CN201926014U - Semiconductor ground heating hot water apparatus - Google Patents
Semiconductor ground heating hot water apparatus Download PDFInfo
- Publication number
- CN201926014U CN201926014U CN201120010808XU CN201120010808U CN201926014U CN 201926014 U CN201926014 U CN 201926014U CN 201120010808X U CN201120010808X U CN 201120010808XU CN 201120010808 U CN201120010808 U CN 201120010808U CN 201926014 U CN201926014 U CN 201926014U
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- Prior art keywords
- water
- floor heating
- hot water
- storage tank
- heating hot
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Abstract
The utility model relates to a semiconductor ground heating hot water apparatus, which comprises a water storage tank, a water pump, a heat source apparatus and a water distributor, wherein the water pump is connected with the water outlet of the water storage tank; the heat source apparatus is used for heating water; and the water distributor is used for branching hot water. The semiconductor ground heating hot water apparatus is characterized in that the heat source apparatus comprises a body made of a positive temperature coefficient (PTC) heating core and an aluminum profile; a longitudinal channel for the water to flow is arranged in the body; a longitudinal through hole which is arranged in parallel with the longitudinal channel is also arranged in the body; the PTC heating core is arranged in the longitudinal through hole; one end of the longitudinal channel is connected with the outlet of the water pump; and the other end of the longitudinal channel is connected with the inlet of the water distributor. Compared with the prior art, the utility model has the advantages that a semiconductor liquid heater is adopted to serve as a heat source to heat ground heating circulating water, and thus, the ground heating hot water apparatus has a simpler structure, is safer to use and is energy-saving.
Description
Technical field
The utility model relates to a kind of semiconductor floor heating hot water apparatus.
Background technology
The floor heating hot-water heating system of Chu Xianing mainly is made up of water knockout drum, water collector, water pump, water supply tank and electric boiler in the market, and has following defective:
1, the heat power supply device in the existing floor heating hot-water heating system is an electric boiler, so have that cost of investment height, energy consumption are big, maintenance is frequent, a defective such as safety in utilization difference and service life are short;
2, water knockout drum in the existing floor heating hot-water heating system and the exhaust steam valve displacement on the water collector are limited, so the air in the water route is difficult to emptying, and often occur feeling suffocated and heat can not the normal supply phenomenon, and every system also needs to carry out artificial exhaust when restarting;
3. electric boiler, water pump, water knockout drum and water collector in the existing floor heating hot-water heating system are installed in the water passage circulation system respectively, thus when system construction, must construct by the professional, and the engineering complexity.
The utility model content
First technical problem to be solved in the utility model is to provide a kind of simple in structure, safe in utilization, energy-conservation semiconductor floor heating hot water apparatus at above-mentioned prior art.
Second technical problem to be solved in the utility model provides a kind of energy-conservation, semiconductor floor heating hot water apparatus that can also effectively solve the phenomenon of feeling suffocated in original floor heating hot-water heating system water knockout drum and the water collector loop not only simple in structure, safe in utilization.
The 3rd technical problem to be solved in the utility model be for a kind of not only simple in structure, safe in utilization energy-conservation, can also effectively solve the phenomenon of feeling suffocated in original floor heating hot-water heating system water knockout drum and the water collector loop, simultaneously simple and convenient, reliable semiconductor floor heating hot water apparatus be installed.
The utility model solves the technical scheme that above-mentioned first technical problem adopted: this semiconductor floor heating hot water apparatus, comprise heat power supply device that storage tank, the water pump that is connected with the storage tank delivery port, feedwater are heated and the water knockout drum that hot water is carried out shunt, it is characterized in that: described heat power supply device comprises a body of being made by PTC heat generating core and type aluminium, has the through-flow vertical passage of a water supply in this body, also be provided with the longitudinal hole that be arranged in parallel with described vertical passage in the described body, described PTC heat generating core is set in the described longitudinal hole; One end of this vertical passage links to each other with the outlet of described water pump, and the other end of this vertical passage links to each other with the inlet of water knockout drum.
As improvement, described longitudinal hole is provided with two or more, is symmetricly set on the both sides of described vertical passage or all around respectively.
Improve, described body integral body is column structure again, and after described PTC heat generating core was arranged in the described longitudinal hole, two ends adopted fluid sealant and plastic closure that it is sealed.
The utility model solves above-mentioned second technical scheme that technical problem adopted: on the semiconductor floor heating hot water apparatus basis of said structure, described water knockout drum is provided with N road delivery port, this N road delivery port links to each other with N road floor heating pipe water inlet pipe respectively, one upper lateral part of described storage tank is provided with N recirculated water water inlet, these N recirculated water water inlets are connected with N road floor heating pipe outlet pipe respectively, and wherein N is the natural number more than or equal to 1.
The utility model solves above-mentioned the 3rd technical scheme that technical problem adopted: on the semiconductor floor heating hot water apparatus basis of said structure, the delivery port place, N road on the described water knockout drum is linked to each other with N road floor heating pipe water inlet pipe by the pneumatic joint socket; N the recirculated water water inlet that described storage tank one upper lateral part is provided with also links to each other with N road floor heating pipe outlet pipe by the pneumatic joint socket.
Also be provided with a sealed electric appliance control box that is used to start water pump and heat power supply device on the storage tank, carry out heat insulation with heat-barrier material between sealing formula electric appliance control box and the storage tank.
Compared with prior art, advantage of the present utility model is:
1, adopt PTC semi-conductor electricity thermal element as thermal source, floor heating recirculated water heated, make floor heating hot water apparatus structure simple more, use safer and energy-conservation;
2, at a storage tank side upper design N circulating water intake, this N circulating water intake is connected with the floor heating pipe outlet pipe, be connected with water pump at delivery port of storage tank bottom design, this design efficiently solves the phenomenon and change the complicated procedures of exhaust again season of feeling suffocated in existing floor heating hot-water heating system water knockout drum and the water collector loop;
3, outlet is connected with the floor heating pipe water inlet pipe to water knockout drum to adopt pneumatic joint, and adopts pneumatic joint that the floor heating pipe outlet pipe is connected with the storage tank water inlet, makes to install simply, conveniently, reliably, and the house user is fitting operation voluntarily also.
Description of drawings
Fig. 1 is the structure diagram of semiconductor floor heating hot water apparatus among the utility model embodiment.
Fig. 2 is the perspective view of heat power supply device among the utility model embodiment;
Fig. 3 is the cutaway view of heat power supply device among the utility model embodiment.
The specific embodiment
Embodiment describes in further detail the utility model below in conjunction with accompanying drawing.
Semiconductor floor heating hot water apparatus as shown in Figure 1, it comprises storage tank 1, the bottom of storage tank is provided with delivery port, this delivery port is connected with a water pump 2 by pneumatic joint, the outlet of water pump 2 is connected with the import of heat power supply device 3, the outlet of heat power supply device 3 links to each other with the inlet of water knockout drum 4, the N road delivery port of water knockout drum 4 links to each other with N road floor heating pipe water inlet pipe respectively by pneumatic joint, one upper lateral part of storage tank 1 is provided with N recirculated water water inlet, these N recirculated water water inlets are connected with N road floor heating pipe outlet pipe respectively by pneumatic joint, and wherein N is the natural number more than or equal to 1.
In the present embodiment, described heat power supply device 3 comprises that an integral body is the body of being made by PTC heat generating core and type aluminium 31 of column, has the through-flow vertical passage 32 of a water supply in this body 31, also be provided with two longitudinal holes 33 that be arranged in parallel with described vertical passage 32 in the described body 31, these two longitudinal holes 33 are symmetricly set on the both sides of described vertical passage 32 respectively, in each longitudinal hole 33 PTC heat generating core 34 is set all, after the PTC heat generating core was arranged in the longitudinal hole 33, two ends adopted fluid sealant and plastic closure that it is sealed; One end of this vertical passage 32 links to each other with the outlet of described water pump 2, and the other end of this vertical passage 32 links to each other with the inlet of water knockout drum 4.
In addition, storage tank among the utility model embodiment bottom also is fixed with a sealed electric appliance control box 5 that is used to start water pump and heat power supply device, carries out heat insulation with heat-barrier material 6 between sealing formula electric appliance control box and the storage tank.
Claims (6)
1. semiconductor floor heating hot water apparatus, comprise heat power supply device that storage tank, the water pump that is connected with the storage tank delivery port, feedwater are heated and the water knockout drum that hot water is carried out shunt, it is characterized in that: described heat power supply device comprises a body of being made by PTC heat generating core and type aluminium, has the through-flow vertical passage of a water supply in this body, also be provided with the longitudinal hole that be arranged in parallel with described vertical passage in the described body, described PTC heat generating core is set in the described longitudinal hole; One end of this vertical passage links to each other with the outlet of described water pump, and the other end of this vertical passage links to each other with the inlet of water knockout drum.
2. floor heating hot water apparatus according to claim 1 is characterized in that: described longitudinal hole is provided with two or more, is symmetricly set on the both sides of described vertical passage or all around respectively.
3. floor heating hot water apparatus according to claim 1 and 2 is characterized in that: described body integral body is column structure, and after described PTC heat generating core was arranged in the described longitudinal hole, two ends adopted fluid sealant and plastic closure that it is sealed.
4. floor heating hot water apparatus according to claim 1 and 2, it is characterized in that: described water knockout drum has N road delivery port, this N road delivery port links to each other with N road floor heating pipe water inlet pipe respectively, one upper lateral part of described storage tank is provided with N recirculated water water inlet, these N recirculated water water inlets are connected with N road floor heating pipe outlet pipe respectively, and wherein N is the natural number more than or equal to 1.
5. floor heating hot water apparatus according to claim 4 is characterized in that: the delivery port place, N road on the described water knockout drum links to each other with N road floor heating pipe water inlet pipe by the pneumatic joint socket; N the recirculated water water inlet that described storage tank one upper lateral part is provided with also links to each other with N road floor heating pipe outlet pipe by the pneumatic joint socket.
6. require 1 described semiconductor floor heating hot water apparatus according to power, it is characterized in that: also be provided with a sealed electric appliance control box that is used to start water pump and heat power supply device on the described storage tank, carry out heat insulation with heat-barrier material between sealing formula electric appliance control box and the storage tank.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201120010808XU CN201926014U (en) | 2011-01-12 | 2011-01-12 | Semiconductor ground heating hot water apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201120010808XU CN201926014U (en) | 2011-01-12 | 2011-01-12 | Semiconductor ground heating hot water apparatus |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201926014U true CN201926014U (en) | 2011-08-10 |
Family
ID=44429861
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201120010808XU Expired - Fee Related CN201926014U (en) | 2011-01-12 | 2011-01-12 | Semiconductor ground heating hot water apparatus |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201926014U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102042635A (en) * | 2011-01-12 | 2011-05-04 | 熊欣 | Semiconductor floor water heating device |
-
2011
- 2011-01-12 CN CN201120010808XU patent/CN201926014U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102042635A (en) * | 2011-01-12 | 2011-05-04 | 熊欣 | Semiconductor floor water heating device |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20110810 Termination date: 20130112 |