CN202018954U

CN202018954U - Wafer packaging mold

Info

Publication number: CN202018954U
Application number: CN2011200821185U
Authority: CN
Inventors: 钟旭光
Original assignee: SINGLE WELL PRECISION INDUSTRY (KUNSHAN) Co Ltd
Current assignee: SINGLE WELL PRECISION INDUSTRY (KUNSHAN) Co Ltd
Priority date: 2011-03-25
Filing date: 2011-03-25
Publication date: 2011-10-26
Anticipated expiration: 2021-03-25

Abstract

The utility model discloses a wafer packaging mold, which comprises an upper mold plate, an upper mold cavity, a lower mold plate, a lower mold cavity, an upper injection molding runner and a lower injection molding runner, wherein the upper mold cavity is recessed in a surface of the upper mold plate; the lower mold cavity is recessed in the surface of the lower mold plate and matched with the upper mold cavity in shape; the upper injection molding runner is arranged at an angular edge of the upper mold cavity and communicated with the upper mold cavity; the lower injection molding runner is arranged at the angular edge of the lower mold cavity and communicated with the lower mold cavity; the upper injection molding runner corresponds to the lower injection molding runner; and a de-foaming element is recessed in at least one angular edge of at least one of the upper mold cavity and the lower mold cavity. By arranging an air guide groove in the de-foaming element of the wafer packaging mold, air which remains in the mold cavities is guided into thermal plastics and then can completely enter an air groove channel which is formed by the air guide groove, so the problems that an air hole is easy to form in the conventional packaging mold during molding or a hard protection layer of a packaged product is easy to embrittle to shorten the service life of the product are solved.

Description

The wafer package mould

Technical field

The utility model relates to a kind of encapsulating mould, especially relates to a kind of wafer package mould.

Background technology

The encapsulation technology majority of present stage is finished wafer in the mode of mould model, the front end packaging operation of memory card, employed mould includes cope match-plate pattern, lower bolster, one surface of cope match-plate pattern and a surface of lower bolster all are concaved with a corresponding die cavity, one jiao of edge place at each die cavity is provided with an injection molding channel that is conducted with die cavity, can flow into for plastics, all be provided with a short and small air drain that is conducted with described die cavity as for remaining each edge place, angle, when last, after following die cavity middle part is placed with wafer, on closing, lower bolster, containing cavity of the corresponding formation of die cavity, then from injection molding channel, import plastics in the containing cavity, wafer is coated on central authorities and behind plastics solidification, be formed on the hard protective layer of wafer periphery, but in the process of producing, be easy to generate following two problems: first, just finish mould model when the air in containing cavity is not squeezed in three little air drains, can contain the gas hole in the hard protective layer that is coated on the wafer periphery behind the plastics solidification; Second; because in mfg. moulding die; have the volume difference that error causes two die cavitys; then the more capacious die cavity of the die cavity that volume is little injects full plastics earlier; because capacious die cavity does not also fill up and then can cause air tank is overlying on wherein; more than two kinds of easy embrittlement of product hard protective layer that situation all can produce the gas hole or seal, the life-span of having reduced product.

Summary of the invention

For overcoming above-mentioned shortcoming, thereby the purpose of this utility model is to provide a kind of gas hole of can avoiding in the process of mould model to produce the wafer package mould that has improved life of product.

In order to reach above purpose, the technical solution adopted in the utility model is: a kind of wafer package mould, and it comprises cope match-plate pattern, is arranged with in the upper mould cave on described cope match-plate pattern one surface; Lower bolster, the following die cavity that is arranged with in described lower bolster one surface and is complementary with the shape of described upper mould cave; And the last injection molding channel of being located at one jiao of edge place of described upper mould cave and being conducted with described upper mould cave, the following injection molding channel of being located at described one jiao of edge place of die cavity down and being conducted with described die cavity down, described upper and lower injection molding channel is corresponding mutually, and described upper mould cave is concaved with a de-bubble element with at least one edge place, angle of at least one die cavity of following die cavity.

Preferably, described de-bubble element comprises the inner groovy cave and is arranged with in first air slot of upper surface, relative both sides, described inner groovy cave, is connected by the discharge road between described inner groovy cave and the described die cavity.

Preferably, described upper mould cave is equipped with a de-bubble element with each edge place, angle of one of them die cavity of following die cavity, and each edge place, angle of another die cavity all is concaved with one second air slot, and described first air slot and described second air slot mate mutually.

Preferably, described upper mould cave is equipped with a de-bubble element with corresponding each the edge place, angle of following die cavity.

Owing to adopted technique scheme; be not difficult to find out that the utility model wafer package mould can be squeezed into the air that residues in the die cavity in the formed air drain of the air slot road completely by the setting of the air slot in the de-bubble element after importing thermoplastic materials; solve the easy embrittlement of product hard protective layer that the conventional package mould forms the gas hole or seals easily in mould model, reduced the problem in the life-span of product.

Description of drawings

Fig. 1 is the schematic diagram of embodiment one;

Fig. 2 is for being injected with the profile at the A-A place of plastics and electronic component among Fig. 1;

Fig. 3 is the stereogram of embodiment one;

Fig. 4 is the schematic diagram of embodiment two;

Fig. 5 is the schematic diagram of embodiment three.

Among the figure:

The 10-cope match-plate pattern; The 11-upper mould cave; The last injection molding channel of 12-;

The 20-lower bolster; Die cavity under the 21-; Injection molding channel under the 22-;

30-de-bubble element; 31-inner groovy cave; 32-first air slot; 33-second air slot; 34-air drain road; 35-discharge road; The 40-thermoplastic materials; The 50-electronic component.

Embodiment

Below in conjunction with accompanying drawing preferred embodiment of the present utility model is described in detail, thereby protection range of the present utility model is made more explicit defining so that advantage of the present utility model and feature can be easier to be it will be appreciated by those skilled in the art that.

Referring to shown in Figure 1, a kind of wafer package mould, it comprises cope match-plate pattern 10, is arranged with in the upper mould cave 11 on cope match-plate pattern 10 1 surfaces; Lower bolster 20, the following die cavity 21 that is arranged with in lower bolster 20 1 surface and is complementary with the shape of upper mould cave 11; And the last injection molding channel 12 of being located at 11 1 jiaos of edge places of upper mould cave and being conducted with upper mould cave 11, the following injection molding channel 22 of being located at down 21 1 jiaos of edge places of die cavity and being conducted with following die cavity 21, upper and lower

injection molding channel

12,22 is corresponding mutually, upper mould cave 11 is concaved with a de-bubble element 30 with at least one edge place, angle of following die cavity 21 at least one die cavitys, be connected by discharge road 35 between first air slot 32 that de-bubble element 30 comprises inner groovy cave 31 and is arranged with the 31 relative upper surfaces, both sides in the inner groovy cave, inner groovy cave 31 and die cavity.

Embodiment one,

As Fig. 1, Fig. 2, shown in Figure 3, in the present embodiment, each edge place, angle of following die cavity 21 is equipped with a de-bubble element 30, first air slot 32 that de-bubble element 30 comprises inner groovy cave 31 and is arranged with the 31 relative upper surfaces, both sides in the inner groovy cave, then each edge place, angle of upper mould cave 11 all is concaved with one second air slot 33, second air slot 33 and first air slot 32 mate mutually, and when cope match-plate pattern 10 and lower bolster 20 matched moulds, first air slot 32 and second air slot 33 form air drain roads 34.

As shown in Figure 2; when electronic component 50 places in the die cavity; thermoplastic materials 40 is introduced in upper mould caves 11, the following die cavity 21 from following injection molding channel 22; air in the die cavity can be squeezed in the de-bubble element 30; when thermoplastic materials 40 is filled with in inner groovy cave 31; residual air is squeezed in the air drain road 34 that is formed by first air slot 32 and second air slot 33; after treating that thermoplastic materials 40 solidifies; because air is clamp-oned in the air drain road 34 twice; guaranteed that the hard protective layer that forms can not produce the gas hole, thereby improved the protection of hard protective layer.

Embodiment two,

As shown in Figure 4; compared to embodiment one; different is the position opposite of the de-bubble element 30 and second air slot 33; each the edge place, angle that is upper mould cave 11 is equipped with a de-bubble element 30; each edge place, angle of following die cavity 21 all is concaved with one second air slot 33; when cope match-plate pattern 10 and lower bolster 20 matched moulds; first air slot 32 in the de-bubble element 30 and second air slot 33 form air drain road 34; principle as embodiment one; air in the die cavity is clamp-oned in the air drain road 34 twice; guaranteed that the hard protective layer that forms can not produce the gas hole, thereby improved the protection of hard protective layer.

Embodiment three,

As shown in Figure 5, compared to embodiment one, different is, upper mould cave 11 is equipped with a de-bubble element 30 with following die cavity 21 corresponding each edge place, angle, when cope match-plate pattern 10 during with lower bolster 20 matched moulds, and the corresponding mutually formation air drain of per two first air slots 32 roads 34.

Above execution mode only is explanation technical conceive of the present utility model and characteristics; its purpose is to allow the people that is familiar with this technology understand content of the present utility model and is implemented; can not limit protection range of the present utility model with this; all equivalences of being done according to the utility model spirit change or modify, and all should be encompassed in the protection range of the present utility model.

Claims

1. wafer package mould, it comprises:

Cope match-plate pattern (10), be arranged with in the upper mould cave (11) on described cope match-plate pattern (10) one surfaces;

Lower bolster (20), the following die cavity (21) that is arranged with in described lower bolster (20) one surfaces and is complementary with the shape of described upper mould cave (11); And

The last injection molding channel (12) of being located at (11) one jiaos of edge places of described upper mould cave and being conducted with described upper mould cave (11), the following injection molding channel (22) of being located at described (21) one jiaos of edge places of die cavity down and being conducted with described die cavity (21) down, described upper and lower injection molding channel (12,22) is corresponding mutually, it is characterized in that: described upper mould cave (11) is concaved with a de-bubble element (30) with at least one edge place, angle of at least one die cavity of following die cavity (21).

2. wafer package mould according to claim 1, it is characterized in that: described de-bubble element (30) comprises inner groovy cave (31) and is arranged with in described inner groovy cave (31) first air slot (32) of upper surface, both sides relatively, is connected by discharge road (35) between described inner groovy cave (31) and the described die cavity.

3. wafer package mould according to claim 1 and 2, it is characterized in that: described upper mould cave (11) is equipped with a de-bubble element (30) with each edge place, angle of one of them die cavity of following die cavity (21), each edge place, angle of another die cavity all is concaved with one second air slot (33), and described first air slot (32) mates mutually with described second air slot (33).

4. wafer package mould according to claim 1 and 2 is characterized in that: described upper mould cave (11) is equipped with a de-bubble element (30) with corresponding each the edge place, angle of following die cavity (21).