CN201965156U - IC test socket - Google Patents

IC test socket Download PDF

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Publication number
CN201965156U
CN201965156U CN2011200057054U CN201120005705U CN201965156U CN 201965156 U CN201965156 U CN 201965156U CN 2011200057054 U CN2011200057054 U CN 2011200057054U CN 201120005705 U CN201120005705 U CN 201120005705U CN 201965156 U CN201965156 U CN 201965156U
Authority
CN
China
Prior art keywords
substrate
upper cover
thimble
utility
model
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN2011200057054U
Other languages
Chinese (zh)
Inventor
彭玉元
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
DONGGUAN HUAHUI ELECTRONIC TECHNOLOGY CO., LTD.
Original Assignee
彭玉元
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 彭玉元 filed Critical 彭玉元
Priority to CN2011200057054U priority Critical patent/CN201965156U/en
Application granted granted Critical
Publication of CN201965156U publication Critical patent/CN201965156U/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Abstract

The utility model relates to the technical field of electronic product test apparatus, and particularly relates to an IC test socket. The IC test socket comprises a substrate and an upper cover, wherein the substrate is hinged with the upper cover; a positioning frame is arranged on the surface of the substrate; a centre is arranged in the positioning frame; a pressing plate is arranged on the surface of the upper cover; a fixing device is arranged on the upper cover corresponding to the front part of the substrate; the centre has two elastic surfaces; and the pressing plate is fixed on the surface of the upper cover through an adjustable bolt. The IC test socket can replace various positioning frames according to the requirement, and can achieve compensation adjustment according to the thickness and the height of IC to be tested, thereby achieving tests of various IC, greatly improving test efficiency, and reducing test cost.

Description

A kind of IC test bench
Technical field
The utility model relates to electronic product testing appliance technical field, particularly a kind of IC test bench.
Background technology
Along with the development of hyundai electronics infotech, the use of integrated circuit (IC) more and more widely, thing followed testing requirement is also more and more.Conventional IC test bench needs special die sinking customized, and can only if thickness or the model size of IC to be tested change, need again to prepare corresponding test bench at a kind of encapsulation, and versatility is poor, and it is expensive to waste time and energy.
The utility model content
At the problems referred to above, the utility model provides the IC test bench of a kind of highly versatile, effect practicality.
The utility model is for reaching this purpose, the technical scheme of being taked is: a kind of IC test bench, comprise substrate and loam cake, described substrate and loam cake are hinged, described substrate surface is provided with posting, and in posting, being provided with thimble, the described cap surface of going up is provided with pressing plate, loam cake and the anterior corresponding stationary installation that is provided with of substrate.
According to the utility model of above structure, described thimble is the elasticity thimble.
According to the utility model of above structure, described thimble is two-sided thimble.
According to the utility model of above structure, described pressing plate is by adjusting bolt in last cap surface.
According to the utility model of above structure, described stationary installation is to be located at the grab of loam cake front portion and the bayonet socket of substrate front portion.
The utility model beneficial effect is:
1, the utility model adopts the posting structure, and this posting can be changed according to the difference of tested object, thereby realizes various different IC are tested;
2, include many double end thimbles in the utility model posting, it has two-way load, and is good in order to guarantee contact under the situation of protection tested object;
3, the utility model pressing plate can carry out the height adjusting by adjusting bolt, to realize just compensating adjustment according to the thickness of tested object.
Description of drawings
Fig. 1 is the utility model open mode synoptic diagram.
Fig. 2 is the utility model closure state vertical view.
Fig. 3 is the utility model thimble structure cut-open view.
Embodiment
Be elaborated as follows below in conjunction with drawings and Examples to the utility model structure and principle of work:
As shown in Figures 1 and 2, the utility model test bench mainly comprises substrate 1 and loam cake 2, and the two is hinged by devices such as bearing or hinges 6, and in loam cake 2 and the substrate 1 anterior corresponding stationary installation that is provided with, the two is connected to become integral body.The described stationary installation of present embodiment is to be located at the grab 8 of loam cake 2 front portions and the bayonet socket 9 of substrate 1 front portion.Described substrate 1 surface is provided with posting 3, and this posting is fixed in substrate 1 surface with screw 10, can change different postings according to different tested objects.Be provided with thimble 5 in the posting 3, spring 51 is set in the thimble 5, and establish top 52 respectively, as shown in Figure 3 at thimble 5 two ends.As two-sided elasticity thimble, make it have two-way load on thimble 5, good in order under the situation of protection tested object, to guarantee contact.
Described loam cake 2 surfaces are provided with pressing plate 4, and pressing plate 4 is fixed in loam cake 2 surfaces by adjusting bolt 7, during test, can carry out the height adjusting by adjusting bolt 7, to realize just compensating adjustment according to the thickness of tested object.
During test, the posting of correspondence is fixed on the substrate, IC to be tested is put in the posting, and adjust bolt to regulate the height of pressing plate, IC to be tested is well contacted and to be unlikely to pressure again excessive with two-sided thimble according to the thickness adjusted of IC to be tested.Two-sided thimble bottom contacts with pcb board, and pcb board is connected to the stitch of test bench simultaneously, stitch is plugged in can treats test I C on the testing apparatus and detect.(pcb board and stitch are not shown).When needing to change test I C, open grab, change posting, regulate the adjustment bolt and get final product, convenient and swift, improve detection efficiency greatly, and also reduced the detection cost.
Above content be in conjunction with concrete preferred implementation to further describing that the utility model is done, can not assert that concrete enforcement of the present utility model is confined to these explanations.For the utility model person of an ordinary skill in the technical field, under the prerequisite that does not break away from the utility model design, can also make some simple deduction or replace, all should be considered as belonging to protection domain of the present utility model.

Claims (5)

1. IC test bench, comprise substrate and loam cake, it is characterized in that, described substrate (1) is hinged with loam cake (2), described substrate (1) surface is provided with posting (3), and in posting (3), being provided with thimble (5), described loam cake (2) surface is provided with pressing plate (4), loam cake (2) and the anterior corresponding stationary installation that is provided with of substrate (1).
2. IC test bench according to claim 1 is characterized in that, described thimble (5) is the elasticity thimble.
3. IC test bench according to claim 1 and 2 is characterized in that, described thimble (5) is two-sided thimble.
4. IC test bench according to claim 1 is characterized in that, described pressing plate (4) is fixed in loam cake (2) surface by adjusting bolt (7).
5. IC test bench according to claim 1 is characterized in that, described stationary installation is for being located at anterior grab (8) of loam cake (2) and the anterior bayonet socket (9) of substrate (1).
CN2011200057054U 2011-01-10 2011-01-10 IC test socket Expired - Fee Related CN201965156U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN2011200057054U CN201965156U (en) 2011-01-10 2011-01-10 IC test socket

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN2011200057054U CN201965156U (en) 2011-01-10 2011-01-10 IC test socket

Publications (1)

Publication Number Publication Date
CN201965156U true CN201965156U (en) 2011-09-07

Family

ID=44527702

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2011200057054U Expired - Fee Related CN201965156U (en) 2011-01-10 2011-01-10 IC test socket

Country Status (1)

Country Link
CN (1) CN201965156U (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104251922A (en) * 2013-06-27 2014-12-31 深圳市江波龙电子有限公司 Limiting frame, chip testing device and chip testing method
CN104330722A (en) * 2014-11-07 2015-02-04 东莞华贝电子科技有限公司 Flat pressing type multipurpose modularized testing device
CN106093487A (en) * 2016-08-22 2016-11-09 景旺电子科技(龙川)有限公司 A kind of Hi-pot test tool
CN110441674A (en) * 2019-09-16 2019-11-12 北京无线电测量研究所 A kind of BGA circuit board testing device
CN110596503A (en) * 2019-10-23 2019-12-20 天津市英贝特航天科技有限公司 DIP type connector veneer test fixture

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104251922A (en) * 2013-06-27 2014-12-31 深圳市江波龙电子有限公司 Limiting frame, chip testing device and chip testing method
CN104251922B (en) * 2013-06-27 2017-05-03 深圳市江波龙电子有限公司 Limiting frame, chip testing device and chip testing method
CN104330722A (en) * 2014-11-07 2015-02-04 东莞华贝电子科技有限公司 Flat pressing type multipurpose modularized testing device
CN106093487A (en) * 2016-08-22 2016-11-09 景旺电子科技(龙川)有限公司 A kind of Hi-pot test tool
CN110441674A (en) * 2019-09-16 2019-11-12 北京无线电测量研究所 A kind of BGA circuit board testing device
CN110596503A (en) * 2019-10-23 2019-12-20 天津市英贝特航天科技有限公司 DIP type connector veneer test fixture

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Legal Events

Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
ASS Succession or assignment of patent right

Owner name: DONGGUAN HUAHUI ELECTRONIC TECHNOLOGY CO., LTD.

Free format text: FORMER OWNER: PENG YUYUAN

Effective date: 20150414

C41 Transfer of patent application or patent right or utility model
COR Change of bibliographic data

Free format text: CORRECT: ADDRESS; FROM: 518000 SHENZHEN, GUANGDONG PROVINCE TO: 523710 DONGGUAN, GUANGDONG PROVINCE

TR01 Transfer of patent right

Effective date of registration: 20150414

Address after: 523710 No. 10 Qin Lin Road, Tangxia Town, Guangdong, Dongguan

Patentee after: DONGGUAN HUAHUI ELECTRONIC TECHNOLOGY CO., LTD.

Address before: 518000 Guangdong city of Shenzhen province Futian District Huaqiang North CLP 10000 Electronic City 5037A

Patentee before: Peng Yuyuan

DD01 Delivery of document by public notice

Addressee: Peng Yuyuan

Document name: Notification of Passing Examination on Formalities

CF01 Termination of patent right due to non-payment of annual fee
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20110907

Termination date: 20180110