alloy substrate and polycrystalline diamond layer is the arc bonding surface of epirelief, offers one radial groove or one circumferential recess on the arc bonding surface at least.
Described composite polycrystal-diamond, wherein: offer radial groove and circumferential recess on the described arc bonding surface, radial groove and circumferential recess run through mutually.
Described composite polycrystal-diamond, wherein: the peak of described bonding surface and the difference in height of minimum point are between 0.1～5mm.
Described composite polycrystal-diamond, wherein: described radial groove has 3～50 roads, and circumferential recess has 1～6 road.
Described composite polycrystal-diamond, wherein: described radial groove is that the summit with the arc bonding surface is the center, along the arc bonding surface to around radially distribute.
Described composite polycrystal-diamond, wherein: the concavo-convex variation of described radial grooves distributed is to adopt the sine curve transition.
Described composite polycrystal-diamond, wherein: described circumferential recess is to be the donut in the center of circle with the bonding surface summit.
Described composite polycrystal-diamond, wherein: the cross section of described circumferential recess is a circular arc.
Described composite polycrystal-diamond, wherein: the degree of depth of described radial groove and circumferential recess is 0.1～2mm, width is 0.1～5mm.
Described composite polycrystal-diamond, wherein: described radial groove and circumferential recess are the groove of continous way or the groove of discontinuous.
The composite polycrystal-diamond that the utility model provides is owing to adopted more rational bed boundary structure, the firmness of polycrystalline diamond layer and hard alloy substrate is further strengthened, the normal contraction of diamond dust when guaranteeing ultra-high pressure sintering, improve shock resistance simultaneously, reduce interface axis to tensile stress and shear stress.
Description of drawings
Fig. 1 is the plan view of the utility model composite polycrystal-diamond bonding surface.
Fig. 2 is the utility model composite polycrystal-diamond bonding surface radial groove stereogram.
Fig. 3 is the utility model composite polycrystal-diamond bonding surface circumferential recess stereogram.
Fig. 4 is the stereogram that the utility model composite polycrystal-diamond bonding surface radial groove and circumferential recess run through mutually.
The specific embodiment
It is the composite polycrystal-diamond of arc that the utility model provides a kind of bed boundary, clearer, clear and definite for making the purpose of this utility model, technical scheme and effect, below with reference to accompanying drawing and give an actual example the utility model is further described.Should be appreciated that specific embodiment described herein only in order to explanation the utility model, and be not used in qualification the utility model.
As shown in Figure 1, a kind of composite polycrystal-diamond comprises polycrystalline diamond layer and hard alloy substrate, and composite polycrystal-diamond is to be composited by the two, and the diameter of composite polycrystal-diamond is 19.05 millimeters, and thickness is 13.20 millimeters.Hard alloy substrate 1 be a nonplanar structure with the bonding surface 2 of polycrystalline diamond layer, and wherein, bonding surface 2 is the arc bonding surface of epirelief, the peak of bonding surface be the difference in height of summit 21 and minimum point 20 between 0.1～5mm, the preferred heights difference is 1mm.
Embodiment one
As shown in Figure 2, footpath at the circular arc bonding surface makes progress, with summit 21 is the center, along the arc bonding surface to around be distributed with radial waveform groove, be called radial groove 3, camber line transition, for example sine curve are adopted in the concavo-convex variation between the radial groove 3, the quantity of radial groove 3 is 3～50 roads, and depth of groove is 0.1～2mm.
Preferred version, the length of radial groove 3 is started at from the edge and to be had only the radius of 3/4ths bonding surfaces long, and 24 radial grooves 3 have altogether evenly distributed on the entire joint face, the sine curve transition is adopted in the concavo-convex variation of radial groove 3, and each groove 21 degree of depth all is 0.3mm.
Embodiment two
As shown in Figure 3, make progress in the week of circular arc bonding surface, be provided with the groove that 1～10 donut is formed, be called circumferential recess 4, the cross section of circumferential recess 4 is a circular arc, circumferential recess 4 dark 0.1～2mm, wide 0.1～5mm.
Preferred version is provided with 3 radially equidistant equally distributed circumferential recess 4 along bonding surface, and the degree of depth is 0.3mm, and width is 1mm, adopts the camber line transition between the circumferential recess 4.
Embodiment three
As shown in Figure 4, in conjunction with the embodiments one and the feature of embodiment two.Radial groove and circumferential recess are intersected mutually to connect and are distributed on the bonding surface, form the nonplanar structure that is similar to earth longitude and latitude line style.All adopt the camber line transition between the circumferential recess and between the radial groove.
Described bonding surface can be selected all or part of of convex bonding surface.The cross section of radial groove and circumferential recess can be that circular arc also can be the polygon groove of trapezoidal or other shapes.
Described radial groove and circumferential recess can be continous ways, also can be discontinuous.
In the utility model,, these two power all can be decomposed into two component at and sensing arc surface center tangential at the bonding surface place along arc surface owing to be circular arc bonding surface structure.Impact force head-on and be opposite at the tangential branch force direction of arc surface to the normal pressure that presses down, the part of can cancelling out each other, thus improve the shock resistance of polycrystalline diamond layer.
Its two because bonding surface is the circular arc bonding surface, more help the sintering of polycrystalline diamond layer.Because in the high pressure-temperature sintering process, the thermal field of sintering zone and pressure field are uneven: diametrically, temperature is that middle high rim is low, and pressure field is then just opposite.So in sintering process, the thermodynamic driving force of the diadust sintering at edge is greater than the thermodynamic driving force of center diadust sintering, the edge sintering is easier to carry out; Simultaneously, relative center, lip temperature reaches the infiltration temperature of cobalt in advance, and the time of cobalt diffusion is more abundant, so the edge sinters than the center is easier.At thermal field in the sintering cavity and uneven this inherent characteristics of pressure field, bonding surface is designed to circular arc bonding surface structure after, the thickness of polycrystalline diamond layer attenuate gradually from the edge to the center, the sintering difficulty in the middle of having reduced; Circular arc bonding surface projection is deep into the glomerocryst layer, and the effect of supercharging has also been played at the center, has remedied the insufficient pressure at center.So the easier realization homogeneous of this circular arc bonding surface structure sintering.
Detect demonstration by finite element analysis computation and laboratory test: this edge is thick, the polycrystalline diamond layer structure of intermediate thin, under the condition that guarantees polycrystalline diamond layer work plane thickness, reduce greatly interface axis to tensile stress and shear stress, improve the stress distribution of composite polycrystal-diamond, improved the application life of polycrystalline diamond layer.
Owing to be that bonding surface is the design of circular arc bonding surface, adopt radial groove and circumferential recess to mutually combine.Radial groove, the normal contraction of diamond dust in the time of can guaranteeing ultra-high pressure sintering can minimize the residual stress that causes because of interfacial structure.Circumferential recess can be got up groove UNICOM radially, forms net structure, increases the bond strength at interface.Setting up of circumferential recess also increases the circumferential flowability of diadust on the other hand.
Be understandable that; for those of ordinary skills; can be equal to replacement or change according to the technical solution of the utility model and utility model design thereof, and all these changes or replacement all should belong to the protection domain of the appended claim of the utility model.
Claims (10)
1. composite polycrystal-diamond, comprise polycrystalline diamond layer and hard alloy substrate, it is characterized in that: the bonding surface of described hard alloy substrate and polycrystalline diamond layer is the arc bonding surface of epirelief, offers one radial groove or one circumferential recess on the arc bonding surface at least.
2. composite polycrystal-diamond according to claim 1 is characterized in that: offer radial groove and circumferential recess on the described arc bonding surface, radial groove and circumferential recess run through mutually.
3. composite polycrystal-diamond according to claim 1 is characterized in that: the peak of described bonding surface and the difference in height of minimum point are between 0.1～5mm.
4. composite polycrystal-diamond according to claim 2 is characterized in that: described radial groove has 3～50 roads, and circumferential recess has 1～6 road.
5. according to each described composite polycrystal-diamond of claim 1～4, it is characterized in that: described radial groove is that the summit with the arc bonding surface is the center, along the arc bonding surface to around radially distribute.
6. composite polycrystal-diamond according to claim 5 is characterized in that: the concavo-convex variation of described radial grooves distributed is to adopt the sine curve transition.
7. according to each described composite polycrystal-diamond of claim 1～4, it is characterized in that: described circumferential recess is to be the donut in the center of circle with arc bonding surface summit.
8. according to each described composite polycrystal-diamond of claim 1～4, it is characterized in that: the cross section of described circumferential recess is a circular arc.
9. according to each described composite polycrystal-diamond of claim 1～4, it is characterized in that: the degree of depth of described radial groove and circumferential recess is 0.1～2mm, and width is 0.1～5mm.
10. according to each described composite polycrystal-diamond of claim 1～4, it is characterized in that: described radial groove and circumferential recess are the groove of continous way or the groove of discontinuous.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011201255071U CN202055757U (en) | 2011-04-26 | 2011-04-26 | Polycrystalline diamond compact with arc-shaped layer interface |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011201255071U CN202055757U (en) | 2011-04-26 | 2011-04-26 | Polycrystalline diamond compact with arc-shaped layer interface |
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| CN202055757U true CN202055757U (en) | 2011-11-30 |
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| CN2011201255071U Expired - Fee Related CN202055757U (en) | 2011-04-26 | 2011-04-26 | Polycrystalline diamond compact with arc-shaped layer interface |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102913135A (en) * | 2012-11-16 | 2013-02-06 | 福建万龙金刚石工具有限公司 | Polycrystalline diamond compound sheet and manufacturing process thereof |
| CN103470190A (en) * | 2013-09-22 | 2013-12-25 | 株洲硬质合金集团有限公司 | Diamond compact substrate |
| CN103726792A (en) * | 2013-12-03 | 2014-04-16 | 常州深倍超硬材料有限公司 | Abrasion-resistant tool |
| CN104343391A (en) * | 2013-08-05 | 2015-02-11 | 常州深倍超硬材料有限公司 | Abrasion-resistant tool |
| CN112437827A (en) * | 2018-07-27 | 2021-03-02 | 贝克休斯控股有限责任公司 | Cutting elements configured to reduce impact damage and related tools and methods-alternative configurations |
-
2011
- 2011-04-26 CN CN2011201255071U patent/CN202055757U/en not_active Expired - Fee Related
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102913135A (en) * | 2012-11-16 | 2013-02-06 | 福建万龙金刚石工具有限公司 | Polycrystalline diamond compound sheet and manufacturing process thereof |
| CN104343391A (en) * | 2013-08-05 | 2015-02-11 | 常州深倍超硬材料有限公司 | Abrasion-resistant tool |
| CN103470190A (en) * | 2013-09-22 | 2013-12-25 | 株洲硬质合金集团有限公司 | Diamond compact substrate |
| CN103726792A (en) * | 2013-12-03 | 2014-04-16 | 常州深倍超硬材料有限公司 | Abrasion-resistant tool |
| CN112437827A (en) * | 2018-07-27 | 2021-03-02 | 贝克休斯控股有限责任公司 | Cutting elements configured to reduce impact damage and related tools and methods-alternative configurations |
| CN112437827B (en) * | 2018-07-27 | 2023-10-17 | 贝克休斯控股有限责任公司 | Cutting elements configured to reduce impact damage and related tools and methods-alternative configurations |
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Legal Events
| Date | Code | Title | Description |
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C56 | Change in the name or address of the patentee |
Owner name: SHENZHEN HAIMINGRUN SUPERHARD MATERIALS CO., LTD. Free format text: FORMER NAME: SHENZHEN HAIMINGRUN CO., LTD. |
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| CP03 | Change of name, title or address |
Address after: 518000, No. 7, Section 1, Huang Tian Yang Industrial Zone, Xixiang street, Shenzhen, Guangdong, Baoan District Patentee after: SHENZHEN HAIMINGRUN SUPERHARD MATERIALS CO., LTD. Address before: 518128, No. 7, Section 1, Huang Tian Yang Industrial Zone, Xixiang street, Shenzhen, Guangdong, Baoan District Patentee before: Shenzhen Haimingrun Industrial Co., Ltd. |
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| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20111130 Termination date: 20200426 |