CN201975567U

CN201975567U - Improved micro-USB interface

Info

Publication number: CN201975567U
Application number: CN2011200055468U
Authority: CN
Inventors: 刘大海
Original assignee: KUNSHAN JXT PRECISION ELECTRONIC TECHNOLOGY Co Ltd
Current assignee: KUNSHAN JXT PRECISION ELECTRONIC TECHNOLOGY Co Ltd
Priority date: 2011-01-10
Filing date: 2011-01-10
Publication date: 2011-09-14
Anticipated expiration: 2021-01-10

Abstract

An improved micro-USB interface comprises a colloid formed by injection molding, wherein two main cavities for terminals to insert are arranged on the colloid; and the plurality of terminals are flat plate-type terminals, each terminal is provided with a terminal contact cross beam and a terminal position clamping cross beam, the terminals are inserted into the colloid in parallel, and the terminal contact cross beams are inserted into one main cavity of the colloid and the terminal position clamping cross beams are inserted into the other cavity of the colloid. The colloid is injection-molded by an injection machine at first, then terminal groups are mounted into corresponding cavities of the colloid, and the terminals are pressed into appropriate positions with the help of a pressing-in jig. The assembly mode adopted in the utility model has simple process and enables automatic assembly to be possible, and the productivity can reach up to 60-65K per day after the automatic assembly is adopted; the terminals are flat plate-type and high in strength, so that welding legs have low possibility of deformation; and a material convey belt does not need to be connected to the head parts of the terminals, so that the colloid damage after material folding is effectively avoided.

Description

A kind of modified form MicroUSB interface

Technical field

The utility model relates to a kind of usb interface, refers to a kind of firm Micro usb interface of realizing the automation assembling especially.

Background technology

USB is the abbreviation of Universal Serial BUS, Chinese implication " USB ", and it is an external bus standard, is used for being connected and communication of standard computer and external equipment; The plug and play of USB interface support equipment and hot plug function, and USB interface can be used for connecting nearly 127 kinds of peripheral hardwares, as mouse, modulator-demodulator, keyboard, portable hard drive, DVD etc., mobile phone, walkman etc., USB has become one of indispensable interface of current PC and a large amount of smart machines after releasing in 1996.

The USB version has three at present, and the first generation: USB1.0/1.1, peak transfer rate are 12Mbps, releases in 1996.The second generation: USB2.0, peak transfer rate be up to 480Mpbs, backward compatible USB1.0/1.1.The third generation: USB3.0, peak transfer rate can reach 5Gbps, backward compatible SB1.0/1.1/2.0.

Wherein, USB3.0 is a third generation USB connector, has increased by five signal pins on the basis of producing in original two generations, is used for the high-speed transfer of data.Thereby increased in the density of original size standard lower terminal.

Because of Micro USB belongs to the ultramicro minitype USB interface, its overall dimensions are very small and exquisite, are " forming terminal " Insert molding (embedding moulding) technology (referring to Fig. 1) so the Micro USB2.0/3.0 connector (containing horizontal and vertical type) that present connector industry is produced adopts a traditional group cube formula; Adopt this technology to have the drawback of following several aspects:

1. because of being Insert molding technology,, increased exploitation input expense greatly so need the extra vertical injection molding machine that increases as production equipment; And the vertical injection molding machine production capacity is extremely low, separate unit machine production capacity only be 5～6K per hour, increased cost of goods manufactured virtually.

2. the embedding vertical injection molding machine remakes jet modling and is wrapped to form Insert semi-finished product 5 after the terminal 4 employing pressing and bending moulding, excises unnecessary conveying strip 51 and 52 at last; This production process is very complicated, loaded down with trivial details, and the stress release effects very easily causes 53 distortion of product scolding tin pin when strip 51 is carried in excision, fracture easily make when carrying strip 52 colloid contact glue wall 54 impaired, come off.

In addition, existing product also exists shortcoming:

1, because the regulation Micro USB2.0/3.0-PCS of USB association boards solder Copper Foil width is 0.4mm, the bonder terminal interface width is 0.35～0.37mm; Because of terminal is flat,, conventional Micro USB2.0/3.0 (containing horizontal and vertical type) the bonder terminal scolding tin pin of existing industry width equals terminal material thickness 0.35～0.37mm so equaling termination contact face width degree; Stipulated that because of association as mentioned above pcb board scolding tin Copper Foil width is 0.4mm again, after terminal scolding tin pin places PCB scolding tin Copper Foil central authorities so, (0.4-0.37)/2 to (0.4-0.35)/2 are only arranged is 0.015mm to 0.025mm to the tin width of eating of both sides, therefore very easily cause tin pin rosin joint and empty tin, finally cause the connector loose contact or directly open circuit.

2, Micro USB2.0/3.0 connector mainly is made up of terminal, colloid, three functional parts of shell, and wherein terminal is used for transmission current and signal, and colloid is used for support terminals, shell then be used for fixing whole connector and realize with the butt end join shape to inserting; All adopt the sheet metal material to process at the existing industry of the shell of critical piece through pressing and bending, so the shell after the moulding can form bonding crack 11 at sheet metal material head and the tail position, this bonding crack is the weakest position of whole casing, meet external force collision or the incorrect use of user to plug to it when inserting, these shell bonding crack 11 outer very easily distortions are split, and cause connector function to lose efficacy.(referring to Fig. 4)

3, Micro USB2.0/3.0 (containing horizontal and vertical) connector mainly forms effect by terminal with the spigot shell fragment is in contact with one another when conducting is connected, referring to Fig. 5, but system users and terminal user all have discovery and reaction contact terminal head 45 that the spigot shell fragment is ejected at present, cause and to insert connector smoothly, finally lose connector function spigot.After its reason is industry Micro USB2.0/3.0 (containing horizontal and vertical) bonder terminal and colloid assembly, the colloid cavity is not fixed the termination contact head and parcel fully, the terminal head is when being subjected to the ejection of spigot shell fragment front, reach Yi Chaowei and stuck up, and then stop the stroke that the spigot shell fragment is continued insertion by the direction that colloid wraps up.

Summary of the invention

For addressing the above problem, a purpose of the present utility model is to provide a kind of " flat high strength terminal " and the colloid assembling structure, to avoid embedding problems such as production cost height that moulding process causes, quality instability.

Another purpose of the utility model is to provide a kind of " both sides press material structure " of terminal scolding tin pin, to increase the scolding tin space of leg both sides and PCB Copper Foil, guarantees product tin pin and firm the welding together of PCB Copper Foil.

Another purpose of the utility model is to provide a kind of " auxiliary welding stage structure " that is provided with in outer casing bottom, to solve the shell cracking problem that is produced when the use of user's misoperation is carried out slotting the connection to spigot to shell.

The another purpose of the utility model is to provide " the anti-structure of sticking up of flush type " of a kind of terminal head and the formation of colloid cavity, is wrapped up fully by colloid screens cavity by terminal head screens structure, makes it avoid sticking up the bad hidden danger of PIN to having a downwarp out.

For reaching above-mentioned purpose, the technical solution adopted in the utility model is:

A kind of modified form Micro USB interface, it comprises: a colloid that forms through ejection formation, this colloid have several cavitys that inserts for a terminal respectively, and described cavity has two main cavitys respectively; Several terminals, it is flat terminal, respectively this terminal is provided with termination contact crossbeam and terminal screens crossbeam; Wherein, respectively this terminal is in the parallel insertion colloid, and respectively this termination contact crossbeam inserts in one of them main cavity of this colloid, and this each terminal screens crossbeam inserts in another main cavity of this colloid.

Wherein:

This terminal screens crossbeam is provided with in addition with this colloid master cavity upper wall and forms the Ka Tai that interference structure fixes terminal.

Respectively this flat terminal is provided with the leg that welds with the PCB Copper Foil, and the one or both sides of described leg are provided with press material structure, and respectively this press material structure is for flattening tin pin side material in the space of the formed ccontaining scolding tin in tin pin one or both sides towards the thick direction of material.

Described tin pin is plane or curved surface in abutting connection with the side of press material structure.

It comprises a shell that adopts the sheet metal material to process through pressing and bending in addition, and this shell forms a bonding crack at the shell lower surface, and is respectively equipped with the auxiliary welding stage that at least one can form firm welding body with the Copper Foil on the pcb board in these bonding crack both sides.

Should can be square or round boss by auxiliary welding stage.

The head that described terminal gets contacting crossbeam extends a flush type screens structure, and correspondence position is provided with a screens cavity that is wrapped with making terminal head screens sound construction in the main cavity of ccontaining this contacting crossbeam of colloid.

The head that this screens cavity is a colloid and this head constitute to the extended projection of the contact-making surface of described terminal.

This projection and this terminal head screens structure interface are inclined-plane or arc surface or stepped.

Making of the present utility model can be adopted following steps:

1) elder generation is by the colloid of a described main cavity of tool of injection molding machine ejection formation;

2) prepare described terminal;

3) then terminal group is packed in the corresponding cavity of colloid,

4) relending pressing aid closes tool terminal is pressed into place, the termination contact crossbeam is inserted in one of them main colloid cavity, and the screens crossbeam of terminal inserts in another colloid cavity, and utilizes a Ka Tai and this colloid cavity upper wall formation interference structure to fix this terminal.

The utility model is by the beneficial effect that said structure and method reach as from the foregoing:

1, the utility model has overcome bad defectives of many qualities such as production cost height, complex process, product scolding tin pin that Insert Molding technology caused be yielding.By a kind of modified model assembling structure that the utility model proposes, promptly adopt the flat terminal of high strength directly to be assembled in the colloid, need not vertical injection molding machine therebetween and embed moulding, avoided embedding problems such as production cost height that moulding process causes, quality instability.

2, can increase the scolding tin space of tin pin and PCB Copper Foil both sides by the terminal press material structure, be that solder area increases, and the firm performance of scolding tin increases.

3, by the newly-increased auxiliary welding stage in shell bonding crack both sides, its purpose is auxiliary welding stage and pcb board body are welded together, and generation is out of shape or problem such as split when preventing that joint close is subjected to the external force distortion.

4, wrapped up fully by colloid screens cavity by terminal head screens structure, can't avoid sticking up the bad hidden danger of PIN to having a downwarp out.

Description of drawings

Fig. 1 adopts the schematic diagram that embeds moulding process for existing Micro USB2.0/3.0 connector;

Fig. 2 a is the assembling structure schematic perspective view of the utility model modified form Micro USB specific embodiment;

Fig. 2 b is the assembling structure decomposing schematic representation of the utility model modified form Micro USB specific embodiment;

Fig. 2 c is the assembling structure combination schematic diagram of the utility model modified form Micro USB specific embodiment;

Fig. 3 a, b are the schematic perspective view and the end view of terminal of the tool press material structure of the utility model one specific embodiment;

Fig. 4 is the shell stereogram of the auxiliary welding stage of tool of the utility model one specific embodiment;

Fig. 5 is the contact terminal head cross-sectional schematic of not wrapped up by colloid of existing usb connector;

Fig. 6 is that the colloid of the utility model one embodiment and the side subdivision of terminal are separated schematic diagram;

The partial schematic sectional view of the contact terminal head that Fig. 7 is wrapped up by colloid for the utility model one embodiment.

Embodiment

For above-mentioned and other purposes, feature and advantage of the present utility model can be become apparent, preferred embodiment cited below particularly, and conjunction with figs. are described in detail below.

In order to overcome production cost height, the complex process that Insert Molding technology is caused; Many qualities such as product scolding tin pin is yielding are bad.The utility model proposes a kind of modified model assembling structure, promptly adopt the flat terminal of high strength directly to be assembled in the colloid, need not vertical injection molding machine therebetween and embed moulding, avoided embedding problems such as production cost height that moulding process causes, quality instability.

Shown in Fig. 2 a, Fig. 2 b and Fig. 2 c, assembling structure for the utility model modified form Micro USB one specific embodiment, in the terminal 3 parallel insertion colloids 2, wherein colloid has 22 and 23 two main cavitys, and after the combination, termination contact crossbeam 33 inserts in the colloid cavity 23, terminal screens crossbeam 32 inserts in the colloid cavity 22, be preferably, can utilize card platform 34 is set forms interference structure with colloid cavity 22 upper walls and fix terminal 3, and the quantity of this card platform 34 be not defined as one;

When the utility model was implemented, colloid was then terminal manually to be assembled in the corresponding cavity of colloid earlier by injection molding machine (being preferably common horizontal injection press) ejection formation, relended pressing aid and closed tool terminal is pressed into place; This assembling mode is simple than Insert molding technology, and the production production capacity can reach 30～40K every day, and this assembling scheme makes and adopts automation to be assembled into possibility simultaneously, adopts automation assembling back production capacity can reach 60～65K every day; And terminal is flat, and intensity height, leg are not yielding.The terminal head need not to connect carries strip, so effectively avoided the colloid damage behind the folding material.

This process only needs by simple and easy riveting tool and can finish assembling, and can realize the automation assembling.Need not use vertical injection molding machine to embed moulding, improve the assembling production capacity greatly.

Shown in Fig. 3 a, b, be the schematic perspective view and the end view of the terminal of the tool press material structure of the utility model one specific embodiment; Be the performance of further connector, improve the scolding tin performance of connector scolding tin pin, guarantee good conduction of product and signal transmission performance at a high speed.The technical scheme that this embodiment of the present utility model provides is: the leg one or both sides set at flat terminal one end increase press material structure 35, being about to tin pin two layers of material flattens towards the thick direction of material, with in the space of tin pin one side (scheming not shown) or the formed ccontaining scolding tin in both sides, to increase the scolding tin space of leg both sides and PCB Copper Foil, guarantee product tin pin and firm the welding together of PCB Copper Foil.As shown in the figure, terminal press material structure 35 can increase the scolding tin space of tin pin and PCB Copper Foil both sides, and promptly solder area increases, and the firm performance of scolding tin increases.The thickness of tin pin is less than the thickness of terminal 3 at this moment, the thickness of this tin pin is preferable between 0.2 to 0.3, and in order to increase the area of this tin pin and scolding tin, the side of tin pin can be not limited to the plane, and plane that also can be cambered surface, waveform, tool groove or projection or the like can increase the shape of contact-making surface.

Referring to shown in Figure 4, assist the shell stereogram of welding stage for the tool of the utility model one specific embodiment, in present embodiment, there is this hidden danger of cracking problem in the utility model for effectively avoiding shell, the technical scheme that is adopted is: at newly-increased several the auxiliary welding stages 12 of shell lower surface bonding crack 11 peripheries, increase some welding Copper Foils on the pcb board surface newly with shell welding stage 12 correspondence positions simultaneously, make shell welding stage 12 and pcb board form firm welding body, it is by the newly-increased auxiliary welding stage 12 in shell bonding crack 11 both sides, its purpose is auxiliary welding stage 12 and pcb board body are welded together, and prevents that joint close 11 from producing distortion when being subjected to the external force distortion or problem such as split.Therefore, in present embodiment, this shell bonding crack 11 can't twist the fixing next of pcb board and welding stage structure 12, has thoroughly solved the shell cracking problem that is produced when the use of user's misoperation is carried out slotting the connection to spigot to shell.

In addition, stick up the serious bad hidden danger that for effectively solving the terminal head, as Fig. 6, shown in Figure 7, the utility model further improves the structure of terminal and plastic cement, it is that the terminal head is extended flush type screens structure 31, simultaneously draw out a screens cavity 21 again, terminal head screens structure 31 is wrapped in the colloid screens cavity 21 securely, can't stick up at colloid cavity correspondence position.Wherein, what the bottom of this screens cavity 21 formed for the termination of this colloid 2 extends internally one colludes the shape projection, and its upper surface can be screens structure 31 corresponding inclined-planes, curved surface or the cascaded surface with the head of this terminal 3, to form firm clamping structure.

As shown in Figure 5: the bottom direction of the conventional contact terminal head 45 of industry by the protection of colloid parcel, when chance is docked with it the spigot shell fragment, does not very easily stick up to the position of not wrapped up by colloid.

Thereby shown in Fig. 6,7, the utility model is wrapped up by colloid screens cavity 21 fully by terminal head screens structure 31 in present embodiment, can't avoid sticking up the bad hidden danger of PIN to having a downwarp out.

What need statement is that the technical characterictic of the foregoing description is not limited in the specific embodiment and implements, in order to address the above problem, in those skilled in the art's scope as can be known, but each technical characterictic combination in any satisfies the usb connector of various requirement with formation.

The above, it only is preferred embodiment of the present utility model, be not that the utility model is done any pro forma restriction, though the utility model discloses as above with preferred embodiment, yet be not in order to limit the utility model, any those skilled in the art, in not breaking away from the technical solutions of the utility model scope, when the technology contents that can utilize above-mentioned announcement is made a little change or is modified to the equivalent embodiment of equivalent variations, in every case be not break away from the technical solutions of the utility model content, according to technical spirit of the present utility model to any simple modification that above embodiment did, equivalent variations and modification all still belong in the scope of technical solutions of the utility model.

Claims

1. modified form Micro USB interface is characterized in that it comprises:

A colloid that forms through ejection formation, this colloid have several cavitys that inserts for a terminal respectively, and described cavity has two main cavitys respectively;

Several terminals, it is flat terminal, respectively this terminal is provided with termination contact crossbeam and terminal screens crossbeam;

Wherein, respectively this terminal is in the parallel insertion colloid, and respectively this termination contact crossbeam inserts in one of them main cavity of this colloid, and this each terminal screens crossbeam inserts in another main cavity of this colloid.

2. interface according to claim 1 is characterized in that, this terminal screens crossbeam is provided with in addition with this colloid master cavity upper wall and forms the Ka Tai that interference structure fixes terminal.

3. interface according to claim 1 and 2, it is characterized in that, respectively this flat terminal is provided with the leg that welds with the PCB Copper Foil, the one or both sides of described leg are provided with press material structure, and respectively this press material structure is for flattening tin pin side material in the space of the formed ccontaining scolding tin in tin pin one or both sides towards the thick direction of material.

4. interface according to claim 3 is characterized in that, described tin pin is plane or curved surface in abutting connection with the side of press material structure.

5. interface according to claim 1 and 2, it is characterized in that, it comprises a shell that adopts the sheet metal material to process through pressing and bending in addition, this shell forms a bonding crack at the shell lower surface, and is respectively equipped with the auxiliary welding stage that at least one can form firm welding body with the Copper Foil on the pcb board in these bonding crack both sides.

6. interface according to claim 5 is characterized in that, this auxiliary welding stage is square or round boss.

7. interface according to claim 1 and 2, it is characterized in that, the head that described terminal gets contacting crossbeam extends a flush type screens structure, and correspondence position is provided with a screens cavity that is wrapped with making terminal head screens sound construction in the main cavity of ccontaining this contacting crossbeam of colloid.

8. interface according to claim 7 is characterized in that, the head that this screens cavity is a colloid and this head constitute to the extended projection of the contact-making surface of described terminal.

9. interface according to claim 8 is characterized in that, this projection and this terminal head screens structure interface are inclined-plane or arc surface or stepped.