CN201985299U

CN201985299U - Conductive adhesive structure

Info

Publication number: CN201985299U
Application number: CN2011200395440U
Authority: CN
Inventors: 陈文俊; 周铭贤
Original assignee: YUANXING TECH Co Ltd
Current assignee: Modest Technology Ltd
Priority date: 2011-02-16
Filing date: 2011-02-16
Publication date: 2011-09-21
Anticipated expiration: 2021-02-16

Abstract

The utility model provides a conductive adhesive structure comprising a soft adhesive sheet, a plurality of conductive metal wires, and a plurality of conductors, wherein the soft adhesive sheet is made of elastic insulating material; the conductive metal wires are arranged in the soft adhesive sheet and two ends of each conductive metal wire are exposed out of the upper surface and the lower surface of the conductive adhesive respectively; and the conductors are arranged at one end of each conductive metal wire and correspond to electrodes of a PCB of a detection device. When the conducting resin structure is used, the conductors are in contact with the electrodes of the PCB to increase press-down stroke, so as to prolong the service life of the conducting resin and reduce solder splash falling on the surface of the conducting resin; meanwhile, the contact between a chip and the PCB of the detection device are more stable, and loose contact is prevented.

Description

The conducting resinl structure

Technical field

The utility model is about a kind of conducting resinl structure, be meant that especially a kind of use is when the detection of the chip of solder ball array encapsulation (BGA), can increase to press down stroke and alleviate and press down strength, and make the more stable conducting resinl structure that contacts between the printed circuit board (PCB) (PCB) of chip to be measured and a checkout gear.

Background technology

Along with science and technology is constantly progressive, various electronic product is constantly weeded out the old and bring forth the new, also bring simultaneously people's many facilities in life and efficient, more because various electronic product has occupied indispensable role at present in life, therefore, the stability of electronic product more allows the people pay attention to, since at present electronic product mainly by circuit board and on it cooperatively interacting of chip form, make the chip stability on the circuit board come into one's own more, in the process of present various chip manufacturing, because yield still can't reach absolutely, therefore after finishing, manufacturing still needs bad chip screening to be gone out by inspection process, and make it be able to the product condition of poor and take place.

At present in chip screening and measurement, main by a conducting resinl 1, see also shown in the 1st figure, this conducting resinl 1 is provided with the cushion compound 11 of an insulation, be provided with many conductive metal wires 12 in this cushion compound 11, each conductive metal wire 12 is arranged in this cushion compound 11, and each conductive metal wire 12 one on contact jaw 121 and once contact jaw 122 (two ends) is protruding respectively exposes on this conducting resinl 1, lower surface, use printed circuit board (PCB) 22 (PCB) for contact one a chip (not shown) to be measured and a checkout gear, make this chip to be measured be able to be electrically connected, detect with the printed circuit board (PCB) 22 of this checkout gear.

During use, the solder ball array encapsulation (BGA) of this chip to be measured is positioned over last contact jaw 121 tops of this conducting resinl 1, and following contact jaw 122 belows that the printed circuit board (PCB) 22 of this checkout gear placed this conducting resinl 1, by pressing down this chip to be measured this chip to be measured is electrically connected via the printed circuit board (PCB) 22 of this conducting resinl 1 with this checkout gear, and can carries out the detection of this chip to be measured.

Yet, though this known conducting resinl 1 can carry out the detection of this chip to be measured, but it utilizes conductive metal wire 12 directly the tin ball and the printed circuit board (PCB) 22 of this chip to be measured of contact, because tin ball circle is not easy contact, need to use the bigger strength that presses down, just can make the complete contact conductive metal wire 12 of chip to be measured, so thorn contact that scruff is exerted oneself because of conductive metal wire 12 easily on the tin ball, and scruff drops (thorn falls) on the conductive metal wire 12 of this conducting resinl 1, need are often cleared up otherwise are easy to generate loose contact, very not convenient, and use big under amount of pressure also cause cushion compound 11 bendings of conducting resinl 1 easily and elastic fatigue reduces useful life.

This shows that above-mentioned existing article still have many disappearances, real non-one kindhearted design, and demand urgently being improved.

Summary of the invention

In view of every shortcoming that above-mentioned existing conducting resinl is derived, this case creator urgently thinks to be improved innovation, and after concentrating on studies through taking great pains to attain one's goal for many years, successfully a kind of conducting resinl structure of this part is finished in research and development finally.

A purpose of the present utility model is to provide a kind of conducting resinl structure, can reduce the useful life that presses down strength and increase conducting resinl.

An of the present utility model purpose is to provide a kind of conducting resinl structure, can increase to press down stroke, and reduce scruff and drop (thorn falls) on the conducting resinl surface.

Another purpose of the present utility model is to provide a kind of conducting resinl structure, makes to contact more stablely between the printed circuit board (PCB) (PCB) of chip to be measured and a checkout gear, can not produce loose contact.

In order to achieve the above object, the utility model provides a kind of conducting resinl structure, comprising:

One cushion compound is a flexible insulation material;

Many conductive metal wires are arranged in this cushion compound, and the protruding respectively upper and lower surface of exposing this cushion compound of two ends of each conductive metal wire is respectively in order to the electrode of the printed circuit board (PCB) of the electrode of the printed circuit board (PCB) that contacts a chip to be measured, a checkout gear;

A plurality of conductor block, an end of being located at these many conductive metal wires is to electrode place that should printed circuit board (PCB), and each conductor block is made of many powder conductive particles.

During enforcement, this many powder conductive particles is a bronze end particle.

During enforcement, these many conductive metal wires are the metal wire of golden material.

During enforcement, these many conductive metal wires are arranged in this cushion compound in the arrayed mode.

During enforcement, these many conductor block are cylindric.

Can reach the conducting resinl structure of above-mentioned utility model purpose, include: a cushion compound, many conductive metal wires and a plurality of conductor block; Wherein, this cushion compound is a flexible insulation material; These many conductive metal wires are arranged in this cushion compound, and each conductive metal wire is arranged in this cushion compound, and each conductive metal wire one on contact jaw and the protruding respectively upper and lower surface of this conducting resinl of exposing of contact jaw once; These many conductor block are located on the position of printed circuit board (PCB) (PCB) electrode of the corresponding checkout gear of following contact jaw of conductive metal wire, and each conductor block is made of many powder conductive particles; During use, utilize conductor block to contact the electrode of this printed circuit board (PCB), make to increase and press down that stroke thereby minimizing press down strength and useful life of increasing conducting resinl, and reduce scruff and drop (thorn falls) on the conducting resinl surface, make simultaneously to contact more stablely between chip to be measured and this printed circuit board (PCB), can not produce the loose contact situation.

See also the detailed description and the accompanying drawing thereof of following relevant the utility model one preferred embodiment, can further understand technology contents of the present utility model and purpose effect thereof:

Description of drawings

Below in conjunction with drawings and Examples the utility model is further specified.

Fig. 1 is existing generalized section.

Fig. 2 is a front schematic view of the present utility model.

Fig. 3 is a schematic rear view of the present utility model.

Fig. 4 A is a generalized section of the present utility model.

Fig. 4 B is the part enlarged diagram of Fig. 4 A.

Embodiment

A kind of conducting resinl structure provided by the utility model sees also Fig. 2, shown in Figure 3, and this conducting resinl 3 mainly includes: a cushion compound 31, many conductive metal wires 32 and a plurality of conductor block 33.

Wherein, this cushion compound 31 is a flexible insulation material, and has the elasticity that opposing presses down strength.

These many conductive metal wires 32 are arranged in this cushion compound 31 in the arrayed mode, each conductive metal wire 32 is arranged in this cushion compound 31, and each conductive metal wire 32 one on contact jaw 321 and the protruding respectively upper and lower surface of exposing this cushion compound 31 of contact jaw 322 (two ends) once, use the electrode 521 that encapsulates the printed circuit board (PCB) 52 (PCB) of (Ball Grid Array is called for short BGA) and a checkout gear for the solder ball array of contact one chip (not shown) to be measured.

These many conductor block 33 are cylindric, be located at the position of the electrode 521 that 322 pairs of the following contact jaws of conductive metal wire 32 should printed circuit board (PCB) 52 in the arrayed mode, each conductor block 33 is made of many powder conductive particles 331 (as: the bronze end particle of conductivity the best, silver powder particle, copper powder particles etc.).

See also shown in Fig. 4 A, Fig. 4 B, during use, utilize the electrode 521 of conductor block 33 these printed circuit board (PCB)s 52 of contact, make to increase to press down stroke and to reduce and press down strength and the elastic fatigue phenomenon that reduces this cushion compound 31, thereby the useful life of increase conducting resinl 3, and reduce that scruff drops (thorn falls) on conducting resinl 3 surfaces on the chip to be measured, and make simultaneously to contact more stablely between chip to be measured and this printed circuit board (PCB) 52, can not produce the loose contact situation.

When detecting this chip to be measured, the solder ball array encapsulation (BGA) of this chip to be measured is positioned over last contact jaw 321 tops of this conducting resinl 3, and following contact jaw 322 belows that this printed circuit board (PCB) 52 placed this conducting resinl 3, by pressing down this chip to be measured this chip to be measured is electrically connected via the printed circuit board (PCB) 52 of this conducting resinl 3 with this checkout gear, and can carries out the detection of this chip to be measured.

These many conductive metal wires 32 can be the metal wire of the metal wire of the golden material of conductivity the best, silver-colored material or the metal wire of copper material.

Conducting resinl structure provided by the utility model when comparing mutually with aforementioned prior art, has more following advantage:

1. the useful life that presses down strength and increase conducting resinl can be reduced.

2. can increase and press down stroke, and reduce scruff and drop (thorn falls) on the conducting resinl surface.

3. make to contact more stablely between the printed circuit board (PCB) (PCB) of chip to be measured and a checkout gear, can not produce the situation of loose contact.

Above-listed detailed description is specifying at a possible embodiments of the present utility model, but this embodiment is not in order to limit claim of the present utility model, allly do not break away from the equivalence that the utility model skill spirit does and implement or change, for example: wait the equivalence embodiment of variation, all should be contained in the claim of this case.

Claims

1. a conducting resinl structure is characterized in that, comprising:

One cushion compound is a flexible insulation material;

2. conducting resinl structure according to claim 1 is characterized in that, this many powder conductive particles is a bronze end particle.

3. conducting resinl structure according to claim 1 is characterized in that, these many conductive metal wires are the metal wire of golden material.

4. conducting resinl structure according to claim 1 is characterized in that, these many conductive metal wires are arranged in this cushion compound in the arrayed mode.

5. conducting resinl structure according to claim 1 is characterized in that, these many conductor block are cylindric.