CN201988824U - Fixture special for PCB (printed circuit board) hot air solder leveling - Google Patents

Fixture special for PCB (printed circuit board) hot air solder leveling Download PDF

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Publication number
CN201988824U
CN201988824U CN2011201154437U CN201120115443U CN201988824U CN 201988824 U CN201988824 U CN 201988824U CN 2011201154437 U CN2011201154437 U CN 2011201154437U CN 201120115443 U CN201120115443 U CN 201120115443U CN 201988824 U CN201988824 U CN 201988824U
Authority
CN
China
Prior art keywords
pcb
metal tube
hot air
framework
pcb board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN2011201154437U
Other languages
Chinese (zh)
Inventor
刘冬
周刚
叶汉雄
王予州
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Huidong Jian Xiang Electronic Technology Co., Ltd.
Original Assignee
HUIZHOU CHINA EAGLE ELECTRONIC TECHNOLOGY Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by HUIZHOU CHINA EAGLE ELECTRONIC TECHNOLOGY Co Ltd filed Critical HUIZHOU CHINA EAGLE ELECTRONIC TECHNOLOGY Co Ltd
Priority to CN2011201154437U priority Critical patent/CN201988824U/en
Application granted granted Critical
Publication of CN201988824U publication Critical patent/CN201988824U/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Abstract

The utility model relates to the producing field of a printed circuit board (PCB), in particular to a fixture special for a PCB hot air solder leveling technology. The fixture comprises a frame capable of adjusting sizes, a clamping groove for clamping the PCB is arranged on the inner lateral wall of the frame, and a fixing hole is arranged on an upper beam of the frame. When in usage, four edges of the PCB are arranged in the clamping groove arranged on the inner side of the frame, and a hot air solder leveling process is conducted after the PCB is fixed, the fact that the PCB transforms, is damaged and the like under influences of pressure of a hot air solder leveling air blade and resistance of solder liquid is effectively avoided, thereby guaranteeing quality of finished boards.

Description

A kind of pcb board spray tin special fixture
Technical field
The utility model relates to PCB and makes the field, is specifically related to the special fixture in a kind of pcb board tin spray process.
Background technology
In the pcb board manufacturing, for guaranteeing that tin is good on the pcb board, adhesion is strong, producer generally will spray tin to the pcb board surface and handle.But along with the development of technology, electronic product more and more develops to portability, lightening direction, also requires the more lightening densification of its inner wiring board.In traditional tin spray process, single pcb board directly hung on the spray tin hook by the locating hole on it carry out, tin air knife pressure and tin liquor drag effects are sprayed in the pcb board two sides, usually produce the uneven phenomenon of distortion, damage or tin face, not only influence the pcb board outward appearance, and bring serious hidden danger for the scolding tin quality of client, especially for some thin wiring boards, quality problems are more outstanding.
Summary of the invention
The problem that the utility model need solve provides a kind of pcb board spray tin special fixture.
For addressing the above problem, the technical scheme that the utility model is taked is: a kind of pcb board spray tin special fixture, comprise the framework that is used for fixing pcb board, and described frame size is adjustable; This framework comprises interconnective upper beam, underbeam, left side beam, right side beam, described upper beam, underbeam, left side beam, right side beam are formed by the metal tube of the mutual socket of two joints, slide in the metal tube outside by interior metal tube and to adjust the whole size of framework, described in metal tube fix by screw with outer metal tube; Each metal tube is positioned at the inboard place of framework the continuous draw-in groove that is used for the clamping pcb board is set, and on the described upper beam fixing hole is set.
The utility model is simple for structure, and is easy to use; Each beam length of described framework is short all adjustable, can adjust frame size according to the pcb board size during use, side bayonet slot can fixedly secure pcb board in the framework, fixing hole on putting the beams in place by framework hangs on the spray tin hook and sprays the tin operation, can effectively prevent phenomenons such as pcb board distortion, damage, guarantee the production board quality.
Description of drawings
Accompanying drawing 1 is that anchor clamps described in the utility model are formed structural representation;
Accompanying drawing 2 is jig frame girder construction schematic diagrames described in the utility model.
The specific embodiment
For the ease of those skilled in the art's understanding, the utility model structure is further described in detail below in conjunction with accompanying drawing.
As shown in Figure 1, 2, the pcb board spray tin special fixture that the utility model disclosed, primary structure is the framework of an adjustable size, by this framework pcb board is fixed and is sprayed tin again, prevents that plank is because of spraying the distortion that tin air knife pressure and tin liquor drag effects cause.
The size adjustment of this framework is that the length adjustment by four beams forming this framework realizes.Framework is the framework 1 of putting the beams in place 11, underbeam 12, left side beam 13,14 4 beams of right side beam interconnect composition, and each junction can be fixing by welding.Upper beam 11, underbeam 12, left side beam 13, right side beam 14 are formed by the metal tubes of the mutual socket of two joints, and two metal tubes are fixed by the butterfly screw.When need adjusting, screw the butterfly screw, make two metal tubes loosening after, interior metal tube is slided in the metal tube outside, when adjusting to suitable size, tighten the butterfly screw again, frame size is fixed.Be positioned at the inboard place of framework at each metal tube draw-in groove 10 is set, be used for the clamping pcb board, on the upper beam 11 fixing hole is set, be used for articulating with spray tin.

Claims (1)

1. a pcb board spray tin special fixture comprises the framework that is used for fixing pcb board, and it is characterized in that: described frame size is adjustable; This framework comprises interconnective upper beam (11), underbeam (12), left side beam (13), right side beam (14), described upper beam (11), underbeam (12), left side beam (13), right side beam (14) are formed by the metal tube of the mutual socket of two joints, slide in the metal tube outside by interior metal tube and to adjust the whole size of framework, described in metal tube fix by screw with outer metal tube; Each metal tube is positioned at the inboard place of framework the continuous draw-in groove that is used for the clamping pcb board (10) is set, and described upper beam is provided with fixing hole on (11).
CN2011201154437U 2011-04-19 2011-04-19 Fixture special for PCB (printed circuit board) hot air solder leveling Expired - Fee Related CN201988824U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN2011201154437U CN201988824U (en) 2011-04-19 2011-04-19 Fixture special for PCB (printed circuit board) hot air solder leveling

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN2011201154437U CN201988824U (en) 2011-04-19 2011-04-19 Fixture special for PCB (printed circuit board) hot air solder leveling

Publications (1)

Publication Number Publication Date
CN201988824U true CN201988824U (en) 2011-09-28

Family

ID=44665327

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2011201154437U Expired - Fee Related CN201988824U (en) 2011-04-19 2011-04-19 Fixture special for PCB (printed circuit board) hot air solder leveling

Country Status (1)

Country Link
CN (1) CN201988824U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112605038A (en) * 2020-12-03 2021-04-06 安徽晶飞科技有限公司 Assembling equipment for photovoltaic panel machining and working method thereof

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112605038A (en) * 2020-12-03 2021-04-06 安徽晶飞科技有限公司 Assembling equipment for photovoltaic panel machining and working method thereof
CN112605038B (en) * 2020-12-03 2022-09-06 安徽晶飞科技有限公司 Assembling equipment for photovoltaic panel machining and working method thereof

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Legal Events

Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
CB03 Change of inventor or designer information

Inventor after: Zhang Chengfeng

Inventor before: Liu Dong

Inventor before: Zhou Gang

Inventor before: Ye Hanxiong

Inventor before: Wang Yuzhou

CB03 Change of inventor or designer information
TR01 Transfer of patent right

Effective date of registration: 20170519

Address after: 516300, Huizhou District, Guangdong City, Huidong Province town of camphor Hill Industrial Zone two

Patentee after: Huidong Jian Xiang Electronic Technology Co., Ltd.

Address before: 516008 Guangdong province Huizhou City Road seven Lane three, eling Park in Beijing

Patentee before: Huizhou China Eagle Electronic Technology Co., Ltd.

TR01 Transfer of patent right
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20110928

Termination date: 20180419

CF01 Termination of patent right due to non-payment of annual fee