CN201910441U

CN201910441U - LED packaging structure

Info

Publication number: CN201910441U
Application number: CN201020568601XU
Authority: CN
Inventors: 樊邦扬
Original assignee: NEO-NEON LED LIGHTING INTERNATIONAL Ltd
Current assignee: NEO-NEON LED LIGHTING INTERNATIONAL Ltd
Priority date: 2010-10-18
Filing date: 2010-10-18
Publication date: 2011-07-27
Anticipated expiration: 2020-10-18

Abstract

The utility model discloses an LED packaging structure, which comprises an LED chip, a support and a packaging piece. The support is used for carrying the LED chip, the packaging piece covers the LED chip and a part of the support, at least two light guiding pieces which are integrally formed with the packaging piece are further formed at the top end of the packaging piece, and the light guiding pieces are disposed in a light emergent direction of the LED chip. Since the light guiding pieces which are integrally formed with the packaging piece are formed at the top end of the packaging piece and disposed in the light emergent direction of the LED chip, and after an LED is lit, light emitted by the LED chip can produce bright spots at the top ends of the light guiding pieces. The LED packaging structure has the advantages of simple structure, excellent decorative effect and the like.

Description

A kind of LED encapsulating structure

[technical field]

The utility model relates to field of semiconductor illumination, relates in particular to a kind of LED encapsulating structure.

[background technology]

Light-emitting diode (LED) as the 4th generation light source, have advantages such as energy-saving and environmental protection, volume is little, the life-span is long, be widely used in indicator light, display panel, LCD at present, and in all kinds of electric equipment productss such as ordinary luminaire, decorating lighting lamp.

Light-emitting diode is widely used in the place of various illuminations as novel light source, because light-emitting diode need encapsulate and could make things convenient for use, therefore in the formation of encapsulation, there is multiple variation to change the light effects of light-emitting diode or optically focused or astigmatism etc.In a lot of encapsulation schemes of optically focused, be representative with the round end packaged LED, the shape of convex lens is formed on the top of its packing colloid, makes light-ray condensing and allows the people feel that bulb is brighter, be used for illumination or when decorating effect better.In a lot of encapsulation schemes of astigmatism, top with packing colloid is that concave inward structure is representative, comprise LED wafer 8, the packing colloid 4 at support 2a, the 2b of carrying LED wafer 8 and

package support

2a, 2b top, be provided with a concave inward structure 6 on the top of packing colloid 4, as shown in Figure 9, light can present hot spot at the concave inward structure inner surface on packing colloid top when LED lights, the concave inward structure of packing colloid plays the effect of concavees lens, light scatter is gone out play good decoration effect.But there is following defective in said structure, and LED can only present a bright spot when lighting, and will seem that when above-mentioned LED is applied to the decorative lamp field decorative effect dullness too, above-mentioned LED can not satisfy the growing demand in present decorative lamp field.

[utility model content]

The utility model technical issues that need to address provide a kind of simple in structure, two bright spot LED that decorative effect is good.

In order to solve the problems of the technologies described above, the technical solution adopted in the utility model is: a kind of LED encapsulating structure, comprise the LED wafer, the support of carrying LED wafer and the packaging body that coats LED wafer and part support, it is characterized in that, at least also be formed with two and the integrated light conductor of described packaging body on the top of packaging body, described light conductor is on the light direction of described LED wafer.

The utility model beneficial effect compared with prior art is: owing at least also be formed with two and the integrated light conductor of packaging body on the top of packaging body, light conductor is arranged on the light direction of LED wafer, after LED lights, the light that the LED wafer sends can present a bright spot on each light conductor, the purpose that light conductor is set on the top of described packaging body is in order to make a LEDs wafer present the effect of at least two bright spots.The utlity model has advantage simple in structure, that decorative effect is good.

Preferably, the top of described light conductor is provided with concave inward structure.

Preferably, the V-shaped or circular arc in the longitudinal section of described concave inward structure.

Preferably, the top of described light conductor is provided with bulge-structure.

Preferably, the longitudinal section of described bulge-structure is circular arc.

Preferably, described light conductor is disposed on the light direction of described LED wafer.

Preferably, the spacing between the described light conductor is 0.5～2mm.

Preferably, the spacing between the described light conductor is 1mm.

[description of drawings]

Below in conjunction with accompanying drawing the utility model is described in further detail.

Fig. 1 is the structural representation of two light conductors of the utility model.

Fig. 2 is the structural representation of first kind of embodiment of the utility model.

Fig. 3 is the bright dipping schematic diagram of first kind of embodiment shown in Figure 2.

Fig. 4 is the structural representation of second kind of embodiment of the utility model.

Fig. 5 is the bright dipping schematic diagram of second kind of embodiment shown in Figure 4.

Fig. 6 is the structural representation of the third embodiment of the utility model.

Fig. 7 is the bright dipping schematic diagram of the third embodiment shown in Figure 6.

Fig. 8 is the structural representation of three light conductors of the utility model.

Fig. 9 is the encapsulating structure schematic diagram of background technology tradition LED.

[embodiment]

With reference to accompanying drawing 1, shown in Figure 2, the utility model comprises LED wafer 30, the support 20a of carrying

LED wafer

30,20b and coating LED wafer 30 and part support 20a, the packaging body 10 of 20b, be formed with and packaging body 10 integrated light conductor 11a on the top of

packaging body

10,11b, described

light conductor

11a, 11b is on the light direction of described LED wafer 30, described

light conductor

11a, 11b is arranged side by side the top at packaging body 10, on the top of described packaging body 10 light conductor 11a is set, the purpose of 11b is in order to make a LEDs wafer 30 present the effect of two bright spots, at light conductor 11a, the top correspondence of 11b is provided with concave inward structure 12a, 12b.The longitudinal section of described concave

inward structure

12a, 12b is V-shaped, concave inward structure 12a, the 12b of " V " shape is equivalent to concavees lens, after LED lights, the bottom of " V " shape can correspondence present two

bright spot

13a, 13b in

light conductor

11a, 11b, described

bright spot

13a, 13b are virtual focus, as shown in Figure 3; Another embodiment is with reference to shown in Figure 4, the longitudinal section of described concave

inward structure

12a, 12b is circular arc, concave inward structure 12a, the 12b of circular arc is equivalent to concavees lens, after LED lights, the bottom of circular arc can correspondence present two

bright spot

14a, 14b in

light conductor

11a, 11b, described

bright spot

14a, 14b are virtual focus, as shown in Figure 5.The third embodiment as shown in Figure 6, top at described

light conductor

11a, 11b is provided with bulge-

structure

16a, 16b, the longitudinal section of described bulge-

structure

16a, 16b is circular arc, bulge-structure 16a, the 16b of circular arc is equivalent to convex lens, after LED lights, the top of circular arc can correspondence present two

bright spot

15a, 15b in

light conductor

11a, 11b, and described two

bright spot

15a, 15b are real focus, as shown in Figure 7.Above-mentioned

light conductor

11a, 11b are disposed on the light direction of described LED wafer 30, promptly on the top of described packaging body 10.Spacing L between described light conductor 11a, the 11b is 0.5～2mm, preferred embodiment, and the spacing L between described light conductor 11a, the 11b is 1mm, promptly the spacing L between light conductor 11a and the light conductor 11b is 1mm, shown in Fig. 2,3,4,5,6.Above-mentioned

light conductor

11a, 11b also can be close on the light direction that together is arranged on described LED wafer 30 side by side, promptly on the top of described packaging body 10.

With reference to shown in Figure 8, being arranged on packaging body 10 tops has three

light conductor

11a, 11b, 11c.Also the light conductor that is arranged on packaging body 10 tops can be arranged to a plurality ofly, show in the accompanying drawing that each light conductor can be close on the light direction that together is arranged on LED wafer 30, promptly on the top of described packaging body 10; Also each light conductor can be disposed on the light direction of described LED wafer 30, promptly on the top of described packaging body 10.

Because at least also be formed with two and packaging body 10 integrated light conductors on the top of packaging body 10, light conductor is arranged on the light direction of LED wafer 30, after LED lighted, the light that LED wafer 30 sends can present bright spot on the top of each light conductor.

The above is all so that the utility model conveniently to be described, in the spiritual category that does not break away from the utility model creation, the various simple covert and modification that those skilled in the art did of being familiar with this technology still belongs to protection range of the present utility model.

Claims

1. LED encapsulating structure, comprise the LED wafer, the support of carrying LED wafer and the packaging body that coats LED wafer and part support, it is characterized in that: at least also be formed with two and the integrated light conductor of described packaging body on the top of packaging body, described light conductor is on the light direction of described LED wafer.

2. according to the described LED encapsulating structure of claim 1, it is characterized in that: the top of described light conductor is provided with concave inward structure.

3. according to the described LED encapsulating structure of claim 2, it is characterized in that: the V-shaped or circular arc in the longitudinal section of described concave inward structure.

4. according to the described LED encapsulating structure of claim 1, it is characterized in that: the top of described light conductor is provided with bulge-structure.

5. according to the described LED encapsulating structure of claim 4, it is characterized in that: the longitudinal section of described bulge-structure is circular arc.

6. according to the described LED encapsulating structure of the arbitrary claim of claim 1-5, it is characterized in that: described light conductor is disposed on the light direction of described LED wafer.

7. according to the described LED encapsulating structure of claim 6, it is characterized in that: the spacing between the described light conductor is 0.5～2mm.

8. according to the described LED encapsulating structure of claim 7, it is characterized in that: the spacing between the described light conductor is 1mm.