CN202030725U - Device fore preparing solar cell silicon wafer cutting sand pulp - Google Patents

Device fore preparing solar cell silicon wafer cutting sand pulp Download PDF

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Publication number
CN202030725U
CN202030725U CN2011200791033U CN201120079103U CN202030725U CN 202030725 U CN202030725 U CN 202030725U CN 2011200791033 U CN2011200791033 U CN 2011200791033U CN 201120079103 U CN201120079103 U CN 201120079103U CN 202030725 U CN202030725 U CN 202030725U
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CN
China
Prior art keywords
heat exchanger
polyoxyethylene glycol
solar cell
silicon wafer
polyethylene glycol
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Expired - Lifetime
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CN2011200791033U
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Chinese (zh)
Inventor
张龙
陈世波
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ZHENJIANG RIETECH NEW ENERGY TECHNOLOGY Co Ltd
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ZHENJIANG RIETECH NEW ENERGY TECHNOLOGY Co Ltd
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Priority to CN2011200791033U priority Critical patent/CN202030725U/en
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Publication of CN202030725U publication Critical patent/CN202030725U/en
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Abstract

The invention discloses a device fore preparing solar cell silicon wafer cutting sand pulp, which comprises a heat source device used for heating polyethylene glycol, a heat exchange device and a stirring device used for mixing silicon carbide and the heated polyethylene glycol; the upper part of the heat exchange device is provided with a water inlet used for feeding hot water; the lower part of the heat exchange device is provided with a water outlet; the water inlet and the outer outlet are respectively connected with the heat source device through pipelines; the upper part of the heat exchange device is provided with a feed port used for feeding the polyethylene glycol to be heated; the lower part of the heat exchange device is provided with a discharge port used for outputting the heated polyethylene glycol; and the discharge port is connected with the stirring device. The viscosity of the polyethylene glycol can be quickly reduced by quickly heating the polyethylene glycol so that silicon carbide particles can be uniformly dispersed in the polyethylene glycol, thus solving the problems of lines on the surfaces of silicon wafers, filter bag blocking and overlarge sand pulp pump load appeared in the solar cell silicon wafer cutting process.

Description

The equipment of preparation solar cell silicon wafer cutting mortar
Technical field
The utility model relates to the mortar compounding process field that is used for the silicon chip cutting in the solar cell manufacturing processed, is specifically related to a kind of equipment of preparing solar cell silicon wafer cutting mortar.
Background technology
In actual applications, to the surface finish of the silicon chip that is used to make solar cell, the index request strictness of cleanliness factor, in the cutting process of silicon chip, need to use the hardness height, granularity is little and the silicon carbide micro-powder of centralized particle diameter as main cutting medium.For silicon carbide micro-powder is uniformly dispersed in working angles, in time take away simultaneously the heat of friction that produces in the working angles, usually earlier the carbonization micro mist is joined according to a certain percentage also fully to disperse in polyoxyethylene glycol oiliness such as (PEG) the cutting liquid, be configured to be used further to the silicon chip cutting behind the uniform and stable cutting mortar.Polyoxyethylene glycol (PEG) molecular weight that is used for the cutting liquid of silicon chip cutting process is generally 300-400, and other PEG of this grade has suitable viscosity index, and existing good flowability has good dispersion stabilization to silicon carbide micro-powder again, and band sand ability is strong.
The problem that prior art exists is: when temperature is low in the winter time, it is big that polyoxyethylene glycol viscosity becomes, silicon-carbide particle is difficult to disperse in polyoxyethylene glycol, a lot of particle agglomeration phenomenons occur, and will produce silicon chip surface when cutting has problems such as stria, the stifled bag of filter bag and mortar pump load be excessive.
The utility model content
At the above-mentioned defective that prior art exists, problem to be solved in the utility model is, a kind of equipment of preparing solar cell silicon wafer cutting mortar is provided, and reduces the viscosity of polyoxyethylene glycol, satisfies the requirement of solar cell silicon wafer cutting to mortar.
For addressing the above problem, the utility model provides a kind of equipment of preparing solar cell silicon wafer cutting mortar, it is characterized in that, comprise be used to heat the heat power supply device and the heat exchanger of polyoxyethylene glycol and be used for the heating after described polyoxyethylene glycol and silicon carbide blended whipping appts; The top of described heat exchanger is provided with the water-in that is used to enter hot water, and the bottom of described heat exchanger is provided with water outlet, and described water-in is connected with described heat power supply device by pipeline respectively with water outlet; The top of described heat exchanger is provided with the opening for feed that is used to enter polyoxyethylene glycol to be heated, and the bottom of described heat exchanger is provided with the discharge port that is used to export the polyoxyethylene glycol after the heating, and described discharge port is connected with described whipping appts.
Preferably, also comprise the storing device that is used to store polyoxyethylene glycol to be heated, described storing device is connected with opening for feed on the described heat exchanger, also is provided with air pump between described opening for feed and the storing device.
As preferably, described opening for feed and storing device are respectively two, and each described opening for feed is connected with a described storing device respectively.
As preferably, described heat exchanger is a plate-type heat exchanger.
As preferably, described heat power supply device is a boiler.
The equipment of preparation solar cell silicon wafer cutting mortar of the present utility model is by carrying out rapid heating to polyoxyethylene glycol, can reduce the viscosity of polyoxyethylene glycol rapidly, make silicon-carbide particle homodisperse in polyoxyethylene glycol, having solved the silicon chip surface that occurs in the solar cell silicon wafer cutting process has stria, the stifled bag of filter bag and the excessive problem of mortar pump load.
Description of drawings
Fig. 1 is the composition structural representation that the preparation solar cell silicon wafer of embodiment one of the present utility model cuts the equipment of mortar.
Embodiment
Describe the embodiment of embodiment of the present utility model in detail below in conjunction with accompanying drawing.
Embodiment one
As shown in Figure 1, the equipment of the preparation solar cell silicon wafer of embodiment one of the present utility model cutting mortar comprises that they are used to heat polyoxyethylene glycol as the boiler 11 of heat power supply device and boiler 12 with as the plate-type heat exchanger 4 of heat exchanger, its temperature is raise, and viscosity reduces.Wherein, the quantity of employed boiler and power can be adjusted according to the quantity of the actual polyoxyethylene glycol that will heat, and can adopt polytype boiler, as vertical, horizontal fuel homogeneous solution-type reactor, vertical, horizontal fuel steam boiler etc.; Can also select other heat power supply devices except that boiler.Certainly, to one skilled in the art, heat exchanger can be selected other forms of heat exchanger as required, as plate type regenerator group etc.
As shown in Figure 1, the top of plate-type heat exchanger 4 be provided with the water-in 41 that is used for entering hot water,, the bottom is provided with water outlet 42.Water-in 41 is connected with boiler by pipeline respectively with water outlet 42, wherein, be respectively equipped with valve 111 and valve 121 on boiler 11 and boiler 12 and the pipeline that the water-in 41 of plate-type heat exchanger 4 is connected, valve 111 and valve 121 are used to regulate the speed that flows into the hot water in the plate-type heat exchanger 4, hot water descends through temperature after the heat exchange with polyoxyethylene glycol in plate-type heat exchanger 4, flow out from water outlet 42, get back to boiler 11 and boiler 12 through valve 123, heat again, heated hot water enters plate-type heat exchanger 4 by water-in 41 again, so circulation.
As shown in Figure 1, in the plate-type heat exchanger 4, top is provided with the opening for feed 45 that is used to enter polyoxyethylene glycol to be heated, opening for feed 45 is by pipeline and the storing device that is used to store polyoxyethylene glycol, be that storage tank 6 in the present embodiment links to each other, be provided with air pump 5 between opening for feed 45 and the storage tank 6, air pump 5 is extracted polyoxyethylene glycol to be heated out from storage tank 6, enter in the plate-type heat exchanger 4 from opening for feed 45 by pipeline.The bottom of plate-type heat exchanger 4 is provided with the discharge port 46 that is used to export the polyoxyethylene glycol after the heating, entering whipping appts from the effusive polyoxyethylene glycol through heating of discharge port 46 through valves 71 is mortar a mixing bowl 7 present embodiment, mixes being formed for the cutting mortar that silicon chip cuts with silicon carbide micro-powder in the mortar a mixing bowl 7.Valve 71 can be adjusted the speed of the polyoxyethylene glycol inflow mortar a mixing bowl 7 after the heating.
In the embodiment shown in fig. 1, as medium, make hot water and polyoxyethylene glycol in plate-type heat exchanger 4, carry out thermal exchange, the polyoxyethylene glycol through plate-type heat exchanger 4 is heated, have heating soon, the advantage that calorific loss is little by water.By polyoxyethylene glycol is effectively heated, improved the temperature of polyoxyethylene glycol, can reach 40 degrees centigrade, reduced the viscosity of polyoxyethylene glycol, its rotary viscosity is less than 60mPa.s.Polyoxyethylene glycol after the heating can with the silicon carbide thorough mixing, improved dispersiveness and the suspension of solid particulate in polyoxyethylene glycol of silicon carbide, make the cutting slurry density that is used for the silicon chip cutting that is mixed with stable, reached the requirement of cutting solar cell silicon wafer, having solved silicon chip surface has stria, the stifled bag of filter bag, the excessive problem of mortar pump load.
Embodiment two
Embodiment two is with the difference of embodiment one, has increased by one and has been used to store the storage tank that reclaims polyoxyethylene glycol.Wherein be respectively equipped with the pipeline of two polyoxyethylene glycol in the plate-type heat exchanger 4, the top of each pipeline is opening for feed 45, and the bottom is a discharge port 46.That is to say that when plate-type heat exchanger 4 was connected with two hold-up vessels, opening for feed 45 and discharge port 46 also were made as two, the storage tank of increase also is connected with an opening for feed 45 on plate-type heat exchanger 4 tops by an air pump.Like this, plate-type heat exchanger 4 just is connected with the storage tank of two polyoxyethylene glycol simultaneously, it in one of them storage tank primary polyoxyethylene glycol, be the recovery polyoxyethylene glycol in another storage tank, only need a plate-type heat exchanger 4 just can heat two kinds of polyoxyethylene glycol simultaneously, by primary polyoxyethylene glycol and recovery polyoxyethylene glycol are heated simultaneously, flow out by discharge port 46 respectively, in mortar a mixing bowl 7, mix with the silicon carbide solid.The ratio of primary polyoxyethylene glycol and recovery polyoxyethylene glycol can be controlled by the valve 71 between discharge port 46 and the mortar a mixing bowl 7, because it is lower to reclaim the price of polyoxyethylene glycol, thereby has reduced production cost.Certainly, can also only establish the pipeline of a polyoxyethylene glycol in the plate-type heat exchanger 4, just be provided with two opening for feeds 45 simultaneously, be connected with two storage tanks by air pump respectively, so just primary polyoxyethylene glycol being mixed the back by a certain percentage with the recovery polyoxyethylene glycol heats at plate-type heat exchanger 4, flow out by same discharge port 46, enter mortar a mixing bowl 7.In this case, the ratio of primary polyoxyethylene glycol and recovery polyoxyethylene glycol can be by 5 controls of the air pump between opening for feed 45 and the storage tank.
Certainly; the above is a preferred implementation of the present utility model; should be understood that; for those skilled in the art; under the prerequisite that does not break away from the utility model principle; can also make some improvements and modifications, these improvements and modifications also are considered as protection domain of the present utility model.

Claims (5)

1. an equipment of preparing solar cell silicon wafer cutting mortar is characterized in that, comprises being used to heat the heat power supply device and the heat exchanger of polyoxyethylene glycol and being used for described polyoxyethylene glycol and silicon carbide blended whipping appts after the heating;
The top of described heat exchanger is provided with the water-in that is used to enter hot water, and the bottom of described heat exchanger is provided with water outlet, and described water-in is connected with described heat power supply device by pipeline respectively with water outlet;
The top of described heat exchanger is provided with the opening for feed that is used to enter polyoxyethylene glycol to be heated, and the bottom of described heat exchanger is provided with the discharge port that is used to export the polyoxyethylene glycol after the heating, and described discharge port is connected with described whipping appts.
2. the equipment of preparation solar cell silicon wafer cutting mortar as claimed in claim 1, it is characterized in that, also comprise the storing device that is used to store polyoxyethylene glycol to be heated, described storing device is connected with opening for feed on the described heat exchanger, also is provided with air pump between described opening for feed and the storing device.
3. the equipment of preparation solar cell silicon wafer cutting mortar as claimed in claim 2 is characterized in that described opening for feed and storing device are respectively two, and each described opening for feed is connected with a described storing device respectively.
4. the equipment of preparation solar cell silicon wafer cutting mortar as claimed in claim 1 is characterized in that described heat exchanger is a plate-type heat exchanger.
5. the equipment of preparation solar cell silicon wafer cutting mortar as claimed in claim 1 is characterized in that described heat power supply device is a boiler.
CN2011200791033U 2011-03-23 2011-03-23 Device fore preparing solar cell silicon wafer cutting sand pulp Expired - Lifetime CN202030725U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN2011200791033U CN202030725U (en) 2011-03-23 2011-03-23 Device fore preparing solar cell silicon wafer cutting sand pulp

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN2011200791033U CN202030725U (en) 2011-03-23 2011-03-23 Device fore preparing solar cell silicon wafer cutting sand pulp

Publications (1)

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CN202030725U true CN202030725U (en) 2011-11-09

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CN2011200791033U Expired - Lifetime CN202030725U (en) 2011-03-23 2011-03-23 Device fore preparing solar cell silicon wafer cutting sand pulp

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102694058A (en) * 2011-03-23 2012-09-26 镇江荣德新能源科技有限公司 Device for preparing solar cell silicon chip cutting mortar
CN103627369A (en) * 2013-12-11 2014-03-12 兴化市台林机械有限公司 Abrasive paste and preparation method thereof
CN111805775A (en) * 2020-06-09 2020-10-23 徐州鑫晶半导体科技有限公司 Mortar supply method, mortar supply equipment and crystal bar cutting system

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102694058A (en) * 2011-03-23 2012-09-26 镇江荣德新能源科技有限公司 Device for preparing solar cell silicon chip cutting mortar
CN103627369A (en) * 2013-12-11 2014-03-12 兴化市台林机械有限公司 Abrasive paste and preparation method thereof
CN103627369B (en) * 2013-12-11 2018-07-06 兴化市台林机械有限公司 Abrasive pastes and preparation method thereof
CN111805775A (en) * 2020-06-09 2020-10-23 徐州鑫晶半导体科技有限公司 Mortar supply method, mortar supply equipment and crystal bar cutting system

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Granted publication date: 20111109