CN202006415U - Novel polishing machine - Google Patents
Novel polishing machine Download PDFInfo
- Publication number
- CN202006415U CN202006415U CN2011200198048U CN201120019804U CN202006415U CN 202006415 U CN202006415 U CN 202006415U CN 2011200198048 U CN2011200198048 U CN 2011200198048U CN 201120019804 U CN201120019804 U CN 201120019804U CN 202006415 U CN202006415 U CN 202006415U
- Authority
- CN
- China
- Prior art keywords
- polishing machine
- head
- guide bar
- support guide
- flexure strip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Abstract
The utility model discloses a novel polishing machine, which comprises a polishing machine body and a head on the body, wherein the head is provided with a polishing sheet; and the polishing sheet comprises at least one layer of elastic sheet and an abrasive material adhered to the elastic sheet. Through the improvement provided by the utility model, at least one compression spring and at least one supporting guide rod are arranged between the head and the body; the supporting guide rod is fixed on the head; the body is provided with a travel groove which is matched with the supporting guide rod; the supporting guide rod is arranged in the compression spring; and the compression spring and the supporting guide mechanism form a buffer device. In the polishing machine, the buffer device is arranged between the body and the head, so that impact caused by the polishing machine during use is relieved, and the working of the polishing sheet is facilitated. The elastic polishing sheet with elasticity is combined with an inner metal fixing ring and has toughness and rigidity, so that the comprehensive performance is improved, and furthermore, an accident of bursting of the polishing sheet caused by careless operation is reduced.
Description
Technical field
The utility model relates to the polishing machine that a kind of panel beating mirror polish is used, in particular for the polishing machine of automobile upper face polishing.
Background technology
In the vehicle maintenance process, the surface needs polishing in rust cleaning or baking vanish front face, and the polished silicon wafer of the polishing machine that is used to polish is an emery wheel, in polishing process, require the user to grasp the polishing dynamics of polishing machine, for operating personnel certain requirement is arranged, power causes polishing not enough inadequately; The excessive polishing of exaggerating of power, severe patient can make the polished silicon wafer explosion, causes accident.
Summary of the invention
The utility model is for solving prior art in use, and the deficiency of existence provides that a kind of to satisfy execute-in-place rigidity moderate, the polishing machine of being convenient to operate.
The technical scheme that the utility model solves existing issue is: a kind of novel polishing machine, comprise the polishing machine body, be arranged at the head on the body, described head is provided with polished silicon wafer, described polished silicon wafer comprises one deck flexure strip and the abrasive material that is bonded on the flexure strip at least, as improvement of the present utility model, be provided with at least one stage clip and at least one support guide bar on the described head and between the body, described support guide bar is fixed on the head, and body is provided with the stroke groove that matches with the support guide bar.Described support guide bar is arranged in the stage clip, and described stage clip and support guide bar constitute a buffer unit.
As further improvement of the utility model, be compounded with the metal retainer plate of diameter on the described flexure strip less than flexure strip.
As further improvement of the utility model, described metal retainer plate is the waveform retainer plate.
As further improvement of the utility model, described flexure strip is provided with two-layer, and the metal retainer plate is compound between the two-layer flexure strip, and described abrasive material is bonded on the metal retainer plate, and is sandwiched between the two-layer flexure strip.
As further improvement of the utility model, described abrasive material is the wire of tempering.
As further improvement of the utility model, described support guide bar is arranged in the stage clip, and is concentric with stage clip.
As further improvement of the utility model, be provided with stop pin, at least one lockhole that cooperates with stop pin on the support guide bar in the stroke groove of described body.
The utility model compared with prior art, its beneficial effect is that a buffer unit is set between body and head, alleviates the impact that polishing machine in use causes, and is convenient to polished silicon wafer work.Elastic polished silicon wafer and inner metal retainer plate combine, and make polished silicon wafer flexible and rigidity, and combination property gets a promotion, thereby reduce the polished silicon wafer bursting accident that causes because of careless manipulation.
Description of drawings
Fig. 1 is a structural representation of the present utility model.
Fig. 2 is the structure enlarged diagram of the utility model polished silicon wafer.
The specific embodiment
Referring to Fig. 1-2, the implementation case comprises polishing machine body 1, be arranged at the head 2 on the body 1, head 2 is provided with polished silicon wafer, polished silicon wafer comprises one deck flexure strip 3 and the abrasive material 31 that is bonded on the flexure strip 3 at least, be provided with at least one stage clip 4 and at least one support guide bar 5 on the head 2 and between the body 1, support guide bar 5 is fixed on the head 2, and body 1 is provided with the stroke groove 11 that matches with support guide bar 5.Support guide bar 5 is arranged in the stage clip 4, and stage clip 4 and support guide bar 5 constitute a buffer unit.Be preferably in the implementation case support guide bar 5 and a stage clip 4 only are set, be convenient to simplified structure.Support guide bar 5 is arranged in the stage clip 4, and is concentric with stage clip 4.Be provided with stop pin 12 in the stroke groove 11 of body 1, at least one lockhole 51 that cooperates with stop pin 12 on the support guide bar 5, stop pin 12 matches with lockhole 51, pins head 2, and can use this moment as common polishing machine.
Be compounded with the metal retainer plate 32 of diameter less than flexure strip 3 on the flexure strip 3, metal retainer plate 32 is the waveform retainer plate.In the implementation case, flexure strip 3 is provided with two-layer, and between metal the retainer plate 32 compound and two-layer flexure strips 3, abrasive material 31 is bonded on the metal retainer plate 32, and is sandwiched between the two-layer flexure strip 3, and abrasive material 31 is the wire of tempering.
Claims (7)
1. novel polishing machine, comprise the polishing machine body, be arranged at the head on the body, described head is provided with polished silicon wafer, described polished silicon wafer comprises one deck flexure strip and the abrasive material that is bonded on the flexure strip at least, it is characterized in that: be provided with at least one stage clip and at least one support guide bar on the described head and between the body, described support guide bar is fixed on the head, body is provided with the stroke groove that matches with the support guide bar, described support guide bar is arranged in the stage clip, and described stage clip and support guide bar constitute a buffer unit.
2. novel polishing machine as claimed in claim 1 is characterized in that: be compounded with the metal retainer plate of diameter less than flexure strip on the described flexure strip.
3. novel polishing machine as claimed in claim 1 or 2 is characterized in that: described metal retainer plate is the waveform retainer plate.
4. novel polishing machine as claimed in claim 3 is characterized in that: described flexure strip is provided with two-layer, and the metal retainer plate is compound between the two-layer flexure strip, and described abrasive material is bonded on the metal retainer plate, and is sandwiched between the two-layer flexure strip.
5. novel polishing machine as claimed in claim 4 is characterized in that: described abrasive material is the wire of tempering.
6. novel polishing machine as claimed in claim 1 is characterized in that: described support guide bar is arranged in the stage clip.
7. as claim 1 or 6 described novel polishing machines, it is characterized in that: be provided with stop pin, at least one lockhole that cooperates with stop pin on the support guide bar in the stroke groove of described body.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011200198048U CN202006415U (en) | 2011-01-21 | 2011-01-21 | Novel polishing machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011200198048U CN202006415U (en) | 2011-01-21 | 2011-01-21 | Novel polishing machine |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202006415U true CN202006415U (en) | 2011-10-12 |
Family
ID=44748078
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011200198048U Expired - Fee Related CN202006415U (en) | 2011-01-21 | 2011-01-21 | Novel polishing machine |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202006415U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106271660A (en) * | 2016-09-28 | 2017-01-04 | 煌盛集团重庆管业有限公司 | Axially cutting metallic conduit device with grinding function |
-
2011
- 2011-01-21 CN CN2011200198048U patent/CN202006415U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106271660A (en) * | 2016-09-28 | 2017-01-04 | 煌盛集团重庆管业有限公司 | Axially cutting metallic conduit device with grinding function |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20111012 Termination date: 20130121 |