CN202045432U - Device for controlling height of pin of wave-welding spot - Google Patents
Device for controlling height of pin of wave-welding spot Download PDFInfo
- Publication number
- CN202045432U CN202045432U CN2010205952041U CN201020595204U CN202045432U CN 202045432 U CN202045432 U CN 202045432U CN 2010205952041 U CN2010205952041 U CN 2010205952041U CN 201020595204 U CN201020595204 U CN 201020595204U CN 202045432 U CN202045432 U CN 202045432U
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- China
- Prior art keywords
- board
- pin
- plate
- hinge chain
- base plate
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- Expired - Lifetime
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- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The utility model discloses a device for controlling the height of a pin of a wave-welding spot; the device consists of a hinge chain, a side board, a printed template, a printed board, an anti-static foam, a pressing board, a bottom board, a locating board and a locating pin, wherein the bottom board and the side board are connected by the hinge chain; and when in use, the bottom board and the side board are opened firstly, then the printed board to be welded and the printed template are combined by the anti-static foam and are placed on the bottom board to close the side board, and the whole device is fixed by the locating board. The device effectively solves the demand problem that the height of the welding spot of a product is less than or equal to 0.8mm and has the beneficial effects of low manufacture cost, flexibility, variability, simplicity, easiness and strong practical applicability.
Description
Technical field
The utility model relates to welding technology field, is specifically related to a kind of device of controlling wave-soldering printed board and plug-in unit welding back solder joint pin height.
Background technology
The plug-in unit of printed circuit board is fixedly connected after by soldering, must shear pin by the wave-soldering cutter after its solder joint forms, and the pin height is controlled at≤0.8mm usually.But the printed circuit board for small lot adopts wave-soldering to shear pin, it is with high costs, and with regard to wave-soldering cutter commodity price, the wave-soldering cutter costs an arm and a leg, cut the control range of pin extension elongation behind the pin: only reach 1mm～3mm, far can not satisfy the instructions for use of specialities.
The utility model content
Problem to be solved in the utility model is, how to control the length of the edge receptacle pin shearing of wave-soldering, the utility model provides a kind of device of controlling wave-soldering solder joint pin height, this device is by the hinge chain, side plate, print template, printed board, the antistatic foam, pressing plate, base plate, location-plate, alignment pin is formed, the first hinge chain is connected base plate with pressing plate, the second hinge chain is connected base plate with side plate, base plate is positive to fit tightly with the antistatic foam, the length of antistatic foam is identical with base plate, thickness is consistent with the width of side plate, is convenient to the antistatic foam, printed board and printing template are fastened on the device together.Described side plate upper end has 3 chutes altogether, and an alignment pin is installed in each chute, described location-plate be a pair of clamping upper and lower at matrix, be used for fastening whole device matrix, prevent antistatic foam and printed board slippage.
Utilize this device because low cost of manufacture, can be flexible and changeable, being particularly suitable for the butt welding point height has the printed board pin length of the small lot of strict demand to control, effectively solve the length issue of the edge receptacle control pin shearing of wave-soldering, obtained simple, convenient, practical beneficial effect.
Description of drawings
Fig. 1 is the side view schematic diagram of the utility model apparatus structure
Fig. 2 is the vertical view schematic diagram of the utility model apparatus structure
Fig. 3 is the product structure schematic diagram that enforcement of the present utility model obtains
The accompanying drawing sign
1-alignment pin 2-side plate 3-prints the template 4-printed board 5-antistatic foam 6-pressing plate 7-location-plate 8-first hinge chain 9-base plate 10-second hinge chain
The specific embodiment
Below in conjunction with accompanying drawing embodiment of the present utility model is elaborated, this device comprises alignment pin 1, side plate 2, print template 3, printed board 4, antistatic foam 5, pressing plate 6, location-plate 7, the first hinge chain 8, base plate 9, the second hinge chain 10 is formed, the first hinge chain 8 is connected base plate 9 with pressing plate 6, the second hinge chain 10 is connected base plate 9 with side plate 2, base plate 9 fronts fit tightly with antistatic foam 5, the length and width of antistatic foam are identical with base plate, thickness is consistent with the width of side plate, is convenient to the antistatic foam, printed board and printing template are fastened on the device together.
Printed board to be welded is installed on the antistatic foam, prints template 3 and place in the printed board to be welded, print template 3 solder joint heights and carry out making according to instructions for use, when requiring to 0.8mm such as solder joint height, the thickness of printing template is 0.4mm.
Owing to adopt the first hinge chain, 8 connected modes, earlier base plate 9 and side plate 2 are in open mode during use, then 5 printed boards to be welded of antistatic foam are placed on the base plates 9 with printing template 3 combination backs and mate side plate, have 3 chutes on the side plate, an alignment pin 1 is housed in each groove, can be for the slip of alignment pin 1, alignment pin 1 is adjusted the position of alignment pin 1 according to the plug-in unit situation of different printed boards.Be used for the side of printed board to be welded is positioned, play the effect of fastening printed board side.
Embodiment is as shown in Figure 3: will print template 3 and place the printed board reverse side, finish components and parts and look into dress, be adjacent to printed board front (being the components and parts faces) with antistatic foam 5 again, be fixed on the base plate 9 with pressing plate 6, side plate 2, alignment pin 1 then, with location-plate 7 whole device is fixed at last.
More than be implementation process of the present utility model, allly change according to technical solutions of the utility model, during the not super technical solutions of the utility model scope of the function that produces, effectiveness, all belong to the utility model protection domain.
Claims (2)
1. device of controlling wave-soldering solder joint pin height, it is characterized in that: this device is by alignment pin [1], side plate [2], print template [3], printed board [4], antistatic foam [5], pressing plate [6], location-plate [7], the first hinge chain [8], base plate [9], the second hinge chain [10] is formed, the first hinge chain [8] is connected base plate [9] with pressing plate [6], the second hinge chain [10] is connected base plate [9] with side plate [2], base plate [9] is positive to fit tightly with antistatic foam [5], the length of antistatic foam [5] is identical with base plate [9], thickness is consistent with the width of side plate [2], is convenient to antistatic foam [5], printed board [4] and printing template [3] are fastened on the device together.
2. a kind of device of controlling wave-soldering solder joint pin height according to claim 1, it is characterized in that: described side plate [2] has 3 chutes, and 1 alignment pin [1] is housed in each chute.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010205952041U CN202045432U (en) | 2010-11-05 | 2010-11-05 | Device for controlling height of pin of wave-welding spot |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010205952041U CN202045432U (en) | 2010-11-05 | 2010-11-05 | Device for controlling height of pin of wave-welding spot |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202045432U true CN202045432U (en) | 2011-11-23 |
Family
ID=44985756
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010205952041U Expired - Lifetime CN202045432U (en) | 2010-11-05 | 2010-11-05 | Device for controlling height of pin of wave-welding spot |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202045432U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102935537A (en) * | 2012-07-27 | 2013-02-20 | 西安永电电气有限责任公司 | Welding fixture structure and welding method for n-shaped electrode based on insulated gate bipolar translator (IGBT) |
| CN103722267A (en) * | 2013-12-17 | 2014-04-16 | 合肥邦立电子股份有限公司 | Positioning-foam compressing tool for tin soldering tables |
| CN104722873A (en) * | 2014-10-10 | 2015-06-24 | 淮安信息职业技术学院 | Welding technological process for restraining discharge of welding spot without point |
-
2010
- 2010-11-05 CN CN2010205952041U patent/CN202045432U/en not_active Expired - Lifetime
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102935537A (en) * | 2012-07-27 | 2013-02-20 | 西安永电电气有限责任公司 | Welding fixture structure and welding method for n-shaped electrode based on insulated gate bipolar translator (IGBT) |
| CN103722267A (en) * | 2013-12-17 | 2014-04-16 | 合肥邦立电子股份有限公司 | Positioning-foam compressing tool for tin soldering tables |
| CN103722267B (en) * | 2013-12-17 | 2016-04-13 | 合肥邦立电子股份有限公司 | Soldering platform location foam compression tooling |
| CN104722873A (en) * | 2014-10-10 | 2015-06-24 | 淮安信息职业技术学院 | Welding technological process for restraining discharge of welding spot without point |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20111123 |