CN201910421U - Planar structure for LED (light-emitting diode) device - Google Patents
Planar structure for LED (light-emitting diode) device Download PDFInfo
- Publication number
- CN201910421U CN201910421U CN201020637723XU CN201020637723U CN201910421U CN 201910421 U CN201910421 U CN 201910421U CN 201020637723X U CN201020637723X U CN 201020637723XU CN 201020637723 U CN201020637723 U CN 201020637723U CN 201910421 U CN201910421 U CN 201910421U
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- light
- printing opacity
- emitting diode
- conductive part
- planar structure
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Abstract
The utility model provides a planar structure for an LED (light-emitting diode) device. The planar structure for the LED device comprises a first light-transmission conductive part and a second light-transmission conductive part that are insulative to each other and are arranged on a light-transmission rigid substrate by patterning; and the first LED is electrically connected with the first light-transmission conductive part and the second light-transmission conductive part. The planar structure can be used for various displays, decorations and illuminations.
Description
Technical field
The utility model is the planar structure of the planar structure, particularly a kind of light-emitting diode assembly of relevant a kind of light-emitting device.
Background technology
Along with development of technology and development, light-emitting diode (Light Emitting Diode, LED) in many application, play the part of critical role, this kind element has, and caloric value is low, power consumption is little, the life-span is long, reaction speed is fast, volume is little, antidetonation is good, but discharge off gas reaches advantages such as planar package, therefore is widely used on the product of illumination application, landscape design, traffic sign, electronics show tools.
For instance, on commercial building and beautification of landscape were used, the LED illuminator can represent the effect that light coloring changes, and not only can have good daylighting function, and have certain energy saving and riotous with colour, dazzle beautiful decorative effect.
Yet existing LED fixes or is installed on nontransparent carrier after using the laying that mostly LED is cooperated circuit, and so installation or fixed form have limited the application of size, size, shape and the perspective of LED application product.
The utility model content
The utility model provides a kind of planar structure of light-emitting diode assembly, can be applicable to the usefulness of various demonstrations decorations and illumination.
An embodiment of the present utility model is a kind of planar structure of light-emitting diode assembly, comprising: a printing opacity rigid substrates, one first printing opacity conductive part, one second printing opacity conductive part and a plurality of first light-emitting diode.The first printing opacity conductive part and the second printing opacity conductive part are respectively the upper surface that patterning is arranged at the printing opacity rigid substrates, and wherein the first printing opacity conductive part and the second printing opacity conductive part are electrically insulated each other; In a plurality of first light-emitting diodes, each first light-emitting diode is striden and is established and be electrically connected the first printing opacity conductive part and the second printing opacity conductive part.
Below cooperate appended accompanying drawing to illustrate in detail by specific embodiment, when the effect that is easier to understand the purpose of this utility model, technology contents, characteristics and is reached.The palpus expositor in following examples and the accompanying drawing, omits and does not illustrate with the non-directly related element of the utility model; And each interelement size relationship is only for asking easy understanding in the accompanying drawing, and is non-in order to the restriction actual ratio.
Description of drawings
Fig. 1 is the schematic diagram of planar structure of the light-emitting diode assembly of an embodiment of the present utility model.
Fig. 2 is the vertical view of planar structure of the light-emitting diode assembly of embodiment of the present utility model.
Fig. 3 is the vertical view of planar structure of the light-emitting diode assembly of another embodiment of the present utility model.
Fig. 4 is the schematic diagram of planar structure of the light-emitting diode assembly of another embodiment of the present utility model.
Fig. 5 is the schematic diagram of planar structure of the light-emitting diode assembly of another embodiment of the present utility model.
Drawing reference numeral
10 printing opacity rigid substrates
20 first printing opacity conductive parts
30 second printing opacity conductive parts
40 first light-emitting diodes
50 light transmission protective layers
60 transparent substrates
70 first insulation divisions
80 the 3rd printing opacity conductive parts
90 the 4th printing opacity conductive parts
100 second light-emitting diodes
Embodiment
Please refer to Fig. 1, be the schematic diagram of the planar structure of the light-emitting diode assembly of an embodiment of the present utility model.The planar structure of light-emitting diode assembly comprises: a printing opacity rigid substrates 10, one first printing opacity conductive part 20, one second printing opacity conductive part 30 and a plurality of first light-emitting diodes 40.The first printing opacity conductive part 20 and the second printing opacity conductive part 30 are respectively the upper surface that patterning is arranged at printing opacity rigid substrates 10, and wherein the first printing opacity conductive part 20 and the second printing opacity conductive part 30 are electrically insulated each other; In a plurality of first light-emitting diodes 40, each first light-emitting diode 40 is striden and is established and be electrically connected the first printing opacity conductive part 20 and the second printing opacity conductive part 30.Printing opacity rigid substrates 10 is a rigid insulation material, for instance, can be the stained glass or a rigid plastic substrate of a clear glass, a light-permeable, for example the acrylic plate of light-permeable (polymethyl methacrylate (Polymethylmethacrylate, PMMA)), but not as limit.The first printing opacity conductive part 20 and the second printing opacity conductive part 30 can be indium tin oxide (Indium Tin Oxide, ITO), indium-zinc oxide (Indium Zinc Oxide, transparent metal conductive coating such as IZO), also can be transparent conductive materials such as poly-dioxoethyl plug fen/poly styrene sulfonate (PEDOT/PSS) or carbon dust, the mode that is coated with or attaches with sputter, evaporation, printing is formed on the printing opacity rigid substrates 10.Wherein the refractive index of poly-dioxoethyl plug fen/poly styrene sulfonate (PEDOT/PSS) and glassy phase are worked as, therefore when printing opacity rigid substrates 10 is clear glass, the first printing opacity conductive part 20 and the second printing opacity conductive part 30 promote brightness for poly-dioxoethyl plug fen/poly styrene sulfonate (PEDOT/PSS) can significantly reduce the cirtical angle of total reflection.Understandable, the first printing opacity conductive part 20 also can utilize electric conducting material to mix dyestuff etc. to produce different visual effects with the second printing opacity conductive part 30.
Please continue with reference to Fig. 2, vertical view for the planar structure of the light-emitting diode assembly of embodiment of the present utility model, the first printing opacity conductive part 20 is arranged on the printing opacity rigid substrates 10 according to different desired patternizations with the second printing opacity conductive part 30, makes cross-over connection present required pattern in a plurality of first light-emitting diodes 40 of the first printing opacity conductive part 20 and the second printing opacity conductive part 30.For instance, an end of the first printing opacity conductive part 20 connects a positive pole of an extraneous power supply unit (not shown); One end of the second printing opacity conductive part 30 connects a negative pole of an extraneous power supply unit, and is luminous in order to drive 40 starts of a plurality of first light-emitting diode.Be noted that the first printing opacity conductive part 20 and the second printing opacity conductive part 30 also can be connected extraneous other controlling signal lines, to control 40 starts of a plurality of first light-emitting diode.
Be noted that, the width of the first printing opacity conductive part 20 and the second printing opacity conductive part 30 can be shown in the embodiment of Fig. 1, Fig. 2, for linear pattern is divided cloth, but not as limit, Fig. 3 is the vertical view of planar structure of the light-emitting diode assembly of another embodiment of the present utility model, and the first printing opacity conductive part 20 and the second printing opacity conductive part 30 can be the block pattern and be distributed on the printing opacity rigid substrates 10.
Please refer to Fig. 4, be the schematic diagram of the planar structure of the light-emitting diode assembly of another embodiment of the present utility model.The planar structure of this light-emitting diode assembly also comprises a light transmission protective layer 50 and a transparent substrates 60, and light transmission protective layer 50 covers the first printing opacity conductive part 20, the second printing opacity conductive part 30 and first light-emitting diode 40.Light transmission protective layer 50 can be the wherein arbitrary of polyamine fat (PU), epoxy resin (epoxy), polyethylene vinylacetate (EVM), plastic of poly vinyl acetate (EVA), UV cured glue (UV glue); wherein polyethylene vinylacetate (EVM) has advantages such as high temperature resistant, anti-weather deterioration, but that the utility model is not limited to is above-mentioned.Transparent substrates 60 is arranged on the light transmission protective layer 50, and light transmission protective layer 50 is arranged between printing opacity rigid substrates 10 and the transparent substrates 60.Wherein transparent substrates 60 is a pliability material or a rigid substrates; Transparent substrates 60 also can be a light diffusing sheet, evenly penetrates through transparent substrates (light diffusing sheet) 60 backs in order to the light that first light-emitting diode 40 is sent.In addition, the planar structure of light-emitting diode assembly of the present utility model, comprise that also a plurality of conduction cohesive structures (not being shown in the diagram) are adhered to the first printing opacity conductive part 20 and the second printing opacity conductive part 30 with first light-emitting diode 40, the conduction cohesive structure can be elargol or tin cream.Planar structure so, printing opacity rigid substrates 10 has characteristics such as high strength scratch resistance, cooperates light transmission protective layer 50 can protect first light-emitting diode 40, increases the service life, and can be applicable to various demonstrations and decorate usefulness with illumination.
Please refer to Fig. 5, be the schematic diagram of the planar structure of the light-emitting diode assembly of another embodiment of the present utility model.The planar structure of this light-emitting diode assembly also comprises: one first insulation division 70, one the 3rd printing opacity conductive part 80, one the 4th printing opacity conductive part 90, a plurality of second light-emitting diode 100, light transmission protective layer 50 and transparent substrates 60.First insulation division, 70 insulation materials and patterning are arranged on the first printing opacity conductive part 20 or the second printing opacity conductive part 30; The upper surface that the 3rd printing opacity conductive part 80 is corresponding with the 4th printing opacity conductive part 90 to be arranged at first insulation division 70 wherein the 3rd printing opacity conductive part 80 and the 4th printing opacity conductive part 90 is electrically insulated each other; Each second light-emitting diode 100 is striden and is established and be electrically connected the 3rd printing opacity conductive part 80 and the 4th printing opacity conductive part 90.Light transmission protective layer 50 covers the first printing opacity conductive part 20, the second printing opacity conductive part 30, the 3rd printing opacity conductive part 80, the 4th printing opacity conductive part 90, first light-emitting diode 40 and second light-emitting diode 100.The setting of second light-emitting diode 100 can make the luminous density of the planar structure of light-emitting diode assembly of the present utility model more can flexible Application and variation.The spirit of present embodiment is, can increase the elasticity on using according to the application combination of different demands with the light-emitting diode of one deck or bilayer.Identical as for the material of the 3rd printing opacity conductive part 80 and the 4th printing opacity conductive part 90 and processing procedure mode and the first printing opacity conductive part 20 or the second printing opacity conductive part 30, light transmission protective layer 50 is also identical with previous embodiment with transparent substrates 60, does not repeat them here.
Comprehensively above-mentioned; the planar structure of light-emitting diode assembly of the present utility model comprises the first printing opacity conductive part and the second printing opacity conductive part is insulated from each other and patterning is arranged on the printing opacity rigid substrates; first light-emitting diode is electrically connected the first printing opacity conductive part and the second printing opacity conductive part; the printing opacity rigid substrates has characteristics such as high strength scratch resistance, cooperates light transmission protective layer can protect light-emitting diode to increase the service life.
Above-described embodiment only is for technological thought of the present utility model and characteristics are described; its purpose is enabling those skilled in the art to understand content of the present utility model and enforcement according to this; when can not with qualification protection range of the present utility model; promptly the equalization of doing according to the spirit that the utility model disclosed in every case changes or modifies, and must be encompassed in the protection range of the present utility model.
Claims (15)
1. the planar structure of a light-emitting diode assembly is characterized in that, the planar structure of described light-emitting diode assembly comprises:
One printing opacity rigid substrates;
One first printing opacity conductive part is arranged at the upper surface of described printing opacity rigid substrates for patterning;
One second printing opacity conductive part, for patterning is arranged at the upper surface of described printing opacity rigid substrates, wherein said first printing opacity conductive part and the described second printing opacity conductive part are electrically insulated each other; And
A plurality of first light-emitting diodes, each described first light-emitting diode are striden and are established and be electrically connected described first printing opacity conductive part and the described second printing opacity conductive part.
2. the planar structure of light-emitting diode assembly as claimed in claim 1; it is characterized in that; the planar structure of described light-emitting diode assembly also comprises a light transmission protective layer, covers the described first printing opacity conductive part, the described second printing opacity conductive part and described first light-emitting diode.
3. the planar structure of light-emitting diode assembly as claimed in claim 2 is characterized in that, described light transmission protective layer is the wherein arbitrary of polyamine fat, epoxy resin, polyethylene vinylacetate, plastic of poly vinyl acetate, UV cured glue.
4. the planar structure of light-emitting diode assembly as claimed in claim 2; it is characterized in that; the planar structure of described light-emitting diode assembly also comprises a transparent substrates; be arranged on the described light transmission protective layer, described light transmission protective layer is arranged between described printing opacity rigid substrates and the described transparent substrates.
5. the planar structure of light-emitting diode assembly as claimed in claim 4 is characterized in that, described transparent substrates is a pliability material or a rigid substrates.
6. the planar structure of light-emitting diode assembly as claimed in claim 4 is characterized in that, described transparent substrates is a light diffusing sheet.
7. the planar structure of light-emitting diode assembly as claimed in claim 1 is characterized in that, described printing opacity rigid substrates is a rigid insulation material.
8. the planar structure of light-emitting diode assembly as claimed in claim 1, it is characterized in that the planar structure of described light-emitting diode assembly comprises that also a plurality of conduction cohesive structures are adhered to described first printing opacity conductive part and the described second printing opacity conductive part with described first light-emitting diode.
9. the planar structure of light-emitting diode assembly as claimed in claim 8 is characterized in that, described conduction cohesive structure can be elargol or tin cream.
10. the planar structure of light-emitting diode assembly as claimed in claim 1 is characterized in that, the planar structure of described light-emitting diode assembly also comprises:
One first insulation division, patterning are arranged on described first printing opacity conductive part or the described second printing opacity conductive part;
One the 3rd printing opacity conductive part, correspondence is arranged at the upper surface of described first insulation division;
One the 4th printing opacity conductive part, correspondence is arranged at the upper surface of described first insulation division, and wherein said the 3rd printing opacity conductive part and described the 4th printing opacity conductive part are electrically insulated each other; And
A plurality of second light-emitting diodes, each described second light-emitting diode are striden and are established and be electrically connected described the 3rd printing opacity conductive part and described the 4th printing opacity conductive part.
11. the planar structure of light-emitting diode assembly as claimed in claim 10; it is characterized in that; the planar structure of described light-emitting diode assembly also comprises a light transmission protective layer, covers the described first printing opacity conductive part, the described second printing opacity conductive part, described the 3rd printing opacity conductive part, described the 4th printing opacity conductive part, described first light-emitting diode and described second light-emitting diode.
12. the planar structure of light-emitting diode assembly as claimed in claim 11 is characterized in that, described light transmission protective layer is the wherein arbitrary of polyamine fat, epoxy resin, polyethylene vinylacetate, plastic of poly vinyl acetate, UV cured glue.
13. the planar structure of light-emitting diode assembly as claimed in claim 11; it is characterized in that; the planar structure of described light-emitting diode assembly also comprises a transparent substrates; be arranged on the described light transmission protective layer, described light transmission protective layer is arranged between described printing opacity rigid substrates and the described transparent substrates.
14. the planar structure of light-emitting diode assembly as claimed in claim 13 is characterized in that, described transparent substrates is a pliability material or a rigid substrates.
15. the planar structure of light-emitting diode assembly as claimed in claim 13 is characterized in that, described transparent substrates is a light diffusing sheet.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201020637723XU CN201910421U (en) | 2010-12-01 | 2010-12-01 | Planar structure for LED (light-emitting diode) device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201020637723XU CN201910421U (en) | 2010-12-01 | 2010-12-01 | Planar structure for LED (light-emitting diode) device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201910421U true CN201910421U (en) | 2011-07-27 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201020637723XU Expired - Lifetime CN201910421U (en) | 2010-12-01 | 2010-12-01 | Planar structure for LED (light-emitting diode) device |
Country Status (1)
| Country | Link |
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| CN (1) | CN201910421U (en) |
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103107169A (en) * | 2011-11-14 | 2013-05-15 | 长荣光电股份有限公司 | Light emitting diode assembly, lighting device and backlight module |
| CN103985810A (en) * | 2014-05-28 | 2014-08-13 | 深圳力合光电传感股份有限公司 | LED glass and manufacturing technology thereof |
| CN104081545A (en) * | 2011-12-01 | 2014-10-01 | 夸克星有限责任公司 | Solid-state lighting device and method of manufacturing same |
| CN105261688A (en) * | 2014-07-14 | 2016-01-20 | 新世纪光电股份有限公司 | Light emitting element structure |
| CN106968391A (en) * | 2016-10-27 | 2017-07-21 | 厦门腾月光电科技有限公司 | Luminous building materials |
| JP2020127050A (en) * | 2014-09-26 | 2020-08-20 | 東芝ホクト電子株式会社 | Light emitting module |
| US10784423B2 (en) | 2017-11-05 | 2020-09-22 | Genesis Photonics Inc. | Light emitting device |
| US10804444B2 (en) | 2014-05-14 | 2020-10-13 | Genesis Photonics Inc. | Light-emitting device and manufacturing method thereof |
| US10854780B2 (en) | 2017-11-05 | 2020-12-01 | Genesis Photonics Inc. | Light emitting apparatus and manufacturing method thereof |
| US10910523B2 (en) | 2014-05-14 | 2021-02-02 | Genesis Photonics Inc. | Light emitting device |
| US10957674B2 (en) | 2015-09-18 | 2021-03-23 | Genesis Photonics Inc | Manufacturing method |
| WO2021223670A1 (en) * | 2020-05-05 | 2021-11-11 | Raysolve Optoelectronics (Suzhou) Co., Ltd. | Full color light emitting diode structure and method for manufacturing the same |
-
2010
- 2010-12-01 CN CN201020637723XU patent/CN201910421U/en not_active Expired - Lifetime
Cited By (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103107169A (en) * | 2011-11-14 | 2013-05-15 | 长荣光电股份有限公司 | Light emitting diode assembly, lighting device and backlight module |
| CN104081545A (en) * | 2011-12-01 | 2014-10-01 | 夸克星有限责任公司 | Solid-state lighting device and method of manufacturing same |
| US10804444B2 (en) | 2014-05-14 | 2020-10-13 | Genesis Photonics Inc. | Light-emitting device and manufacturing method thereof |
| US10910523B2 (en) | 2014-05-14 | 2021-02-02 | Genesis Photonics Inc. | Light emitting device |
| CN103985810A (en) * | 2014-05-28 | 2014-08-13 | 深圳力合光电传感股份有限公司 | LED glass and manufacturing technology thereof |
| CN103985810B (en) * | 2014-05-28 | 2017-01-04 | 深圳力合光电传感股份有限公司 | LED glass and manufacturing process thereof |
| CN105261688A (en) * | 2014-07-14 | 2016-01-20 | 新世纪光电股份有限公司 | Light emitting element structure |
| CN110061113A (en) * | 2014-07-14 | 2019-07-26 | 新世纪光电股份有限公司 | Light emitting element structure |
| JP2020127050A (en) * | 2014-09-26 | 2020-08-20 | 東芝ホクト電子株式会社 | Light emitting module |
| JP7085724B2 (en) | 2014-09-26 | 2022-06-17 | 日亜化学工業株式会社 | Luminous module |
| US10957674B2 (en) | 2015-09-18 | 2021-03-23 | Genesis Photonics Inc | Manufacturing method |
| CN106968391A (en) * | 2016-10-27 | 2017-07-21 | 厦门腾月光电科技有限公司 | Luminous building materials |
| US10784423B2 (en) | 2017-11-05 | 2020-09-22 | Genesis Photonics Inc. | Light emitting device |
| US10854780B2 (en) | 2017-11-05 | 2020-12-01 | Genesis Photonics Inc. | Light emitting apparatus and manufacturing method thereof |
| WO2021223670A1 (en) * | 2020-05-05 | 2021-11-11 | Raysolve Optoelectronics (Suzhou) Co., Ltd. | Full color light emitting diode structure and method for manufacturing the same |
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term |
Granted publication date: 20110727 |
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| CX01 | Expiry of patent term |