CN201897040U - Phenolic aldehyde modified polyurethane polyisocyanurate (PIR) energy-saving and heat-insulating plate - Google Patents
Phenolic aldehyde modified polyurethane polyisocyanurate (PIR) energy-saving and heat-insulating plate Download PDFInfo
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- CN201897040U CN201897040U CN2010206422625U CN201020642262U CN201897040U CN 201897040 U CN201897040 U CN 201897040U CN 2010206422625 U CN2010206422625 U CN 2010206422625U CN 201020642262 U CN201020642262 U CN 201020642262U CN 201897040 U CN201897040 U CN 201897040U
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Abstract
The utility model provides a phenolic aldehyde modified polyurethane polyisocyanurate (PIR) energy-saving and heat-insulating plate, which has a PIR sandwiched plate structure or a PIR bare plate structure. The middle sandwiched layer of the PIR sandwiched plate structure is a phenolic aldehyde modified PIR macromolecule structure body; and an upper panel and a lower panel of the middle sandwiched layer are metal sheets or nonmetal sheets. The phenolic aldehyde modified polyurethane polyisocyanurate (PIR) energy-saving and heat-insulating plate has the advantages that the fireproof and high temperature-resisting performance is improved compared with a polyurethane modified hard polyisocyanurate (PIR) foamed plastic energy-saving and heat-insulating plate; and the environment-friendly performance is good, the physical performance is excellent and the heat-insulating performance is better compared with a phenol formaldehyde resin foam heat-insulating material.
Description
Technical field
The utility model relates to a kind of energy-conserving thermal insulation board, and particularly a kind of difficulty that surpasses is fired the fire protection requirement of B1 level, and the low phenol aldehyde modified polyurethane polyureas isocyanuric acid ester PIR energy-conserving thermal insulation board that reaches 0.018W/mK of thermal conductivity.
Background technique
Existing polyurethane-modified hard polyisocyanurate foamed plastic PIR energy-conserving thermal insulation board has excellent thermal insulation property, but the fire-proof high-temperature resistant performance still remains further to be improved.
The model utility content
Technical problem to be solved in the utility model is the phenol aldehyde modified polyurethane polyureas isocyanuric acid ester PIR energy-conserving thermal insulation board that a kind of fire-proof high-temperature resistant excellent performance will be provided.
In order to solve above technical problem, the utility model provides a kind of phenol aldehyde modified polyurethane polyureas isocyanuric acid ester PIR energy-conserving thermal insulation board, and this phenol aldehyde modified PIR energy-conserving thermal insulation board is a PIR sandwich sheet structure, or PIR bare board structure.
Described PIR sandwich sheet structure is that the therebetween sandwich layer is phenol aldehyde modified PIR polymer structure, is metal or nonmetal thin plate at therebetween sandwich layer upper and lower surface plate; Described phenol aldehyde modified PIR macromolecular structure system adopts 5～50 parts of polyester polyol, 5～50 parts of polyether polyol, 1～30 part of phenolic resin, 5～30 parts of DMMP organophosphorous fire retardants, 5～30 parts of phosphate flame retardants, 5～30 parts of HCFC-141b stabilizers, 0.1～5 parts of foam stabilizing compounds, 0.1～5 parts of catalyst for trimerization, 0.1～5 parts high water trimer catalysts, 0.1～5 parts of delayed catalysts, 0.1～5 parts of first quaternary ammonium salt catalysts, 0.1～5 parts of hot quaternary amine catalyzer, 0.1～5 parts of strong kickers of pentamethyl, 0.1～5 portions of equilibrium catalysts are 20～40 in temperature
oC, pressure are that 5～40Mpa and MDI isocyanates are 20～40 in temperature
oC, pressure are to stir under 5～40Mpa mixes to form; Wherein the shared deal of MDI isocyanates is the former 1.1 times～4 times.
Described PIR sandwich sheet structure, its generating mode are PIR foaming and the once-combined moulding of upper and lower two-layer panel, are about to the PIR raw material and inject between two panels, and the PIR raw material is foaming betwixt, simultaneously with two panel close adhesion.
Described PIR bare board structure is meant the phenol aldehyde modified PIR polymer structure of no any attachment.Its generating mode is easily taken off between the formula surface layer for the PIR raw material is injected two layers, and the PIR raw material is foaming betwixt, then surface layer is thrown off.
The utility model is used for air conditioning wind pipe, building heat preservation and other insulation purposes, specifically be meant be used to make central air conditioning system, construction exterior wall heat insulation heat insulation system, inner wall of building adiabatic heat-insulation system, building roof adiabatic heat-insulation system, trailer coach, freezer, refrigerator, refrigerator, the energy device adiabatic heat-insulation is supporting and the adiabatic heat-insulation of the traffic tool such as aircraft, train, car, refrigerator car.
Superior effect of the present utility model is:
1) compares with polyurethane-modified hard polyisocyanurate foamed plastic PIR energy-conserving thermal insulation board, the utlity model has the good advantage of fireproof performance, further promoted the fire-proof high-temperature resistant performance, further expanded the application space of polyurethane heat insulation material;
2) compare with the phenolic resin foam thermal insulating material, the utlity model has good environmental-protecting performance, physical property and better thermal insulation property, the low 0.018W/mK that reaches of thermal conductivity, having improved 100% than phenolic resin foam thermal insulating material (thermal conductivity 0.036W/mK) heat insulation effect, is to implement one of required best thermal insulating material of energy-saving and emission-reduction state basic policy.
Description of drawings:
Fig. 1 is the cross-sectional view of the utility model PIR sandwich sheet structure;
Fig. 2 is the cross-sectional view of the utility model PIR bare board structure;
The number in the figure explanation
1-phenol aldehyde modified PIR polymer structure; 2-metal or nonmetal thin plate.
Embodiment
See also shown in the accompanying drawing, the utility model is further described.
The utility model provides a kind of phenol aldehyde modified polyurethane polyureas isocyanuric acid ester PIR energy-conserving thermal insulation board, and this phenol aldehyde modified PIR energy-conserving thermal insulation board is a PIR sandwich sheet structure, or PIR bare board structure; Described PIR sandwich sheet structure is that the therebetween sandwich layer is phenol aldehyde modified PIR polymer structure, is metal or nonmetal thin plate at therebetween sandwich layer upper and lower surface plate; Described phenol aldehyde modified PIR macromolecular structure system adopts 5～50 parts of polyester polyol, 5～50 parts of polyether polyol, 1～30 part of phenolic resin, 5～30 parts of DMMP organophosphorous fire retardants, 5～30 parts of phosphate flame retardants, 5～30 parts of HCFC-141b stabilizers, 0.1～5 parts of foam stabilizing compounds, 0.1～5 parts of catalyst for trimerization, 0.1～5 parts high water trimer catalysts, 0.1～5 parts of delayed catalysts, 0.1～5 parts of first quaternary ammonium salt catalysts, 0.1～5 parts of hot quaternary amine catalyzer, 0.1～5 parts of strong kickers of pentamethyl, 0.1～5 portions of equilibrium catalysts are 20～40 in temperature
oC, pressure are that 5～40Mpa and MDI isocyanates are 20～40 in temperature
oC, pressure are to stir under 5～40Mpa mixes to form; Wherein the shared deal of MDI isocyanates is the former 1.1 times～4 times.Its chemical principle is to implant the phenolic resin segment in polyurethane-polyisocyanurate PIR molecular chain, can form the vapour barrier during chance fire rapidly and stop burning away of flame, and its density is 30～100kg/m
3
As shown in Figure 2, described PIR bare board structure is meant the phenol aldehyde modified PIR polymer structure of no any attachment.Its generating mode is easily taken off between the formula surface layer for the PIR raw material is injected two layers, and the PIR raw material is foaming betwixt, then surface layer is thrown off.
As shown in Figure 1, described PIR sandwich sheet structure, its generating mode is PIR foaming and the once-combined moulding of upper and lower two-layer panel, is about to the PIR raw material and injects between two panels, the PIR raw material is foaming betwixt, simultaneously with two panel close adhesion.
The fireproof performance and the thermal conductivity of phenol aldehyde modified polyurethane polyureas isocyanuric acid ester PIR energy-conserving thermal insulation board of the present utility model, satisfy the B1 level of GB8624-1997 " Classification on burning behaviour for building materials " or the B level index request of GB8624-2006 " structural material and the classification of goods combustion performance ", simultaneously the low 0.018W/mK(probe temperature 25 that reaches of thermal conductivity
oDuring C).
The utility model is used for air conditioning wind pipe, building heat preservation and other insulation purposes, specifically be meant be used to make central air conditioning system, construction exterior wall heat insulation heat insulation system, inner wall of building adiabatic heat-insulation system, building roof adiabatic heat-insulation system, trailer coach, freezer, refrigerator, refrigerator, the energy device adiabatic heat-insulation is supporting and the adiabatic heat-insulation of the traffic tool such as aircraft, train, car, refrigerator car.
Claims (3)
1. phenol aldehyde modified polyurethane polyureas isocyanuric acid ester PIR energy-conserving thermal insulation board, it is characterized in that: this phenol aldehyde modified PIR energy-conserving thermal insulation board is a PIR sandwich sheet structure, or PIR bare board structure.
2. phenol aldehyde modified polyurethane polyureas isocyanuric acid ester PIR energy-conserving thermal insulation board according to claim 1 is characterized in that: described PIR bare board structure is meant the phenol aldehyde modified PIR polymer structure of no any attachment.
3. phenol aldehyde modified polyurethane polyureas isocyanuric acid ester PIR energy-conserving thermal insulation board according to claim 1, it is characterized in that: described PIR sandwich sheet structure is that the therebetween sandwich layer is phenol aldehyde modified PIR polymer structure, is metal or nonmetal thin plate at therebetween sandwich layer upper and lower surface plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010206422625U CN201897040U (en) | 2010-12-06 | 2010-12-06 | Phenolic aldehyde modified polyurethane polyisocyanurate (PIR) energy-saving and heat-insulating plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010206422625U CN201897040U (en) | 2010-12-06 | 2010-12-06 | Phenolic aldehyde modified polyurethane polyisocyanurate (PIR) energy-saving and heat-insulating plate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201897040U true CN201897040U (en) | 2011-07-13 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010206422625U Expired - Fee Related CN201897040U (en) | 2010-12-06 | 2010-12-06 | Phenolic aldehyde modified polyurethane polyisocyanurate (PIR) energy-saving and heat-insulating plate |
Country Status (1)
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| CN (1) | CN201897040U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102152561A (en) * | 2010-12-06 | 2011-08-17 | 上海万国科技发展有限公司 | Phenolic modified polyurethane polyisocyanurate PIR energy-saving insulation board |
-
2010
- 2010-12-06 CN CN2010206422625U patent/CN201897040U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102152561A (en) * | 2010-12-06 | 2011-08-17 | 上海万国科技发展有限公司 | Phenolic modified polyurethane polyisocyanurate PIR energy-saving insulation board |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20110713 Termination date: 20181206 |
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| CF01 | Termination of patent right due to non-payment of annual fee |