CN201927458U - Bandage colligation mechanism for semiconductor of transformer iron core - Google Patents
Bandage colligation mechanism for semiconductor of transformer iron core Download PDFInfo
- Publication number
- CN201927458U CN201927458U CN2010206601451U CN201020660145U CN201927458U CN 201927458 U CN201927458 U CN 201927458U CN 2010206601451 U CN2010206601451 U CN 2010206601451U CN 201020660145 U CN201020660145 U CN 201020660145U CN 201927458 U CN201927458 U CN 201927458U
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- CN
- China
- Prior art keywords
- bandage
- semiconductor
- iron core
- polyester
- colligation
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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Abstract
The utility model discloses a bandage colligation mechanism for a semiconductor of a transformer iron core. The bandage colligation structure is characterized in that a plurality of polyester bandages which are strapped on the surface of an iron core limb are comprised, wherein a semiconductor bandage layer is strapped on the surface of the iron core limb and the outer surface of the polyester bandages to sealed the polyester bandages between the surface of the iron core limb and the semiconductor bandage layer. The semiconductor bandage colligation structure has the advantages that the whole mechanical strength and the electric property of the iron core can be satisfied, the production cycle of the transformer can be shortened, and the use ratio of the vapour phase drying can be effectively increased.
Description
Technical field
The utility model relates to a kind of semiconductor bandage binding structure of big capacity oil-filled transformer iron core.
Background technology
Iron core for superhigh pressure, big capacity (500kV and above, 200MVA and more than) AC and DC core type transformer generally adopts and carry out colligation with the semiconductor bandage on core limb, is used to shield wedge angle unshakable in one's determination.Can guarantee simultaneously bulk strength unshakable in one's determination, on core limb, iron core is fixed near circular, core limb is exerted pressure with bandage.
Need during with the colligation of semiconductor bandage earlier with steel wire rope etc. core limb is fastening, treat that core limb is holded up after, carry out the colligation of semiconductor bandage again.Earlier the semiconductor bandage is twined to 1/3rd of specific thickness during colligation, the fastener of the core limb periphery that comes loose then is bind to 1/2nd of specific thickness with the semiconductor bandage again, carries out the curing of semiconductor bandage again, and last colligation is to given size.Adopt this kind bandage to carry out colligation, mechanical strength unshakable in one's determination and electric property are good.But, need take the visual plant-vapour phase drying oven in the transformer production process, and the vapour phase drying oven all is one of bottleneck in the transformer production process all the time owing to need carry out the curing of semiconductor bandage.Therefore cause transformer core long assembly period with semiconductor bandage colligation meeting, and influence the utilance of vapour phase drying device.
Therefore, how to design a kind of needs that both satisfied mechanical strength unshakable in one's determination and electric property, can shorten the strap configurations novel unshakable in one's determination in transformer production cycle again, just become the key of high-power transformer design unshakable in one's determination.
Summary of the invention
The purpose of this utility model provides a kind of needs that both satisfied mechanical strength unshakable in one's determination and electric property, can shorten the strap configurations novel unshakable in one's determination in transformer production cycle again,
For reaching above purpose, the utility model takes following technical scheme to be achieved:
A kind of semiconductor bandage binding structure of transformer core, it is characterized in that, be included in the multiple tracks polyester bandage of core limb surface colligation, on the core limb surface and polyester bandage outer surface be banded with semiconductor bandage layer, multiple tracks polyester bandage is enclosed between core limb surface and the semiconductor bandage layer.
In the such scheme, described semiconductor bandage layer is formed from the colligation from top to bottom of core limb surface by the bandage of coating semiconductor glue.Distance between the per pass polyester bandage is between 150-250mm.
The utility model has the advantages that: the polyester bandage as the frock bandage, is cooperated with the semiconductor bandage, need not to take the vapour phase drying oven in the process of binding, effectively improve the transformer production cycle and guarantee transformer overall mechanical properties and electric property.
Description of drawings
Fig. 1 is a schematic diagram of the present utility model.Among the figure: 1, core limb; 2, polyester bandage; 3, semiconductor bandage layer.
Embodiment
As shown in Figure 1, after the core limb lamination is finished, by the pattern requirement, in closed assembly platform unshakable in one's determination upper edge perpendicular to several polyester bandage 2 of stem direction colligation, distance between the per pass polyester bandage is after treating between the 150-250mm that 2 colligations of polyester bandage are finished, core limb 1 is holded up, carried out the colligation of semiconductor bandage again.The centre need not advanced stove and solidify.During colligation, use the semiconductor bandage layer 3 of the bandage of coating semiconductor glue, multiple tracks polyester bandage 2 is enclosed between core limb surface and the semiconductor bandage layer 3 from core limb 1 surface colligation from top to bottom formation specific thickness.Wherein, semi-conductor adhesive can adopt the product in the patent documentation " a kind of semi-conductor adhesive and preparation method thereof " (application number 200610105339.3).
Claims (3)
1. the semiconductor bandage binding structure of a transformer core, it is characterized in that, be included in the multiple tracks polyester bandage of core limb surface colligation, on the core limb surface and polyester bandage outer surface be banded with semiconductor bandage layer, multiple tracks polyester bandage is enclosed between core limb surface and the semiconductor bandage layer.
2. the semiconductor bandage binding structure of transformer core as claimed in claim 1 is characterized in that, described semiconductor bandage layer is formed from the colligation from top to bottom of core limb surface by the bandage of coating semiconductor glue.
3. the semiconductor bandage binding structure of transformer core as claimed in claim 1 is characterized in that, the distance between the per pass polyester bandage is between 150-250mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010206601451U CN201927458U (en) | 2010-12-15 | 2010-12-15 | Bandage colligation mechanism for semiconductor of transformer iron core |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010206601451U CN201927458U (en) | 2010-12-15 | 2010-12-15 | Bandage colligation mechanism for semiconductor of transformer iron core |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201927458U true CN201927458U (en) | 2011-08-10 |
Family
ID=44431295
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010206601451U Expired - Lifetime CN201927458U (en) | 2010-12-15 | 2010-12-15 | Bandage colligation mechanism for semiconductor of transformer iron core |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201927458U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112457642A (en) * | 2020-11-19 | 2021-03-09 | 马继 | Special semi-conductive weftless tape for transformer binding and preparation method thereof |
-
2010
- 2010-12-15 CN CN2010206601451U patent/CN201927458U/en not_active Expired - Lifetime
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112457642A (en) * | 2020-11-19 | 2021-03-09 | 马继 | Special semi-conductive weftless tape for transformer binding and preparation method thereof |
| CN112457642B (en) * | 2020-11-19 | 2022-04-12 | 马继 | Special semi-conductive weftless tape for transformer binding and preparation method thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20110810 |