CN201867439U - Low-temperature working compensation device - Google Patents
Low-temperature working compensation device Download PDFInfo
- Publication number
- CN201867439U CN201867439U CN2010202804847U CN201020280484U CN201867439U CN 201867439 U CN201867439 U CN 201867439U CN 2010202804847 U CN2010202804847 U CN 2010202804847U CN 201020280484 U CN201020280484 U CN 201020280484U CN 201867439 U CN201867439 U CN 201867439U
- Authority
- CN
- China
- Prior art keywords
- temperature
- circuit
- control circuit
- heating element
- signal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000010438 heat treatment Methods 0.000 claims abstract description 35
- 238000005070 sampling Methods 0.000 claims description 10
- 238000005516 engineering process Methods 0.000 abstract description 2
- 102100038591 Endothelial cell-selective adhesion molecule Human genes 0.000 description 25
- 101000882622 Homo sapiens Endothelial cell-selective adhesion molecule Proteins 0.000 description 25
- 238000004891 communication Methods 0.000 description 3
- 230000035945 sensitivity Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005538 encapsulation Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000012141 concentrate Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000001276 controlling effect Effects 0.000 description 1
- 238000013500 data storage Methods 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 239000012774 insulation material Substances 0.000 description 1
- 230000007257 malfunction Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000012536 packaging technology Methods 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
Images
Landscapes
- Control Of Temperature (AREA)
Abstract
The utility model relates to a low-temperature working compensation device including a temperature testing circuit, a temperature control circuit and a heating element. The temperature control circuit is respectively connected with the temperature testing circuit and the heating element. The temperature testing circuit converts temperature signals into voltage signals and transmits the voltage signals to the temperature control circuit, then the temperature control circuit compares the voltage signals converted by the temperature testing circuit with the voltage signals set by the temperature control circuit to generate the control signals to drive the heating element to heat an embedded secure access module (ESAM). The low-temperature working compensation device adopts the heating technology, and provides certain low-temperature compensation for an ESAM chip which is placed in a fixed environment. The temperature of the ESAM chip is kept above 25 DEG C below zero and the working stability of the chip and the whole device is ensured.
Description
Technical field
The utility model belongs to the intelligent electric meter field, is specifically related to a kind of low-temperature working compensation system based on intelligent electric meter embedded-type security control module.
Background technology
Intelligent electric meter is as the instrument of metering and charge in the prior art, uses very extensively in power industry, and intelligent electric meter removes to be possessed tradition charges, and also bearing control and the integral body that detects user power utilization situation, adjustment electrical network with responsibilities such as electrobalance.This a large amount of operations and control data of storage in the intelligent electric meter, and can realize data communication in real time with by network channel and outside.
Usually adopt in the prior art method of embedded-type security control module (being called for short the ESAM chip) realize intelligent electric meter the secure data storage and with the data securities such as data encrypting and deciphering of extraneous communication on application operating.Because the standard operation temperature of embedded security chip is-25 ℃～70 ℃.And the region of China is very vast at present, and areas such as northern Daxing'an Mountainrange and the Xinjiang lowest temperature in the winter time can reach below-50 ℃.And adopt the safety chip intelligent electric meter is inoperable under this environment obviously.
Because the use in enormous quantities of safety chip mainly concentrates on the milder areas of relative temperature such as North China, the Northwest, the Yangtze river basin.The temperature difference throughout the year in these places is not very big relatively.Therefore, can keep long stable operation.But in some areas, for example subzero 30 severe cold weathers of spending winter appears in some places in regional province such as northwest, northeast, can cause the job insecurity of safety chip.
In existing the application, the table meter is not all done control to temperature environment, the interior environment temperature of ammeter is when continuous firing, owing to itself heater members is arranged, internal temperature can remain on higher relatively state, and after having a power failure, the temperature of ammeter descends, when being reduced to the minimum operating temperature of chip allowance, chip just can not normally start and work.Slave unit sees that chip is the state of locking or damage, causes the unusual of complete machine work.
Therefore, in order to ensure the stability of chip and complete machine work, exigence is developed a device that low temp compensating can be provided for ESAM.
The utility model content
The purpose of this utility model is to propose a kind of low temp compensating device, is used for solving the problem of embedded-type security control module cisco unity malfunction under low temperature environment of intelligent electric meter.
The utility model is achieved through the following technical solutions:
A kind of low temp compensating device, it is characterized in that: this device comprises temperature sensing circuit, temperature-control circuit and heating element, described temperature-control circuit is connected with heating element with temperature sensing circuit respectively, described temperature sensing circuit converts temperature signal voltage signal to and this signal is reached temperature-control circuit, the voltage signal of setting in voltage signal after described temperature-control circuit is changed temperature sensing circuit and the temperature-control circuit compares, and the generation control signal drives heating element and heats for the embedded-type security control module.
Wherein, described temperature sensing circuit, temperature-control circuit and heating element all place in the containment vessel; the slot of the embedded-type security control module that is used to peg graft is installed in the described containment vessel; the outside of described containment vessel is provided with temperature sensor; described temperature sensing circuit and temperature-control circuit are integrated in the embedded-type security control module, described heating element be centered around the embedded-type security control module around.
Wherein, described temperature sensing circuit comprises temperature sensor and temperature voltage change-over circuit, described temperature sensor reaches the temperature voltage change-over circuit with temperature signal, and described temperature voltage change-over circuit converts temperature signal to voltage signal that temperature-control circuit is discerned.
Wherein, described temperature-control circuit comprises voltage sampling circuit, comparer and gain adjusting circuit.
Wherein, described heating element adopts electrical heating wire.
Wherein, described temperature voltage change-over circuit is made up of two resistance R 1 and R2.
Wherein, described voltage sampling circuit is made up of four resistance R 3, R4, R5, R6 and one and half adjustable resistor P1.
Wherein, described gain adjusting circuit is made up of half adjustable resistor P2 and resistance R 8.
The beneficial effects of the utility model are: this low-temperature working compensation system adopts heating technique, and the ESAM chip is placed in the fixing environment, and certain low temp compensating is provided.Be engraved in when keeping the ESAM chip on subzero 25 degree, guarantee the stability of chip and complete machine work.
Description of drawings
Fig. 1 is an one-piece construction synoptic diagram of the present utility model;
Fig. 2 is the fundamental diagram of temperature sensing circuit of the present utility model and temperature-control circuit;
Among the figure, 1-temperature sensing circuit, 2-temperature-control circuit, 3-heating element, 4-containment vessel, 5-slot, 6-embedded-type security control module (being called for short the ESAM chip), 7-temperature sensor.
Embodiment
Below in conjunction with accompanying drawing low-temperature working compensation system of the present utility model is further described in detail.
Be compensated for as example low-temperature working compensation system in the utility model is described the embedded-type security control module in the intelligent electric meter (be called for short ESAM chip) is carried out low-temperature working, the basic structure of this device comprises temperature sensing circuit 1, temperature-control circuit 2 and heating element 3.Temperature sensing circuit 1 converts temperature signal voltage signal to and this signal is reached temperature-control circuit 2, the voltage signal of setting in voltage signal after temperature-control circuit 2 is changed temperature sensing circuit and the temperature-control circuit compares, and the generation control signal drives heating element 3 and heats for the ESAM chip.
In order to protect the temperature in the ESAM chip, preferably ESAM chip 6 and heating element 3 are isolated with external environment condition, so preferably adopt Fig. 1 structure, as shown in Figure 1, temperature sensing circuit 1, temperature-control circuit 2 and heating element 3 all place in the containment vessel 4; Slot 5 also is installed in the containment vessel 4, and ESAM chip 6 is plugged in the slot 5; The outside of containment vessel 4 is equipped with temperature sensor 7, and temperature sensing circuit 1 and temperature-control circuit 2 are integrated in the embedded-type security control module 6, heating element be centered around embedded-type security control module 6 around.
Heating element 3 is centered around heating of ESAM chip 6 on every side and to it, can adopt heating wire or other thermal elements, and concrete mode can be determined according to packaging technology.This heating element is subjected to temperature-control circuit control, and the temperature that is lower than setting when environment is that start-up temperature control circuit 2, driving heating element 3 are 6 heating of ESAM chip; When environment temperature reaches requirement, cut off temperature-control circuit 2, the environment temperature of ESAM chip is moved in a controlled scope.
Containment vessel 4; main effect is that ESAM chip and heating element 3 are protected in the environment of a sealing; it adopts thermal insulation material to make; slot 5 is installed in the containment vessel 4; can easily the ESAM chip be inserted in the slot 5, this slot 5 can adopt the DIP8 encapsulation of standard or the Chip Packaging of other types.
ESAM chip 6 mainly comprises an intelligent card chip, and the outer enclosure of this intelligent card chip has encapsulating material, and described encapsulating material is provided with a plurality of pins, and the intelligent card chip after the encapsulation is fixed in the containment vessel 4 by slot 5.
Temperature sensor 7, main effect is the environment temperature that detects ESAM chip 6, and temperature signal is transferred in the temperature sensing circuit 1 that is attached thereto; This temperature sensor can adopt.
Temperature sensing circuit 1 comprises temperature sensor 7 and temperature voltage change-over circuit, and temperature sensor 7 links to each other with temperature-control circuit 2 by the temperature voltage change-over circuit; Temperature-control circuit 2 comprises voltage sampling circuit, comparer and gain adjusting circuit.Temperature sensor 7 reaches the temperature voltage change-over circuit with temperature signal, and the temperature voltage change-over circuit converts temperature signal to voltage signal that temperature-control circuit 2 discerned and this signal is input in the temperature-control circuit 2; Temperature-control circuit 2 obtains this external voltage signal by voltage sampling circuit, and reach in the comparer to determining voltage signal with another of voltage sampling circuit dividing potential drop gained and to compare, difference relatively is as driving the control signal that 3 pairs of ESAM chips 6 of heating element heat, the temperature that reaches setting when temperature is, temperature-control circuit stops heating, and the working environment of ESAM chip 6 is remained in the higher relatively temperature range.
The utility model also can adopt the mode of leading rectification before this control signal of output, the susceptibility by gain adjusting circuit raising temperature variation increases the sensitivity of control signal.Realize the susceptibility of ESAM chip for convenience to temperature variation, also can adopt communication modes, the actual work temperature of chip is transferred to application system with the form of data, and send the mode of order by application system, the control temperature circuit is realized the control to the environment temperature of ESAM chip.
For the temperature working environment that makes ESAM chip 6 has bigger power load ability, temperature-control circuit 2 should adopt the voltage slightly higher than ESAM chip operating voltage, and higher power requirement is provided.
As shown in Figure 2, RT is a temperature sensor 7, is used to detect the environment temperature of ESAM chip 6.Form the temperature voltage change-over circuit by R1, R2 among the figure, with the resistance variations of temperature variation in RT formation, the circuit of forming by R1, R2 changes into external voltage signal with the external temperature signal, by R7 external voltage signal is sent in the voltage sampling circuit of temperature-control circuit 2.Voltage sampling circuit is made up of resistance R 3, R4, R5, R6 and half adjustable resistor P1, the voltage signal of this voltage sampling circuit dividing potential drop gained reaches in the comparer with external voltage signal and compares, the difference that produces is as control signal, export from the OUT point, drive external heating element 3, realize ESAM chip 6 temperature controlling.Among Fig. 2, the circuit that resistance R 8 and half adjustable resistor P2 form is regulated the gain susceptibility of temperature-control circuit 2 as gain adjustment circuit.Increase the P2 resistance, can improve the sensitivity of circuit temperature gain, otherwise, reduce the P2 resistance, then reduce the sensitivity of circuit to temperature.P2 also can be positioned over outside the temperature-control circuit 2 in side circuit, and application circuit can be adjusted according to actual needs flexibly.
Should be noted that at last: above embodiment only is not intended to limit in order to the explanation the technical solution of the utility model, although the utility model is had been described in detail with reference to the foregoing description, those of ordinary skill in the field are to be understood that: still can make amendment or be equal to replacement embodiment of the present utility model, and do not break away from any modification of the utility model spirit and scope or be equal to replacement, it all should be encompassed in the middle of the claim scope of the present utility model.
Claims (8)
1. low temp compensating device, it is characterized in that: this device comprises temperature sensing circuit (1), temperature-control circuit (2) and heating element (3), described temperature-control circuit (2) is connected with heating element (3) with temperature sensing circuit (1) respectively, described temperature sensing circuit (1) converts temperature signal voltage signal to and this signal is reached temperature-control circuit (2), the voltage signal of setting in voltage signal after described temperature-control circuit (2) is changed temperature sensing circuit and the temperature-control circuit compares, and the generation control signal drives heating element (3) and heats for the embedded-type security control module.
2. low temp compensating device as claimed in claim 1; it is characterized in that: described temperature sensing circuit (1), temperature-control circuit (2) and heating element (3) all place in the containment vessel (4); the slot (5) of embedded-type security control module (6) that are used to peg graft is installed in the described containment vessel (4); the outside of described containment vessel (4) is provided with temperature sensor (7); described temperature sensing circuit (1) and temperature-control circuit (2) are integrated in the embedded-type security control module (6), described heating element be centered around embedded-type security control module (6) around.
3. low temp compensating device as claimed in claim 1 or 2, it is characterized in that: described temperature sensing circuit (1) comprises temperature sensor (7) and temperature voltage change-over circuit, described temperature sensor (7) reaches the temperature voltage change-over circuit with temperature signal, and described temperature voltage change-over circuit converts temperature signal to voltage signal that temperature-control circuit (2) is discerned.
4. low temp compensating device as claimed in claim 1 or 2 is characterized in that: described temperature-control circuit (2) comprises voltage sampling circuit, comparer and gain adjusting circuit.
5. low temp compensating device as claimed in claim 1 or 2 is characterized in that: described heating element (3) adopts electrical heating wire.
6. low temp compensating device as claimed in claim 3 is characterized in that: described temperature voltage change-over circuit is made up of two resistance R 1 and R2.
7. low temp compensating device as claimed in claim 4 is characterized in that: described voltage sampling circuit is made up of four resistance R 3, R4, R5, R6 and one and half adjustable resistor P1.
8. low temp compensating device as claimed in claim 4 is characterized in that: described gain adjusting circuit is made up of half adjustable resistor P2 and resistance R 8.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010202804847U CN201867439U (en) | 2010-08-04 | 2010-08-04 | Low-temperature working compensation device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010202804847U CN201867439U (en) | 2010-08-04 | 2010-08-04 | Low-temperature working compensation device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201867439U true CN201867439U (en) | 2011-06-15 |
Family
ID=44138591
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010202804847U Expired - Lifetime CN201867439U (en) | 2010-08-04 | 2010-08-04 | Low-temperature working compensation device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201867439U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103869150A (en) * | 2012-12-10 | 2014-06-18 | 北京普源精电科技有限公司 | Radio-frequency measurement device with temperature compensation function and temperature compensation method |
| EP2568496A3 (en) * | 2011-09-09 | 2017-12-06 | Assa Abloy Ab | Method and apparatus for maintaining operational temperature of an integrated circuit |
| CN113190061A (en) * | 2021-04-16 | 2021-07-30 | 苏州贝克微电子有限公司 | Auxiliary circuit of integrated circuit chip and design method thereof |
-
2010
- 2010-08-04 CN CN2010202804847U patent/CN201867439U/en not_active Expired - Lifetime
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP2568496A3 (en) * | 2011-09-09 | 2017-12-06 | Assa Abloy Ab | Method and apparatus for maintaining operational temperature of an integrated circuit |
| US9917028B2 (en) | 2011-09-09 | 2018-03-13 | Assa Abloy Ab | Method and apparatus for maintaining operational temperature of an integrated circuit |
| CN103869150A (en) * | 2012-12-10 | 2014-06-18 | 北京普源精电科技有限公司 | Radio-frequency measurement device with temperature compensation function and temperature compensation method |
| CN103869150B (en) * | 2012-12-10 | 2018-03-16 | 北京普源精电科技有限公司 | A kind of radio-frequency measurement device and temperature compensation with temperature compensation function |
| CN113190061A (en) * | 2021-04-16 | 2021-07-30 | 苏州贝克微电子有限公司 | Auxiliary circuit of integrated circuit chip and design method thereof |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN103135045B (en) | Power generation apparatus and method for determining work state of power generation apparatus | |
| CN103066650B (en) | Pitch control system backup battery on-line monitoring and voltage sharing system and method | |
| CN201867439U (en) | Low-temperature working compensation device | |
| CN103067941A (en) | Multivariable distributed type online monitoring system based on wireless sensor network | |
| CN206573225U (en) | One kind is based on arrowband Internet of Things grain temperature monitoring device | |
| CN207623321U (en) | A kind of Multifunctional water monitering buoy | |
| CN204758692U (en) | Voltage detection device is floated to hall sensor temperature | |
| CN102141591A (en) | Device and method for monitoring transient state current-carrying capability of power transmission line | |
| CN202221538U (en) | Cabin intelligent constant temperature controller of wind generator | |
| CN105698959A (en) | Dry-type air-core reactor overheating fault early warning system based on TVOC and temperature test | |
| CN201556105U (en) | Self temperature-reducing circuit for wireless terminal | |
| CN204313984U (en) | A kind of on-Line Monitor Device for electrical node temperature | |
| WO2008002344A3 (en) | Electric drivetrain thermal protection system | |
| CN104836512A (en) | Photovoltaic assembly hot spot effect control method | |
| CN206806347U (en) | A kind of solar photovoltaic assembly device monitored in real time | |
| CN103595236B (en) | Photovoltaic inverter starting-up control, device and solar power system | |
| CN202886957U (en) | Remote energy-saving monitor system based on GPRS (general packet radio service) | |
| CN204461635U (en) | Based on solar powered high voltage bus wireless temperature monitoring device | |
| CN105513263A (en) | Remote-controlled intelligent remote control | |
| CN204925240U (en) | Hall sensor temperature is floated voltage compensation device and is converged flow box | |
| CN104359438A (en) | Conductor sag measuring device and method based on conductor temperature | |
| CN202531956U (en) | Valve array controller based on mobile communication network | |
| CN106872902A (en) | The BMS and detection method of a kind of combination of network structure battery | |
| CN201766345U (en) | Overheat protection device of photovoltaic polycrystalline silicon ingot furnace | |
| CN205318266U (en) | Nuclear power station technology pipeline electric tracer heating system |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| ASS | Succession or assignment of patent right |
Owner name: STATE GRID CORPORATION OF CHINA Free format text: FORMER OWNER: CHINA ELECTRIC POWER RESEARCH INSTITUTE Effective date: 20140321 Owner name: CHINA ELECTRIC POWER RESEARCH INSTITUTE Effective date: 20140321 |
|
| C41 | Transfer of patent application or patent right or utility model | ||
| COR | Change of bibliographic data |
Free format text: CORRECT: ADDRESS; FROM: 100192 HAIDIAN, BEIJING TO: 100031 XICHENG, BEIJING |
|
| TR01 | Transfer of patent right |
Effective date of registration: 20140321 Address after: 100031 Xicheng District West Chang'an Avenue, No. 86, Beijing Patentee after: State Grid Corporation of China Patentee after: China Electric Power Research Institute Address before: 100192 Beijing city Haidian District Qinghe small Camp Road No. 15 Patentee before: China Electric Power Research Institute |
|
| CX01 | Expiry of patent term |
Granted publication date: 20110615 |
|
| CX01 | Expiry of patent term |