CN201913540U - Wafer grinding and positioning structure - Google Patents
Wafer grinding and positioning structure Download PDFInfo
- Publication number
- CN201913540U CN201913540U CN2010206854065U CN201020685406U CN201913540U CN 201913540 U CN201913540 U CN 201913540U CN 2010206854065 U CN2010206854065 U CN 2010206854065U CN 201020685406 U CN201020685406 U CN 201020685406U CN 201913540 U CN201913540 U CN 201913540U
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- China
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- ring body
- ring
- combining unit
- protuberance
- matsurface
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Abstract
A wafer grinding and positioning structure comprises a first ring and a second ring. A plurality of fixing holes are arranged on one surface of the first ring; a combining unit is annularly arranged on the other surface of the first ring; a rough surface is arranged on the combining unit; the second ring combined with the first ring is made of materials different from those of the first ring; a plurality of drainage channels are arranged on one surface of the second ring; and an assembling unit annularly arranged on the other surface of the second ring is in butt joint with the combining unit and abutted to the rough surface. Therefore, the first ring and the second ring can be combined with each other by the aid of the combining unit, the rough surface and the assembling unit, and the effects of stable assembly, close combination and enhancement of structural strength can be achieved.
Description
Technical field
The utility model relates to a kind of grinding wafer location structure, especially refer to that a kind of first ring body and second ring body of making utilizes combining unit, matsurface and winding unit to mutually combine, and reach firm assembling, combine closely and increase the structure of structural strength effect.
Background technology
General semiconductor crystal wafer is when grinding, be to utilize fixed form that semiconductor crystal wafer is located, wafer being connected to one afterwards has on the tray of abrasive cloth again, and then drive template by driving mechanism and produce rotation and grind, and can effectively locate to improve the generation quality of chip for making wafer, usually need make the axis of rotation of fixed form must be corresponding mutually with crystal circle center, and in rotary course, the center of this wafer must keep accurate in locating, but when carrying out grinding wafer, but can't make crystal circle center's strong fix with aforementioned existing mode.
Therefore, just there is relevant dealer to develop a kind of locating ring structure, and this locating ring is the ring bodies institute be combined into by metal and nonmetal two kinds of unlike materials, when utilization the time can allow metal ring body and required driving mechanism positioning combination, but not the internal diameter of metal ring body then can cooperate wafer external diameter to be ground, so, and just can be when grinding wafer, make the center of this wafer must keep accurate in locating, use and improve above-mentioned disappearance.
Yet, because the metal ring body and the nonmetal ring-type body of this locating ring are to carry out be combined into by the mode of sticking together or being spirally connected, therefore, regular meeting is after using a period of time, influence because of long-term pressurization, rotation and hydraulic fluid, produce gap or loosening between metal ring body and the nonmetal ring-type body and make, cause structural strength and stability variation, then can cause metal ring body and nonmetal ring-type body that the situation of disengaging is arranged what is more; Therefore, general existing grinding wafer locating ring is can't be realistic required during use.
Summary of the invention
Technical problem to be solved in the utility model is: at above-mentioned the deficiencies in the prior art, a kind of grinding wafer location structure is provided, can make first ring body and second ring body utilize combining unit, matsurface and winding unit to mutually combine, and reach firm assembling, combine closely and increase the effect of structural strength.
In order to solve the problems of the technologies described above, the technical scheme that the utility model adopted is: a kind of grinding wafer location structure, comprise first ring body, reach second ring body, be characterized in: the one side of described first ring body is provided with several fixing holes, be equipped with combining unit on the another side, have matsurface on this combining unit; This second ring body combines with first ring body, and with first ring body be unlike material, and the one side of this second ring body is provided with several rhones, be equipped with on the another side dock with combining unit and with matsurface against the winding unit.
In an embodiment of the present utility model, this first ring body is made by the metal material with preferable rigidity.
In an embodiment of the present utility model, this combining unit includes the protuberance of being located at centre at least and lays respectively at the depressed part of protuberance both sides, and described matsurface is located on the end face of protuberance.
In an embodiment of the present utility model, this second ring body is made by the nonmetallic materials of high abrasion and chemicals-resistant corrosion.
In an embodiment of the present utility model, this winding unit includes the depressed part of being located at centre at least and lays respectively at the protuberance of depressed part both sides, and further be provided with on the bottom surface of this depressed part with the set matsurface of combining unit against another matsurface.
In an embodiment of the present utility model, be respectively equipped with a breach on the end face of each protuberance.
So, utilize combining unit, matsurface and winding unit to mutually combine by first ring body and second ring body, and reach firm assembling, combine closely and increase the effect of structural strength.
Description of drawings:
Fig. 1 is a schematic appearance of the present utility model.
Fig. 2 is a decomposing schematic representation of the present utility model.
Fig. 3 is a profile status decomposing schematic representation of the present utility model.
Fig. 4 is the profile status schematic diagram after the utility model combination.
Label declaration:
First ring body, 1 fixing hole 11
Combining unit 12 matsurfaces 121
Second ring body, 2 rhones 21
The specific embodiment:
See also Fig. 1 to shown in Figure 4, be respectively schematic appearance of the present utility model, decomposing schematic representation of the present utility model, profile status decomposing schematic representation of the present utility model and the utility model in conjunction with after the profile status schematic diagram.As shown in the figure: the utility model is a kind of grinding wafer location structure, and it comprises one first ring body 1 at least and one second ring body 2 constitutes.
The above-mentioned metal material of first ring body 1 of carrying for having preferable rigidity, its one side is provided with several fixing holes 11, be equipped with combining unit 12 on the another side, and has matsurface 121 on this combining unit 12, wherein this combining unit 12 includes the protuberance 122 of being located at centre at least and lays respectively at the depressed part 123 of protuberance 122 both sides, and described matsurface 121 is located on the end face of protuberance 122.
This second ring body 2 combines with first ring body 1, and with first ring body 1 be unlike material, and the one side of this second ring body 2 is provided with several rhones 21, be equipped with on the another side dock with combining unit 12 and with matsurface 121 against winding unit 22, wherein this winding unit 22 includes the depressed part 221 of being located at centre at least, and lay respectively at the protuberance 222 of depressed part 221 both sides, and each protuberance 222 is slightly larger than the set depressed part 123 of combining unit 12, and be respectively equipped with a breach 223 on the end face of each protuberance 222, this second ring body 2 is the nonmetallic materials of high abrasion and chemicals-resistant corrosion in addition.In this way, constitute a brand-new grinding wafer location structure by said structure.
When first ring body 1 combines with second ring body 2, the combining unit 12 of first ring body 1 can be docked mutually with the winding unit 22 of second ring body 2, and allow the protuberance 122 of this combining unit 12 and each depressed part 123 respectively with the depressed part 221 and the 222 corresponding combinations of each protuberance of winding unit 22, and this matsurface 121 is resisted against on the bottom surface of depressed part 221 carry out firm interlock, and because each protuberance 222 is slightly larger than depressed part 123, therefore, when each protuberance 222 combines with depressed part 123, strut outward again after can utilizing breach 223 that protuberance 222 is slightly contracted toward in, it is urgent in the sidewall of depressed part 123 to use the both sides that make each protuberance 222, so, can make first ring body 1 and second ring body 2 utilize combining unit 12, matsurface 121 and winding unit 22 mutually combine, and reach firm assembling, the effect of combining closely and increasing structural strength; And the utility model more can according to required on the bottom surface of this depressed part 221, further be provided with combining unit 12 set matsurfaces 121 against another matsurface (not shown), and make it can more firmly carry out interlock.
During utilization, can allow first ring body 1 cooperate fixation kit and required driving mechanism (not shown) positioning combination with each fixing hole 11 on its one side, the internal diameter of this second ring body 2 then can cooperate wafer external diameter to be ground, so that being sheathed on the outer rim of wafer, second ring body 2 positions, grind and drive first ring body 1 and second ring body 2 simultaneously, and the hydraulic fluid when grinding is derived by each rhone 21 on second ring body, 2 one sides by the rotation of driving mechanism.
In sum, the utility model grinding wafer location structure can effectively improve the various shortcoming of prior art, can make first ring body and second ring body utilize combining unit, matsurface and winding unit to mutually combine, and reach firm assembling, combine closely and increase the effect of structural strength; And then make the utility model can produce more progressive, more practical, more meet the consumer use institute must, really met the important document of utility application, patent application is proposed in accordance with the law.
Claims (6)
1. a grinding wafer location structure comprises first ring body, reaches second ring body, and it is characterized in that: the one side of described first ring body is provided with several fixing holes, is equipped with combining unit on the another side, has matsurface on this combining unit; This second ring body combines with first ring body, and with first ring body be unlike material, and the one side of this second ring body is provided with several rhones, be equipped with on the another side dock with combining unit and with matsurface against the winding unit.
2. grinding wafer location structure as claimed in claim 1 is characterized in that: described first ring body is made by the metal material with preferable rigidity.
3. grinding wafer location structure as claimed in claim 1 is characterized in that: described combining unit includes the protuberance of being located at centre at least and lays respectively at the depressed part of protuberance both sides, and described matsurface is located on the end face of protuberance.
4. grinding wafer location structure as claimed in claim 1 is characterized in that: described second ring body is made by the nonmetallic materials of high abrasion and chemicals-resistant corrosion.
5. grinding wafer location structure as claimed in claim 1, it is characterized in that: described winding unit includes the depressed part of being located at centre at least and lays respectively at the protuberance of depressed part both sides, and further be provided with on the bottom surface of this depressed part with the set matsurface of combining unit against another matsurface.
6. grinding wafer location structure as claimed in claim 5 is characterized in that: be respectively equipped with a breach on the end face of described each protuberance.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010206854065U CN201913540U (en) | 2010-12-29 | 2010-12-29 | Wafer grinding and positioning structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010206854065U CN201913540U (en) | 2010-12-29 | 2010-12-29 | Wafer grinding and positioning structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201913540U true CN201913540U (en) | 2011-08-03 |
Family
ID=44413356
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010206854065U Expired - Lifetime CN201913540U (en) | 2010-12-29 | 2010-12-29 | Wafer grinding and positioning structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201913540U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110948383A (en) * | 2019-11-27 | 2020-04-03 | 英展新能源科技(昆山)有限公司 | Carrier system for machining sheet type pivot cover body |
-
2010
- 2010-12-29 CN CN2010206854065U patent/CN201913540U/en not_active Expired - Lifetime
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110948383A (en) * | 2019-11-27 | 2020-04-03 | 英展新能源科技(昆山)有限公司 | Carrier system for machining sheet type pivot cover body |
| CN110948383B (en) * | 2019-11-27 | 2021-05-25 | 英展新能源科技(昆山)有限公司 | Carrier system for machining sheet type pivot cover body |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20110803 |