CN201887326U - Semiconductor laser capable of realizing coaxial encapsulation - Google Patents
Semiconductor laser capable of realizing coaxial encapsulation Download PDFInfo
- Publication number
- CN201887326U CN201887326U CN201020187049XU CN201020187049U CN201887326U CN 201887326 U CN201887326 U CN 201887326U CN 201020187049X U CN201020187049X U CN 201020187049XU CN 201020187049 U CN201020187049 U CN 201020187049U CN 201887326 U CN201887326 U CN 201887326U
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- pin
- laser
- semiconductor laser
- chip
- tube socket
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- Optical Couplings Of Light Guides (AREA)
- Semiconductor Lasers (AREA)
Abstract
The utility model relates to the field of laser transmitters of optoelectronic technology, in particular to a semiconductor laser capable of realizing combination and coaxial encapsulation of plastic metal sheets, comprising a first pin, a second pin, a tube socket and a laser chip, wherein positive and negative electrodes of a power supply are connected with the first pin and the second pin to supply power for the laser; the first pin and the second pin are fixed by the tube socket, and extend toward the inner part of the tube socket respectively; and the laser chip is fixed on the first pin and connected to the second pin by a gold thread. Compared with the traditional technology, the semiconductor laser has the advantages that as the tube socket is in a cylindrical structure, the fixing technology of a semiconductor laser component adopts threaded connection of higher coaxiality; and as the laser chip is positioned on the central axis of the tube socket, the laser component can obtain good coaxiality.
Description
Technical field
The utility model relates to the generating laser field of photoelectron technology, relates in particular to a kind of semiconductor laser that can realize coaxial packaging.
Background technology
Semiconductor laser is to utilize GRIN Lens to realize the optical coupling of semiconductor laser and monomode fiber, and its coupling efficiency can artificially be controlled on a large scale, and the coupling range of tolerable variance is wide.The operation principle of its optical system is by shown in Figure 3.The light that the laser 1 on the left side sends has certain emissivity, after the GRIN Lens 3 of centre is assembled light beam, the core diameter that lotus root is closed input the right is in the monomode fiber 4 of 6-9um, its coupling efficiency can be adjusted by object distance, the image distance of GRIN Lens system, and its high coupling efficiency can reach more than 40%.The technique for fixing of at present domestic semiconductor laser adopts the laser welding of non-coaxial configuration or scolder welding to fix usually, this dual in-line package technical matters more complicated, and cost is also higher.
Summary of the invention
The purpose of this utility model is to provide a kind of semiconductor laser of realizing coaxial packaging, and mechanism is simple, production cost is low.
Realize above-mentioned purpose, a kind of semiconductor laser of realizing coaxial packaging of the utility model, it comprises first pin, second pin, base, chip of laser, the both positive and negative polarity of power supply connects described first, second pin, be described laser power supply, described first, second pin is fixed by described base, and described first, second pin is respectively to the inner extension of described base, described chip of laser is fixed on described first pin, and is connected on described second pin by gold thread.
Preferably, described base is a cylindrical structural, and the outer setting of described base has screw thread.
Preferably, the sidepiece of described base is provided with breach, and described chip of laser is positioned among the described breach, and described chip of laser is positioned on the central axis of described base.
Compare with conventional art, the beneficial effects of the utility model are:
1, described base is a cylindrical structural, higher being threaded of alignment that the technique for fixing of semiconductor laser elements adopts;
2, described chip of laser is positioned on the central axis of described base, can obtain good alignment for laser assembly.
Description of drawings
Fig. 1 is a structural representation of the present utility model;
Fig. 2 is the structure cutaway view in the A-A cross section of Fig. 1;
Fig. 3 is the operation principle schematic diagram of the optical system of laser.
Among the figure: 1 laser, 3 GRIN Lens, 4 monomode fibers, 11 second pins, 12 first pins, 13 bases, 14 breach, 15 chip of laser, 31 screw threads.
Embodiment
Below in conjunction with accompanying drawing the utility model is described in further detail, but does not constitute any restriction of the present utility model.
Be structural representation of the present utility model as shown in Figure 1, Fig. 2 is the structure cutaway view in the A-A cross section of Fig. 1.
A kind of semiconductor laser of realizing coaxial packaging, it comprises first pin one 2, second pin one 1, base 13, chip of laser 15, the both positive and negative polarity of power supply connects described first, second pin one 2,11, be described laser power supply, described first, second pin one 2,11 is fixed by described base 13, described first, second pin one 2,11 is respectively to described base 13 inner extensions, described chip of laser is fixed on described first pin one 2, and is connected on described second pin one 1 by gold thread.
Described base 13 is a cylindrical structural, and the outer setting of described base has screw thread 31.
The sidepiece of described base 13 is provided with breach 14, and described chip of laser is positioned among the described breach 14, and described chip of laser 15 is positioned on the central axis of described base 13.
At last, should be pointed out that above embodiment only is the more representational example of the utility model.Obviously, the utility model is not limited to the foregoing description, and many distortion can also be arranged.Every foundation technical spirit of the present utility model all should be thought to belong to protection range of the present utility model to any simple modification, equivalent variations and modification that above embodiment did.
Claims (3)
1. the semiconductor laser that can realize coaxial packaging, it comprises first pin (12), second pin (11), base (13), chip of laser (15), the both positive and negative polarity of power supply connects described first, second pin (12,11), be described laser power supply, it is characterized in that: described first, second pin (12,11) fixing by described base (13), described first, second pin (12,11) respectively to the inner extension of described base (13), described chip of laser is fixed on described first pin (12), and is connected on described second pin (11) by gold thread.
2. laser according to claim 1 is characterized in that: described base (13) is a cylindrical structural, and the outer setting of described base has screw thread (31).
3. laser according to claim 1, it is characterized in that: the sidepiece of described base (13) is provided with breach (14), described chip of laser is positioned among the described breach (14), and described chip of laser (15) is positioned on the central axis of described base (13).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201020187049XU CN201887326U (en) | 2010-04-22 | 2010-04-22 | Semiconductor laser capable of realizing coaxial encapsulation |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201020187049XU CN201887326U (en) | 2010-04-22 | 2010-04-22 | Semiconductor laser capable of realizing coaxial encapsulation |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201887326U true CN201887326U (en) | 2011-06-29 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201020187049XU Expired - Fee Related CN201887326U (en) | 2010-04-22 | 2010-04-22 | Semiconductor laser capable of realizing coaxial encapsulation |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201887326U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110612645A (en) * | 2017-05-17 | 2019-12-24 | 三菱电机株式会社 | Semiconductor package |
| CN113410747A (en) * | 2020-03-17 | 2021-09-17 | 潍坊华光光电子有限公司 | Device and method for quickly repairing pins of semiconductor laser |
-
2010
- 2010-04-22 CN CN201020187049XU patent/CN201887326U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110612645A (en) * | 2017-05-17 | 2019-12-24 | 三菱电机株式会社 | Semiconductor package |
| CN113410747A (en) * | 2020-03-17 | 2021-09-17 | 潍坊华光光电子有限公司 | Device and method for quickly repairing pins of semiconductor laser |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20110629 Termination date: 20130422 |