CN201970383U - Improved soft ferrite molding processing die - Google Patents

Improved soft ferrite molding processing die Download PDF

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Publication number
CN201970383U
CN201970383U CN2010206805533U CN201020680553U CN201970383U CN 201970383 U CN201970383 U CN 201970383U CN 2010206805533 U CN2010206805533 U CN 2010206805533U CN 201020680553 U CN201020680553 U CN 201020680553U CN 201970383 U CN201970383 U CN 201970383U
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CN
China
Prior art keywords
product
die
copper wire
die cavity
soft ferrite
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN2010206805533U
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Chinese (zh)
Inventor
柏玉新
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Changxing Baicheng Electronics Co., Ltd.
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柏玉新
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 柏玉新 filed Critical 柏玉新
Priority to CN2010206805533U priority Critical patent/CN201970383U/en
Application granted granted Critical
Publication of CN201970383U publication Critical patent/CN201970383U/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Abstract

The utility model discloses an improved soft ferrite molding processing die which comprises an upper die and a lower die. An arc chamfer I is arranged on a lower end opening of a die cavity of the upper die, and an arc chamfer II is arranged on an upper end opening of a die cavity of the lower die. Due to the design of adding the chamfers, during processing, the product wall is prevented from being scratched by a copper wire when the copper wire penetrates through the product, and the copper wire is protected from breakage or damage, so that the phenomena that the circuit board of the product leaks power, is short-circuiting or breaks down due to poor voltage endurance property are eliminated, and the service life of the whole circuit board is prolonged. When the product is at a high temperature, the product has a shrinkage ratio, the contact area becomes bigger, and the product is easily connected with other products. After the design of adding the chamfers is adopted, the end surface area of the product is reduced, and the connecting phenomena of the product during sintering are basically avoided.

Description

The soft-magnetic ferrite forming processing mold improves
Technical field
The utility model relates to the soft-magnetic ferrite forming processing mold.
Background technology
Soft magnetic ferrite has characteristics such as permeability height, high resistivity, low-loss under high frequency, use ferrite and make devices such as various inductors, transformer, coil, choke coil, be widely used in communication apparatus, radio and television, computer and external equipment thereof and industrial automation equipment and the electronic instrument, novel energy-conserving lighting particularly, the ring-like product of soft magnetic ferrite is the heart of energy-saving lighting lamp, plays leading role.Existing product is not owing to have chamfering during die sinking, causes the protective layer of finished product disconnected ply-yarn drill easily or scratch line in process, shine easily into leaking electricity in the circuit board, and short circuit or withstand voltage breakdown inadequately causes whole wiring board to be scrapped.
The utility model content
Problem to be solved in the utility model just provides the soft-magnetic ferrite forming processing mold and improves, simple in structure, easy to make, saved process time, reduce raw-material waste, when having reduced the blank sintering owing to shrinking the inconsistent product disjunctor phenomenon that causes, contact area is more little, and the disjunctor phenomenon is few more, cuts easily.
In order to solve the problems of the technologies described above, the utility model adopts following technical scheme: the soft-magnetic ferrite forming processing mold improves, comprise upper die and lower die, it is characterized in that: oral area is provided with circular arc chamfering I in the die cavity lower end of patrix, and oral area is provided with circular arc chamfering II in the die cavity upper end of counterdie.
Further, be provided with circular arc chamfering III between the die cavity bottom face of described counterdie and the sidewall.
Further, described upper die and lower die are provided with one group at least.
After adopting technique scheme, the utlity model has following advantage: increase chamfer design, adding when avoiding man-hour copper cash to pass product and the product wall is swiped, cause copper cash to disconnect or damage, thereby avoid electric leakage on the plate of On-line Product road, short circuit or withstand voltage breakdown inadequately, the service life of improving whole wiring board; There is shrinkage ratio in product through high temperature the time, contact area is big more, the easy disjunctor of product, and after the increase chamfer design, the product end surface area reduces, and has avoided the disjunctor phenomenon of product when sintering substantially.
Description of drawings
The utility model is described in further detail below in conjunction with accompanying drawing:
Fig. 1 is the structural representation of a kind of embodiment of the utility model;
Fig. 2 is the structural representation that three groups of upper die and lower die are set.
The specific embodiment
The structural representation of a kind of embodiment of the utility model as shown in Figure 1, the soft-magnetic ferrite forming processing mold improves, comprise patrix 1 and counterdie 2, oral area is provided with circular arc chamfering I11 in the die cavity lower end of patrix, oral area is provided with circular arc chamfering II21 in the die cavity of counterdie upper end, is provided with circular arc chamfering III22 in addition between the die cavity bottom face of counterdie and sidewall.
Described upper die and lower die are provided with one group at least, and in the foregoing description, upper die and lower die are provided with one group.As shown in Figure 2, upper die and lower die are provided with three groups, because the group number of upper die and lower die increases too much, may cause product quality wayward, and therefore more the and inconvenient processing that goes wrong preferably is provided with the group number of upper die and lower die in three groups.
After increasing chamfer design like this, add man-hour, swiping with the product wall when avoiding copper cash to pass product, causing the copper cash disconnection or damage, thereby avoiding electric leakage on the plate of On-line Product road, short circuit or withstand voltage breakdown inadequately, the service life of improving whole wiring board; When sintering, owing to after the heating of product process high temperature, have shrinkage ratio, contact area is big more, the easy disjunctor of product, and after the increase chamfer design, the product end surface area reduces, and has avoided the disjunctor phenomenon of product when sintering substantially.
Except that above preferred embodiment, the utility model also has other embodiment, those skilled in the art can make various changes and distortion according to the utility model, only otherwise break away from spirit of the present utility model, all should belong to the defined scope of the utility model claims.

Claims (3)

1. the soft-magnetic ferrite forming processing mold improves, and comprises patrix (1) and counterdie (2), and it is characterized in that: oral area is provided with circular arc chamfering I (11) in the die cavity lower end of patrix, and oral area is provided with circular arc chamfering II (21) in the die cavity upper end of counterdie.
2. soft-magnetic ferrite forming processing mold according to claim 1 improves, and it is characterized in that: be provided with circular arc chamfering III (22) between the die cavity bottom face of described counterdie and the sidewall.
3. soft-magnetic ferrite forming processing mold according to claim 1 improves, and it is characterized in that: described upper die and lower die are provided with one group at least.
CN2010206805533U 2010-12-24 2010-12-24 Improved soft ferrite molding processing die Expired - Fee Related CN201970383U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN2010206805533U CN201970383U (en) 2010-12-24 2010-12-24 Improved soft ferrite molding processing die

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN2010206805533U CN201970383U (en) 2010-12-24 2010-12-24 Improved soft ferrite molding processing die

Publications (1)

Publication Number Publication Date
CN201970383U true CN201970383U (en) 2011-09-14

Family

ID=44575488

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2010206805533U Expired - Fee Related CN201970383U (en) 2010-12-24 2010-12-24 Improved soft ferrite molding processing die

Country Status (1)

Country Link
CN (1) CN201970383U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106365642A (en) * 2016-08-31 2017-02-01 长兴柏成电子有限公司 Production process of power type magnetic substrate

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106365642A (en) * 2016-08-31 2017-02-01 长兴柏成电子有限公司 Production process of power type magnetic substrate
CN106365642B (en) * 2016-08-31 2019-01-22 长兴柏成电子有限公司 A kind of power-type magnetics substrate production technology

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Legal Events

Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
ASS Succession or assignment of patent right

Owner name: CHANGXING BAICHENG ELECTRONICS CO., LTD.

Free format text: FORMER OWNER: BAI YUXIN

Effective date: 20120629

C41 Transfer of patent application or patent right or utility model
TR01 Transfer of patent right

Effective date of registration: 20120629

Address after: 313119 Zhejiang city of Huzhou province Changxing County Huai Gang Du cast Development Zone

Patentee after: Changxing Baicheng Electronics Co., Ltd.

Address before: 313119 Zhejiang city of Huzhou province Changxing County Huai ditch Changxin Development Zone Bai Gang cast into electronic Co. Ltd.

Patentee before: Bai Yuxin

CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20110914

Termination date: 20141224

EXPY Termination of patent right or utility model