CN202041977U - External communication expansion device for subscriber identity module (SIM) card with built-in antenna - Google Patents
External communication expansion device for subscriber identity module (SIM) card with built-in antenna Download PDFInfo
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- CN202041977U CN202041977U CN2011201519915U CN201120151991U CN202041977U CN 202041977 U CN202041977 U CN 202041977U CN 2011201519915 U CN2011201519915 U CN 2011201519915U CN 201120151991 U CN201120151991 U CN 201120151991U CN 202041977 U CN202041977 U CN 202041977U
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Abstract
The utility model discloses an external communication expansion device for a subscriber identity module (SIM) card with a built-in antenna, belonging to the technical field of mobile communication. The external communication expansion device comprises a substrate, an antenna coil and a double-interface chip, wherein the double-interface chip is encapsulated on one side of the inside of the substrate; the other side of the substrate is provided with a card slot; and the antenna coil is arranged around the inside of the substrate, is positioned at the peripheries of the double-interface chip and the card slot, and is connected with the double-interface chip. By adopting the external communication expansion device, the overall thickness of the card can be reduced, and a patch smart card is convenient to install and uninstall; moreover, the external communication expansion device can be widely applied to mobile phones of different models, and has very high compatibility; meanwhile, non-contact and contact functions can be realized, and the appearance of a system after combination is consistent with that of the SIM card of which the size is ISO7816 ID-000; and the antenna is built in the system, so that any antenna with a connecting handle does not need to be inserted.
Description
Technical field
The utility model relates to the device in a kind of mobile communication technology field, specifically is a kind of SIM card PERCOM peripheral communication expanding unit of built-in aerial.
Background technology
DI (Dual Interface) card is the abbreviation of double-interface IC card, and the DI card is that coil forms by the laminated chip of PVC (Polyviny1 chloride polymer, Polyvinylchloride), and based on single-chip, collection contact and non-contact interface are the card of one.The DI card has two operation interfaces, both can also can under situation separated by a distance, visit chip, carry out identical operations by the contact of the way of contact by RF-wise, the different standard of two basic points is followed in two cross sections respectively, and contact interface meets ISO/IEC7816; The noncontact interface meets ISO/IEC1443.
The paster smart card, general smart card is made becomes ultra-thin paster form exactly, changes the smart card, particularly telecommunications SIM/UIM card of the standard that is attached to, the surface one logical special smart cards of using.The thickness of general paster smart card is 0.3～0.6mm, and main the application is the function that can additionally increase the conventional telecommunications smart card.Be convenient for changing a little, can directly change paster, and not need to change conventional smart card; Shortcoming is that some is thick for card behind the paster.Just because of its thickness reason, the inconvenient phenomenon of choosing when a lot of paste cards are put into the smart card slot, all appears inserting.
Find through retrieval prior art, Chinese patent literature CN201622596, open day 2010-11-3, put down in writing a kind of " two interfacial film smart card ", this technology comprises the plug receptacle on film and setting and the described film, and have the antenna part that the handle that removably connects connects, solved in the prior art and be solidified into an integral body and then be inconvenient to dismantle the problem of use because of antenna and connecting line.A weak point of this technology with: the antenna substrate at noncontact interface must extend out by connection handle, in use need indoor design structure according to different mobile phone decks and cell panel, it is folding that connection handle is overturn, and uses very inconvenient and tear easily.
Other has Chinese patent literature CN2845170, put down in writing a kind of " double integrated circuit card system ", this technology comprises first substrate with first integrated circuit (IC) chip, has an opening in this first substrate, this double-basis plinth circuit card system comprises one second substrate, this second substrate has the second substrate circuit chip and contact interface stroke thereon, and wherein this second integrated circuit (IC) chip is contained in this opening, and this contact interface is coupled between this first and second integrated circuit (IC) chip.This technology need be in first smart card upper shed to reach the purpose that reduces expropriation of land thickness owing to the thickness reason of second integrated chip.It with regard to the double integrated circuit card itself, has undeniablely increased a lot of application, but has considered equipment such as double integrated circuit card and portable terminal, owing to need exist certain limitation in former smart card upper shed.
The utility model content
The utility model is at the prior art above shortcomings, a kind of SIM card PERCOM peripheral communication expanding unit of built-in aerial is provided, this device can reduce the integral thickness of card, make things convenient for the installation and the unloading of paster smart card, and the mobile phone that can be widely used in different model has great compatibility.Simultaneously can realize non-connecing and the contact function, the system appearance after the combination is consistent with ISO7816ID-000 size SIM card, because system's built-in aerial does not need to patch the antenna that any band connects shank type.
The utility model is achieved through the following technical solutions, the utility model comprises: substrate, aerial coil and two interfaces chip, wherein: two interfaces Chip Packaging is in the inside of substrate one side, the opposite side of substrate is provided with draw-in groove, aerial coil is around the inside that is arranged at substrate and be positioned at the periphery of two interface chips and draw-in groove, and aerial coil links to each other with two interfaces chip.
Described draw-in groove is C4 contact and the C8 contact that is respectively equipped with the C7 contact in concave inward structure and the draw-in groove and is connected with two interfaces chip.
The inside casing shape of described draw-in groove is followed GSM 3FF standard.
Described C4 contact, C8 contact and C7 contact are positioned at the position of draw-in groove and follow the ISO7816-2 agreement.
The profile of described substrate is followed the SIM card size standard among the ISO7816 ID-000.
The utility model has solved many applications of double-interface SIM card, and card integral thickness increment is very little, can use as common SIM card separately, also can utilize built-in aerial, to meet the more applications environment.
Description of drawings
Fig. 1 is a Facad structure synoptic diagram of the present utility model.
Fig. 2 is a structure synoptic diagram of the present utility model.
Fig. 3 is a cross-sectional view of the present utility model.
Fig. 4 is the structural representation after the utility model and the combination of SIM card lesser calorie.
Embodiment
Below embodiment of the present utility model is elaborated; present embodiment is being to implement under the prerequisite with technical solutions of the utility model; provided detailed embodiment and concrete operating process, but protection domain of the present utility model is not limited to following embodiment.
Embodiment
As shown in Figure 1-Figure 3, present embodiment comprises: substrate 1, aerial coil 5 and two interfaces chip 6, wherein: two interfaces chip 6 is packaged in inside one side of substrate 1, the opposite side of substrate 1 is provided with draw-in groove 7, aerial coil 5 is around the inside that is arranged at substrate 1 and be positioned at the periphery of two interface chips 6 and draw-in groove 7, and aerial coil 5 links to each other with two interfaces chip 6.Two interfaces chip 6 is drawn by non-connection interface 8, is connected on C4 contact 2 and the C8 contact 3.
C4 contact 2 and the C8 contact 3 of described draw-in groove 7 for being respectively equipped with C7 contact 4 and being connected in concave inward structure and the draw-in groove with two interfaces chip 6.
The inside casing shape of described draw-in groove 7 is followed GSM 3FF standard.
Described C4 contact 2, C8 contact 3 and C7 contact 4 are positioned at the position of draw-in groove 7 and follow the ISO7816-2 agreement.
The profile of described substrate 1 is followed the SIM card size standard among the ISO7816 ID-000.
As shown in Figure 4, when present embodiment specifically used, with the corresponding contact 12 of C7 contact 4 connection lesser calories 9, C4 contact 2 connected the corresponding contact 10 of lesser calories 9, and C8 contact 3 connects the corresponding contact 11 of lesser calories 9.
Claims (5)
1. the SIM card PERCOM peripheral communication expanding unit of a built-in aerial, it is characterized in that, comprise: substrate, aerial coil and two interfaces chip, wherein: two interfaces Chip Packaging is in the inside of substrate one side, the opposite side of substrate is provided with draw-in groove, aerial coil is around the inside that is arranged at substrate and be positioned at the periphery of two interface chips and draw-in groove, and aerial coil links to each other with two interfaces chip.
2. the SIM card PERCOM peripheral communication expanding unit of built-in aerial according to claim 1 is characterized in that, described draw-in groove is C4 contact and the C8 contact that is respectively equipped with the C7 contact in concave inward structure and the draw-in groove and is connected with two interfaces chip.
3. the SIM card PERCOM peripheral communication expanding unit of built-in aerial according to claim 1 and 2 is characterized in that, the inside casing shape of described draw-in groove is followed GSM 3FF standard.
4. the SIM card PERCOM peripheral communication expanding unit of built-in aerial according to claim 2 is characterized in that, described C4 contact, C8 contact and C7 contact are positioned at the position of draw-in groove and follow the ISO7816-2 agreement.
5. the SIM card PERCOM peripheral communication expanding unit of built-in aerial according to claim 1 is characterized in that, the profile of described substrate is followed the SIM card size standard among the ISO7816 ID-000.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011201519915U CN202041977U (en) | 2011-05-13 | 2011-05-13 | External communication expansion device for subscriber identity module (SIM) card with built-in antenna |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011201519915U CN202041977U (en) | 2011-05-13 | 2011-05-13 | External communication expansion device for subscriber identity module (SIM) card with built-in antenna |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202041977U true CN202041977U (en) | 2011-11-16 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011201519915U Expired - Fee Related CN202041977U (en) | 2011-05-13 | 2011-05-13 | External communication expansion device for subscriber identity module (SIM) card with built-in antenna |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202041977U (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103577862A (en) * | 2012-07-25 | 2014-02-12 | 中国电信股份有限公司 | Biface user identification device and mobile terminal |
| CN103762411A (en) * | 2014-02-21 | 2014-04-30 | 上海坤锐电子科技有限公司 | Card support for whole card scheme SIM card of iphone and with antennas |
| US9686642B2 (en) | 2015-03-06 | 2017-06-20 | At&T Intellectual Property I, L.P. | Method and apparatus for providing location information for a wireless communication device |
| CN109522999A (en) * | 2017-09-19 | 2019-03-26 | 北京同方微电子有限公司 | A kind of new double-interface card chip architecture and encapsulation scheme |
-
2011
- 2011-05-13 CN CN2011201519915U patent/CN202041977U/en not_active Expired - Fee Related
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103577862A (en) * | 2012-07-25 | 2014-02-12 | 中国电信股份有限公司 | Biface user identification device and mobile terminal |
| CN103762411A (en) * | 2014-02-21 | 2014-04-30 | 上海坤锐电子科技有限公司 | Card support for whole card scheme SIM card of iphone and with antennas |
| US9686642B2 (en) | 2015-03-06 | 2017-06-20 | At&T Intellectual Property I, L.P. | Method and apparatus for providing location information for a wireless communication device |
| US10375510B2 (en) | 2015-03-06 | 2019-08-06 | At&T Intellectual Property I, L.P. | Method and apparatus for providing location information for a wireless communication device |
| CN109522999A (en) * | 2017-09-19 | 2019-03-26 | 北京同方微电子有限公司 | A kind of new double-interface card chip architecture and encapsulation scheme |
| CN109522999B (en) * | 2017-09-19 | 2024-05-07 | 紫光同芯微电子有限公司 | Novel double-interface card structure and packaging scheme |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20111116 Termination date: 20190513 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |