CN201990750U - Electroplating hanger system for semiconductor packaging products - Google Patents
Electroplating hanger system for semiconductor packaging products Download PDFInfo
- Publication number
- CN201990750U CN201990750U CN2011200279971U CN201120027997U CN201990750U CN 201990750 U CN201990750 U CN 201990750U CN 2011200279971 U CN2011200279971 U CN 2011200279971U CN 201120027997 U CN201120027997 U CN 201120027997U CN 201990750 U CN201990750 U CN 201990750U
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- Prior art keywords
- controller
- hanger
- semiconductor package
- package product
- electroplating rack
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Abstract
The utility model relates to an electroplating hanger system for semiconductor packaging products, which comprises a power supply, a controller and a hanger, wherein the controller is provided with two digital input ports; and an ultrasonic sensor and an audible and visual alarm are arranged on the hanger and are respectively connected with the two digital input ports on the controller. Compared with the prior art, the electroplating hanger system for the semiconductor packaging products requested to be protected can detect the sequence of the products placed on the hanger on a real-time basis and send out an audible and visual indication to ensure that an operator can not take the wrong products to prevent mixed batch and avoid the economic loss.
Description
Technical field
The utility model relates to semiconductor technology, relates in particular to a kind of semiconductor package product Electroplating Rack system.
Background technology
In semiconductor packages, variant production has requirement in batches, even product design is the same, but need do batch treatment because the chip of encapsulation is different; Some are also arranged is that materials such as product design, chip are all identical, but because the difference of production technique also need be done batch treatment.These all require product to accomplish accurate differentiating and processing in the streamline course of processing, prevent to mix to criticize.
At present, criticize for prevent that product from mixing in the course of processing, it mainly is the mode that adopts artificial vision, memory to differentiate, but for the product of above-mentioned product design of the same race or even batching of the same race, depend vision alone and remember the mode of differentiating and be difficult to accomplish absolute fool proof processing, and in case product occurs and mix batch, can cause serious erroneous judgement and financial loss to the tracking of subsequent product etc.
The utility model content
The technical problem that the utility model solves is: how to avoid encapsulating products to be mixed in the course of processing and criticize.
For solving the problems of the technologies described above, the utility model provides a kind of semiconductor package product Electroplating Rack system, comprises power supply, controller and hanger.
Alternatively, described controller is provided with two digital input ports.
Alternatively, described hanger is provided with ultrasonic transducer and combined aural and visual alarm.
Alternatively, the ultrasonic transducer on the described hanger and combined aural and visual alarm link to each other with two digital input ports on the described controller respectively.
Alternatively, described controller links to each other with power supply.
Alternatively, described ultrasonic transducer links to each other with power supply with combined aural and visual alarm.
Alternatively, described controller is a programmable logic controller, and described programmable logic controller is micro-chip or industrial computer.
Alternatively, described power supply is the direct supply that is output as 24V.
Alternatively, described hanger has two at least.
Alternatively, described two hangers link to each other with a controller.
Compared with prior art, a kind of semiconductor package product Electroplating Rack system that the utility model is asked for protection, utilize parts such as controller, ultrasonic transducer, combined aural and visual alarm, testing product is placed into the precedence of hanger in real time, and send acousto-optic and indicate, guarantee operator not take product by mistake and prevent to mix batch, avoid financial loss; Simultaneously, this system is easy for installation, and it is little to take up room, and maintenance cost is low.
Description of drawings
Fig. 1 is the synoptic diagram of a kind of semiconductor package product Electroplating Rack system among the utility model embodiment.
Embodiment
A lot of details have been set forth in the following description so that fully understand the utility model.But the utility model can be implemented much to be different from alternate manner described here, and those skilled in the art can do similar popularization under the situation of the utility model intension, so the utility model is not subjected to the restriction of following public concrete enforcement.
Secondly, the utility model utilizes synoptic diagram to be described in detail, and when the utility model embodiment was described in detail in detail, for ease of explanation, described synoptic diagram was an example, and it should not limit the scope of the utility model protection at this.
Below in conjunction with accompanying drawing embodiment of the present utility model is described in detail.
As shown in Figure 1, a kind of semiconductor package product Electroplating Rack system that the utility model provides comprises power supply 5, controller 4 and hanger 1.Described hanger 1 is provided with ultrasonic transducer 2 and combined aural and visual alarm 3.
Described controller 1 is provided with two digital input ports, respectively with hanger 1 on ultrasonic transducer 2 link to each other with combined aural and visual alarm 3.Controller 4, ultrasonic transducer 2 and combined aural and visual alarm 3 all link to each other with power supply 5, and described power supply 5 can adopt the direct supply that is output as 24V that regulated supply is provided.
Described controller 4 is a programmable logic controller, as micro-chip or industrial computer, so that set instruction flexibly according to the actual production demand.
Described hanger 1 has two at least, and a controller 4 can link to each other with two hangers 1.
When product is hung on the hanger 1, ultrasonic transducer 2 detects product and exists, combined aural and visual alarm 3 can correspondingly glimmer and pipe, alert will with batch product hang on the same hanger 1, and the product of different batches is placed on another hanger 1, product combined aural and visual alarm 3 can not send the warning acousto-optic in order to avoid disturb though the ultrasonic transducer 2 on this moment second hanger 1 has also detected.The subsequent operations personnel according to acousto-optic indication will with batch product got after, 1 combined aural and visual alarm 3 just can send sound and light alarm on another hanger, to carry out a batch differentiation, prevents mixed getting.
Though the utility model discloses as above with preferred embodiment, the utility model is not to be defined in this.Any those skilled in the art in not breaking away from spirit and scope of the present utility model, all can do various changes and modification, and therefore protection domain of the present utility model should be as the criterion with claim institute restricted portion.
Claims (8)
1. semiconductor package product Electroplating Rack system is characterized in that: described hanger system comprises power supply, controller and hanger; Wherein, described controller is provided with two digital input ports; Described hanger is provided with ultrasonic transducer and combined aural and visual alarm.
2. a kind of semiconductor package product Electroplating Rack as claimed in claim 1 system is characterized in that: the ultrasonic transducer on the described hanger and combined aural and visual alarm link to each other with two digital input ports on the described controller respectively.
3. a kind of semiconductor package product Electroplating Rack as claimed in claim 1 system, it is characterized in that: described controller links to each other with power supply.
4. a kind of semiconductor package product Electroplating Rack as claimed in claim 1 system, it is characterized in that: described ultrasonic transducer links to each other with power supply with combined aural and visual alarm.
5. a kind of semiconductor package product Electroplating Rack as claimed in claim 1 system, it is characterized in that: described controller is a programmable logic controller, described programmable logic controller is micro-chip or industrial computer.
6. a kind of semiconductor package product Electroplating Rack as claimed in claim 1 system, it is characterized in that: described power supply is the direct supply that is output as 24V.
7. a kind of semiconductor package product Electroplating Rack as claimed in claim 1 system, it is characterized in that: described hanger has two at least.
8. a kind of semiconductor package product Electroplating Rack as claimed in claim 7 system, it is characterized in that: described two hangers link to each other with a controller.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2011200279971U CN201990750U (en) | 2011-01-27 | 2011-01-27 | Electroplating hanger system for semiconductor packaging products |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2011200279971U CN201990750U (en) | 2011-01-27 | 2011-01-27 | Electroplating hanger system for semiconductor packaging products |
Publications (1)
Publication Number | Publication Date |
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CN201990750U true CN201990750U (en) | 2011-09-28 |
Family
ID=44667244
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2011200279971U Expired - Fee Related CN201990750U (en) | 2011-01-27 | 2011-01-27 | Electroplating hanger system for semiconductor packaging products |
Country Status (1)
Country | Link |
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CN (1) | CN201990750U (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108950655A (en) * | 2018-08-13 | 2018-12-07 | 四川奥临科技有限公司 | A kind of environmental protection and energy saving steel band and its electroplating technology applied to semiconductor packages |
-
2011
- 2011-01-27 CN CN2011200279971U patent/CN201990750U/en not_active Expired - Fee Related
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108950655A (en) * | 2018-08-13 | 2018-12-07 | 四川奥临科技有限公司 | A kind of environmental protection and energy saving steel band and its electroplating technology applied to semiconductor packages |
CN108950655B (en) * | 2018-08-13 | 2019-07-23 | 四川奥临科技有限公司 | A kind of environmental protection and energy saving steel band and its electroplating technology applied to semiconductor packages |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
CF01 | Termination of patent right due to non-payment of annual fee | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20110928 Termination date: 20130127 |