CN202011134U - Power failure protector for semiconductor plastic encapsulation press - Google Patents

Power failure protector for semiconductor plastic encapsulation press Download PDF

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Publication number
CN202011134U
CN202011134U CN2010205620366U CN201020562036U CN202011134U CN 202011134 U CN202011134 U CN 202011134U CN 2010205620366 U CN2010205620366 U CN 2010205620366U CN 201020562036 U CN201020562036 U CN 201020562036U CN 202011134 U CN202011134 U CN 202011134U
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CN
China
Prior art keywords
semiconductor plastic
plastic package
valve
protection device
hydraulic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN2010205620366U
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Chinese (zh)
Inventor
朱玉根
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Wuhu King-Mac Mechanical & Electrical Technical Co Ltd
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Wuhu King-Mac Mechanical & Electrical Technical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Wuhu King-Mac Mechanical & Electrical Technical Co Ltd filed Critical Wuhu King-Mac Mechanical & Electrical Technical Co Ltd
Priority to CN2010205620366U priority Critical patent/CN202011134U/en
Application granted granted Critical
Publication of CN202011134U publication Critical patent/CN202011134U/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Abstract

The utility model discloses a power failure protector for a semiconductor plastic encapsulation press, which is characterized in that in the device, an energy accumulator, after being connected with an electromagnetic valve, a reducing valve and a pressure switch in sequence, is accessed to a hydraulic module, and then connected with a hydraulic pump of the semiconductor plastic encapsulation press through a pipeline; an electric control unit is connected with the electromagnetic valve; due to the adoption of the structure, the device has the advantages as follows: 1, the device avoids that a complete mold of an encapsulation product is scrapped due to sudden power failure, thereby effectively improving the reliability of the finished product of encapsulation equipment; 2, scrapping of the product is avoided, the production efficiency of an enterprise is improved, and the production cost is lowered; and 3, the device has a simple structure and can be transformed on the basis of the conventional plastic encapsulation press, therefore, the investment of the enterprise is less.

Description

A kind of cut protection device of semiconductor plastic package press
Technical field
The utility model relates to the Plastic Package field, particularly a kind of cut protection device of semiconductor plastic package press.
Background technology
The semiconductor plastic package press is the special equipment that is used for encapsulated integrated circuit chip and discrete device, is collection machinery, hydraulic pressure, automatically controlledly is the electronic product of one.Control the switching that each valve member work in the hydraulic system realizes different hydraulic circuits by PLC, and control flow and pressure, thereby realize matched moulds and action of injection process and speed thereof, pressure control by flow control valve and pressure-control valve.Its working condition is similar to hydraulic injection molding machine, and its working cycles step is generally: matched moulds rising, matched moulds pressurization, input resin material, injecting resin, die sinking reset.
If the semiconductor plastic package press takes place because situations such as power failure, hydraulic pump stall can cause product that serious hidden danger of quality even scrap products are arranged sometimes, thereby increase production cost in carrying out the injecting resin process.
Avoid in process of production because have a power failure or hydraulic pump quits work that to cause causing in the injection moulding process product rejection be the problem that prior art need solve.
The utility model content
Technical problem to be solved in the utility model is, a kind of cut protection device of semiconductor plastic package press is provided, to solve the semiconductor plastic package press in process of production because have a power failure or hydraulic pump quits work and causes the problem of product rejection.
For solving the problems of the technologies described above, the technical solution of the utility model is, a kind of cut protection device of semiconductor plastic package press is characterized in that: described device is that accumulator is connected to successively and is connected by the hydraulic pump of pipeline with the semiconductor plastic package press after being linked into hydraulic module after magnetic valve, pressure-reducing valve and the pressure switch; Electric control unit is connected with magnetic valve, thereby utilizes accumulator to come the replacement liquid press pump to finish whole plastic packaging process when by electric control unit the control of electromagnetic valve being implemented in outage.
Described electric control unit is that its positive-negative power inserted magnetic valve by timer after battery was connected to the PCB charging panel; Be provided with control relay between battery and timer, the magnetic valve, thereby open this device when being implemented in outage, and utilize timer automatic disconnection power of electromagnetic valve after finishing this plastic packaging, close this device by control relay.
Described battery provides 12V dc source, and provides working power for timer simultaneously.
Described hydraulic module is provided with exhaust bolt, thereby utilizes exhaust bolt to regulate the internal pressure of hydraulic module.
Be provided with check valve between the hydraulic pump of described accumulator and semiconductor plastic package press, thereby prevent the anti-cut protection device that flows back to of hydraulic oil.
The pipeline that is connected between described accumulator and magnetic valve, pressure switch, pressure-reducing valve, hydraulic module, the hydraulic pump is provided with stop valve, thereby makes things convenient for the inflation and the maintenance of this device.
A kind of cut protection device of semiconductor plastic package press, owing to adopt said structure, this device has the following advantages: 1, avoid because the phenomenon that power failure suddenly causes the encapsulating products mould preparation to be scrapped, effectively raise the finished product reliability of sealed in unit; 2, avoid product rejection to improve the production efficiency of enterprise, reduce production costs; 3, simple in structure, can transform existing plastic packaging press, enterprise drops into less.
Description of drawings
Below in conjunction with the drawings and specific embodiments the utility model is described in further detail;
Fig. 1 is the structured flowchart of the cut protection device of a kind of semiconductor plastic package press of the utility model;
Fig. 2 is the structural representation of the cut protection device of a kind of semiconductor plastic package press of the utility model;
Fig. 3 is the electric control unit circuit diagram of the cut protection device of a kind of semiconductor plastic package press of the utility model;
In Fig. 1-3,1, accumulator; 2, magnetic valve; 3, pressure switch; 4, pressure-reducing valve; 5, hydraulic module; 6, exhaust bolt; 7, electric control unit.
The specific embodiment
As Figure 1-3, a kind of cut protection device of semiconductor plastic package press is characterized in that: described device is that accumulator 1 is connected to successively and is linked into hydraulic module 5 backs after magnetic valve 2, pressure-reducing valve 4 and the pressure switch 3 and is connected by the hydraulic pump of pipeline with the semiconductor plastic package press; Electric control unit 7 is connected with magnetic valve 2, thereby the control by 7 pairs of electromagnetic valves of electric control unit utilizes accumulator 1 to come the replacement liquid press pump to finish whole plastic packaging process when being implemented in outage.
Its positive-negative power inserts magnetic valve 2 by timer to electric control unit 7 behind the PCB charging panel for battery is connected to; Be provided with control relay between battery and timer, the magnetic valve 2, thereby open this device when being implemented in outage, and utilize timer automatic disconnection power of electromagnetic valve after finishing this plastic packaging, close this device by control relay.Battery provides 12V dc source, and provides working power for timer simultaneously.
Hydraulic module 5 is provided with exhaust bolt 6, thus the internal pressure of utilizing exhaust bolt 6 to regulate hydraulic module 5.
Be provided with check valve between the hydraulic pump of accumulator 1 and semiconductor plastic package press, thereby prevent the anti-cut protection device that flows back to of hydraulic oil.The pipeline that is connected between accumulator 1 and magnetic valve 2, pressure switch 3, pressure-reducing valve 4, hydraulic module 5, the hydraulic pump is provided with stop valve, thereby makes things convenient for the inflation and the maintenance of this device.
When the utility model is made of electrical control and two parts of hydraulic control.Electrical control is that electric control unit 7 comprises the electric control loop that battery, timer and PCB charging panel, relay are constituted.Hydraulic control partly is a drive unit that is made of hydraulic module 5, accumulator 1, pressure switch 3, magnetic valve 2, exhaust bolt 6.
When producing, passes through the utility model the PCB charging panel to charge in batteries under normal condition.When having a power failure in the injection moulding process, battery begins power supply, and timer is started working, and accumulator 1 advances by magnetic valve 2 remaining hydraulic oil in the injection cylinder and makes injection pressure and time with just often the same in injecting head, thereby makes injection cycle finish.When preventing that hydraulic pump from stopping, the hydraulic oil that accumulator 1 stores flows backwards and makes the pump counter-rotating, should between accumulator 1 and hydraulic pump check valve be installed.Between accumulator and the pipeline stop valve has been installed, has been used for inflation and maintenance.
The utility model adopts modular electrical control and structural design, and whole mechanical-hydraulic control device is installed on the standalone module, and electric control loop provides 12V electric energy by battery when having a power failure.Its control principle is: when normal press was worked, relay CR1 disconnected, and compensation electromagnetic valve and loop timer must not be electric among the figure, and the lathe injection is finished by the oil pump injection.Relay CR1 closure when taking place to have a power failure, compensation electromagnetic valve and loop timer get electric, and the lathe injection is finished by pressure-reducing valve by the accumulator hydraulic oil.Compensation beginning control loop is realized that by relay CR3, CR4, CR5 control loop this device that only has a power failure suddenly works when the injection process.
When press has a power failure during in injection moulding.Storage battery power supply, timer is started working, and connects magnetic valve 2 by relay CR1.Magnetic valve 2 is opened, and accumulator 1 pushes the injection moulding oil cylinder with the hydraulic oil that stores injection pressure is provided, and magnetic valve 2 cuts out and prevents that hydraulic oil is back in the master cylinder.
Can avoid on the semiconductor packaging device because the phenomenon that burst power failure causes the encapsulating products mould preparation to be scrapped because the utility model is applied in, improve the finished product reliability of sealed in unit greatly.
In conjunction with the accompanying drawings the utility model has been carried out exemplary description above; obviously the utility model specific implementation is not subjected to the restriction of aforesaid way; as long as the various improvement of having adopted method design of the present utility model and technical scheme to carry out; or directly apply to other occasion without improvement, all within protection domain of the present utility model.

Claims (6)

1. the cut protection device of a semiconductor plastic package press is characterized in that: described device is that accumulator (1) is connected to successively and is linked into hydraulic module (5) back after magnetic valve (2), pressure-reducing valve (4) and the pressure switch (3) and is connected by the hydraulic pump of pipeline with the semiconductor plastic package press; Electric control unit (7) is connected with magnetic valve (2).
2. the cut protection device of a kind of semiconductor plastic package press according to claim 1 is characterized in that: described electric control unit (7) for battery be connected to the PCB charging panel after its positive-negative power insert magnetic valve by timer; Be provided with control relay (CR1, CR13, CR4, CR5) between battery and timer, the magnetic valve (2).
3. the cut protection device of a kind of semiconductor plastic package press according to claim 2 is characterized in that: described battery provides 12V dc source, and provides working power for timer simultaneously.
4. the cut protection device of a kind of semiconductor plastic package press according to claim 1 is characterized in that: described hydraulic module (5) is provided with exhaust bolt (6).
5. the cut protection device of a kind of semiconductor plastic package press according to claim 1 is characterized in that: be provided with check valve between the hydraulic pump of described accumulator (1) and semiconductor plastic package press.
6. the cut protection device of a kind of semiconductor plastic package press according to claim 1 is characterized in that: the pipeline that is connected between described accumulator (1) and magnetic valve (2), pressure switch (3), pressure-reducing valve (4), hydraulic module (5), the hydraulic pump is provided with stop valve.
CN2010205620366U 2010-10-14 2010-10-14 Power failure protector for semiconductor plastic encapsulation press Expired - Fee Related CN202011134U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN2010205620366U CN202011134U (en) 2010-10-14 2010-10-14 Power failure protector for semiconductor plastic encapsulation press

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN2010205620366U CN202011134U (en) 2010-10-14 2010-10-14 Power failure protector for semiconductor plastic encapsulation press

Publications (1)

Publication Number Publication Date
CN202011134U true CN202011134U (en) 2011-10-19

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN2010205620366U Expired - Fee Related CN202011134U (en) 2010-10-14 2010-10-14 Power failure protector for semiconductor plastic encapsulation press

Country Status (1)

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CN (1) CN202011134U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112018720A (en) * 2019-05-31 2020-12-01 核工业理化工程研究院 Power failure protection method and protection system of power supply system based on PLC control

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112018720A (en) * 2019-05-31 2020-12-01 核工业理化工程研究院 Power failure protection method and protection system of power supply system based on PLC control

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C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20111019

Termination date: 20141014

EXPY Termination of patent right or utility model