CN201940898U - Planetary template grinder for wafer - Google Patents
Planetary template grinder for wafer Download PDFInfo
- Publication number
- CN201940898U CN201940898U CN2010206181648U CN201020618164U CN201940898U CN 201940898 U CN201940898 U CN 201940898U CN 2010206181648 U CN2010206181648 U CN 2010206181648U CN 201020618164 U CN201020618164 U CN 201020618164U CN 201940898 U CN201940898 U CN 201940898U
- Authority
- CN
- China
- Prior art keywords
- planetary
- ring gear
- wafer
- template
- grinder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Abstract
A planetary template grinder for wafer comprises a base and a worktable. The utility model is characterized in that: the worktable is internally provided with a ring gear; the ring gear is internally provided with a lower millstone and an upper millstone; the upper millstone is provided with filling holes of grinding lubricant; and the center of the ring gear is provided with a central gear which is driven by a motor. According to the planetary template grinder for wafer, the planetary templates are placed between a central gear and the ring gear in use. The planetary templates perform star revolution and axial rotation between the central gear and the ring gear. The lower millstone and the upper millstone grind the surface of the planetary templates. Therefore, the planetary template grinder for wafer has the following characteristics: simple structure and convenient operation.
Description
Technical field
The utility model relates to plant equipment, a kind of specifically wafer wandering star template sharpening machine.
Background technology
The thickness requirement on machining accuracy of wafer is very high, generally all obtain by grinding, because wafer is a flakelet structure, wafer is placed in the hole of wandering star template surface, control the grinding thickness of wafer with the thickness of wandering star template, after the wandering star template was used a period of time, wandering star template itself was worn and torn, can influence the grinding precision of wafer, need carry out reconditioning the wandering star template.
The utility model content
The purpose of this utility model is at the problems referred to above, proposes a kind of simple in structure, easy to operate wandering star template sharpening machine.
The purpose of this utility model is achieved in that a kind of wafer wandering star template sharpening machine of the present utility model, it comprises support and workbench, it is characterized in that being provided with in the workbench ring gear, lower millstone and upper millstone are arranged in the ring gear, the hand-hole that lapping liquid is arranged on the upper millstone, there is the central gear of driven by motor at the ring gear center.
Wafer wandering star template sharpening machine of the present utility model, during use, the wandering star template is placed between central gear and the ring gear, and the wandering star template is revolution of intercropping star and rotation in central gear and ring gear, and lower millstone and upper millstone carry out reconditioning to the wandering star template surface.Therefore, the utlity model has simple in structure, convenience operation.
Description of drawings
Fig. 1 is the structural representation of wafer wandering star template sharpening machine of the present utility model.
The specific embodiment
The utility model is described in further detail by embodiment below in conjunction with accompanying drawing:
As shown in Figure 1, a kind of wafer wandering star template sharpening machine of the present utility model, it comprises support 1 and workbench 2, it is characterized in that being provided with in the workbench 2 ring gear 3, lower millstone 5 and upper millstone 7 are arranged in the ring gear 3, the hand-hole 8 that lapping liquid is arranged on the upper millstone 7, there is the central gear 6 of driven by motor at ring gear 3 centers.During use, wandering star template 4 is placed between central gear 6 and the ring gear 3, wandering star template 4 is revolution of intercropping star and rotation in central gear 6 and ring gear 3, and reconditioning is carried out on 7 pairs of wandering star nog plate 4 surfaces of lower millstone 5 and upper millstone.
Claims (1)
1. wafer wandering star template sharpening machine, it comprises support (1) and workbench (2), it is characterized in that being provided with in the workbench (2) ring gear (3), lower millstone (5) and upper millstone (7) are arranged in the ring gear (3), the hand-hole (8) that lapping liquid is arranged on the upper millstone (7), there is the central gear (6) of driven by motor at ring gear (3) center.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010206181648U CN201940898U (en) | 2010-11-23 | 2010-11-23 | Planetary template grinder for wafer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010206181648U CN201940898U (en) | 2010-11-23 | 2010-11-23 | Planetary template grinder for wafer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201940898U true CN201940898U (en) | 2011-08-24 |
Family
ID=44468249
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010206181648U Expired - Fee Related CN201940898U (en) | 2010-11-23 | 2010-11-23 | Planetary template grinder for wafer |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201940898U (en) |
-
2010
- 2010-11-23 CN CN2010206181648U patent/CN201940898U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20110824 Termination date: 20121123 |