CN201878423U - Pad structure of flexible circuit board - Google Patents
Pad structure of flexible circuit board Download PDFInfo
- Publication number
- CN201878423U CN201878423U CN2010205808360U CN201020580836U CN201878423U CN 201878423 U CN201878423 U CN 201878423U CN 2010205808360 U CN2010205808360 U CN 2010205808360U CN 201020580836 U CN201020580836 U CN 201020580836U CN 201878423 U CN201878423 U CN 201878423U
- Authority
- CN
- China
- Prior art keywords
- pad
- circuit board
- flexible circuit
- led
- pads
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
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- Fastening Of Light Sources Or Lamp Holders (AREA)
Abstract
Description
Claims (3)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2010205808360U CN201878423U (en) | 2010-10-27 | 2010-10-27 | Pad structure of flexible circuit board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2010205808360U CN201878423U (en) | 2010-10-27 | 2010-10-27 | Pad structure of flexible circuit board |
Publications (1)
Publication Number | Publication Date |
---|---|
CN201878423U true CN201878423U (en) | 2011-06-22 |
Family
ID=44166329
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2010205808360U Expired - Fee Related CN201878423U (en) | 2010-10-27 | 2010-10-27 | Pad structure of flexible circuit board |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN201878423U (en) |
-
2010
- 2010-10-27 CN CN2010205808360U patent/CN201878423U/en not_active Expired - Fee Related
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C56 | Change in the name or address of the patentee |
Owner name: SHENZHEN KEMEI OPTOELECTRONIC TECHNOLOGY CO., LTD. Free format text: FORMER NAME: KEMEI ADHESIVE APPLIED MATERIAL (SHENZHEN) CO., LTD. |
|
CP03 | Change of name, title or address |
Address after: 1-5, building 518000 and 7, building A4, Hengtai Industrial Park, Guangming red depression, Guangming District, Guangdong, Shenzhen Patentee after: Shenzhen Kemei Photoelectric Technology Co., Ltd. Address before: 518000. A4 building, Hengtai Industrial Park, Guangming red depression, Guangming District, Guangdong, Shenzhen Patentee before: Kemei Adhesive Material (Shenzhen) Co., Ltd. |
|
C17 | Cessation of patent right | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20110622 Termination date: 20121027 |