CN201947533U - Thin-film circuit conducting device - Google Patents
Thin-film circuit conducting device Download PDFInfo
- Publication number
- CN201947533U CN201947533U CN 201120000532 CN201120000532U CN201947533U CN 201947533 U CN201947533 U CN 201947533U CN 201120000532 CN201120000532 CN 201120000532 CN 201120000532 U CN201120000532 U CN 201120000532U CN 201947533 U CN201947533 U CN 201947533U
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- CN
- China
- Prior art keywords
- contact
- film
- circuit
- circuit board
- protuberance
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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Abstract
The utility model relates to a thin-film circuit conducting device which comprises a first circuit board, a second circuit board and a partition board. The first circuit board comprises a first thin film and a first circuit, wherein the first circuit is arranged on the first thin film and provided with at least one first connection point; the second circuit board comprises a second thin film and a second circuit, wherein the second circuit is arranged on the second thin film and provided with at least one second connection point which corresponds to the first connection point; the partition board is arranged between the first circuit board and the second circuit board and provided with a through hole at the position corresponding to the first connection point and the second connection point; the first thin film or the second thin film is provided with at least one raised part; and the raised end of the raised part bulges from the through hole to make the first connection point and the second connection point mutually contact and connect. Therefore, the electrical conducting function is strengthened, and the cost of components is saved.
Description
Technical field
The utility model relates to a kind of thin film circuit coupling device, particularly relates to the thin film circuit coupling device that a kind of reinforcement is electrically conducted function and saves the assembly cost.
Background technology
With reference to the prior art of TaiWan, China patent M342716 number as can be known, the electric installation of keyboard comprises a upper film circuit board, film circuit board once, and a insulating spacer between upper film circuit board and following film circuit board.For the upper film circuit board can be electrically connected with following film circuit board, this upper film circuit board has connecting portion on, and film circuit board has a position and the corresponding connecting portion down of last connecting portion down, and insulating spacer has the perforation of corresponding two connecting portions in a position, utilize conducting resinl will go up connecting portion again and bind, make upper film circuit board and following film circuit board can transmit message mutually with following connecting portion.
Yet the stickiness of conducting resinl can die down along with the service time of electric installation, and it is separated from one another with following connecting portion meeting make to go up connecting portion, caused electric installation the problem that bad connection etc. can't normally use to occur.
In order to overcome the disappearance of aforementioned bad connection, the last circuit board of the film circuit board that another kind is known has most and goes up connecting portions, following circuit board has most the position following connecting portions corresponding with last connecting portion, dividing plate has the perforation of connecting portion on most the position correspondences, utilizing conducting resinl will go up connecting portion again binds with following connecting portion, even if wherein on one connecting portion and following coupling part from, also having other connecting portion can keep supplying circuit board is electrically connected with following circuit board, but increase along with service time, last connecting portion still may all separate with following connecting portion, so still, can allow, following circuit board has the problem that can't electrically conduct, and installs coupling assembling in addition additional and also increased the assembly cost.
Summary of the invention
The thin film circuit coupling device that provides a kind of reinforcement to be electrically conducted function and save the assembly cost is provided the purpose of this utility model.
The utility model comprises a first circuit board, a second circuit board and a space bar; This first circuit board comprises that a first film and is arranged on first circuit on this first film, and this first circuit has at least one first contact; This second circuit board has one second film and and is arranged on second circuit on this second film, and this second circuit has at least one second contact corresponding with this first contact; This space bar between this first circuit board and this second circuit board and to should first contact and this second contact place be provided with a perforation; This first film or this second film have at least one protuberance, and the jag of this protuberance is stretched on this perforation and makes this first contact and this second contact be in contact with one another conducting.
Preferably, this the first film is positioned at this space bar top and this second film is positioned at this space bar below, this the first film has first protuberance that is provided with this first contact, and the jag of this first protuberance is stretched on this perforation downwards and makes this first contact and this second contact be in contact with one another conducting.Preferably, this second film is provided with this second contact and second abutting part of dimpling downwards to should first protuberance having one.
Preferably, this the first film be positioned at this space bar top and and this second film be positioned at this space bar below, this second film has second protuberance that is provided with this second contact, and the jag of this second protuberance projects upwards and is stretched on this perforation and makes this first contact and this second contact be in contact with one another conducting.Preferably, this first film is provided with this first contact and first abutting part of dimpling upwards to should second protuberance having one.
Preferably, described jag has surface of breaking or the surface of not breaking.
Preferably, the utility model also comprises a conductive adhesive layer that this first contact and this second contact are electrically connected.
The beneficial effect of the utility model thin film circuit coupling device is: utilize the first film or second film to have at least one protuberance, and the jag of protuberance is stretched on perforation makes first contact and second contact be in contact with one another conducting, not only strengthen being electrically conducted function, and can save the assembly cost.
Description of drawings
Fig. 1 is an exploded view, and the preferred embodiment of the utility model thin film circuit coupling device is described;
Fig. 2 is a part sectioned view, and first preferred embodiment of the present utility model is described;
Fig. 3 is a part sectioned view, and second preferred embodiment of the present utility model is described;
Fig. 4 is a part sectioned view, and the 3rd preferred embodiment of the present utility model is described;
Fig. 5 is a part sectioned view, and the 4th preferred embodiment of the present utility model is described.
Embodiment
Below in conjunction with drawings and Examples the utility model is elaborated.
Consult Fig. 1, among the embodiment of the present utility model, thin film circuit coupling device 100 comprises the space bar 3 of a first circuit board 1, a second circuit board 2 and an insulation.
First circuit board 1 comprises that first circuit, 12, the first circuit 12 that a first film 11 and is arranged on the first film 11 have at least one first contact 13, has seven first contacts 13 as first circuit 12 of present embodiment.
Consult Fig. 2, in first preferred embodiment of the present utility model, the first film 11 is positioned at plate body 31 tops, interval and second film 21 is positioned at plate body 31 belows at interval, the first film 11 has first protuberance 110 that is provided with first contact 13, and the jag of first protuberance 110 is stretched on perforation 301 downwards and makes first contact 13 and second contact 23 be in contact with one another conducting; Just the elastic force by first protuberance 110 allows first contact 13 and second contact 23 be in contact with one another conducting.
Consult Fig. 3, in second preferred embodiment of the present utility model, its overall structure comprises the first film 11, interval plate body 31, second film 21, perforation 301, first contact 13, second contact 23 and first protuberance 110, roughly the same with first preferred embodiment, difference is in and also has one in: second film, 21 corresponding first protuberances 110 and be provided with second contact 23 and second abutting part 220 of dimpling downwards; Just allow first contact 13 and second contact 23 be in contact with one another conducting to the down spring and second abutting part 220 by first protuberance 110.
Consult Fig. 4, in the 3rd preferred embodiment of the present utility model, the first film 11 is positioned at space bar 31 tops and second film 21 is positioned at space bar 31 belows, second film 21 has second protuberance 210 that is provided with second contact 23, and the jag of second protuberance 210 upwards is stretched on perforation 301 and makes first contact 13 and second contact 23 be in contact with one another conducting.
Consult Fig. 5, in the 4th preferred embodiment of the present utility model, its overall structure comprises the first film 11, interval plate body 31, second film 21, perforation 301, first contact 13, second contact 23 and second protuberance 210, roughly the same with the 3rd preferred embodiment, difference be in: preferably, the first film 11 corresponding second protuberances 210 have one and are provided with first contact 13 and first abutting part 120 of dimpling upwards.
Among aforementioned each embodiment, the jag that comprises first protuberance 110, second abutting part 220, second protuberance 210 or first abutting part 120 can be to be made into to have surface of breaking or the surface of not breaking.
In addition, among aforementioned each embodiment, for adding the heavily conducting effect, thin film circuit coupling device 100 also can comprise a conductive adhesive layer that first contact 13 and second contact 23 are electrically connected.
In sum, the effect of the utility model thin film circuit coupling device 100 is: utilize the first film 11 or second film 21 to have at least one protuberance, and the jag of protuberance is stretched on perforation 301 makes first contact 13 and second contact 23 be in contact with one another conducting, not only strengthen and be electrically conducted function, and can save the assembly cost, so can reach the purpose of this utility model really.
Claims (7)
1. a thin film circuit coupling device comprises a first circuit board, a second circuit board and a space bar; This first circuit board comprises that a first film and is arranged on first circuit on this first film, and this first circuit has at least one first contact; This second circuit board has one second film and and is arranged on second circuit on this second film, and this second circuit has at least one second contact corresponding with this first contact; This space bar between this first circuit board and this second circuit board and to should first contact and this second contact place be provided with a perforation; It is characterized in that: this first film or this second film have at least one protuberance, and the jag of this protuberance is stretched on this perforation and makes this first contact and this second contact be in contact with one another conducting.
2. thin film circuit coupling device according to claim 1, it is characterized in that: this first film is positioned at this space bar top and this second film is positioned at this space bar below, this the first film has first protuberance that is provided with this first contact, and the jag of this first protuberance is stretched on this perforation downwards and makes this first contact and this second contact be in contact with one another conducting.
3. thin film circuit coupling device according to claim 2 is characterized in that: this second film is provided with this second contact and second abutting part of dimpling downwards to should first protuberance having one.
4. thin film circuit coupling device according to claim 1, it is characterized in that: this first film is positioned at this space bar top and this second film is positioned at this space bar below, this second film has second protuberance that is provided with this second contact, and the jag of this second protuberance upwards is stretched on this perforation and makes this first contact and this second contact be in contact with one another conducting.
5. thin film circuit coupling device according to claim 4 is characterized in that: this first film is provided with this first contact and first abutting part of dimpling upwards to should second protuberance having one.
6. according to the described thin film circuit coupling device of arbitrary claim in the claim 1 to 5, it is characterized in that: described jag has surface of breaking or the surface of not breaking.
7. thin film circuit coupling device according to claim 6 is characterized in that: also comprise a conductive adhesive layer that this first contact and this second contact are electrically connected.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201120000532 CN201947533U (en) | 2011-01-04 | 2011-01-04 | Thin-film circuit conducting device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201120000532 CN201947533U (en) | 2011-01-04 | 2011-01-04 | Thin-film circuit conducting device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201947533U true CN201947533U (en) | 2011-08-24 |
Family
ID=44474867
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201120000532 Expired - Lifetime CN201947533U (en) | 2011-01-04 | 2011-01-04 | Thin-film circuit conducting device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201947533U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103582280A (en) * | 2012-07-20 | 2014-02-12 | 鸿富锦精密工业（深圳）有限公司 | Circuit board device |
-
2011
- 2011-01-04 CN CN 201120000532 patent/CN201947533U/en not_active Expired - Lifetime
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103582280A (en) * | 2012-07-20 | 2014-02-12 | 鸿富锦精密工业（深圳）有限公司 | Circuit board device |
| CN103582280B (en) * | 2012-07-20 | 2017-10-03 | 鸿富锦精密工业（深圳）有限公司 | Circuit board arrangement |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term |
Granted publication date: 20110824 |
|
| CX01 | Expiry of patent term |