CN201859841U - Silicon wafer marking device - Google Patents
Silicon wafer marking device Download PDFInfo
- Publication number
- CN201859841U CN201859841U CN2010205656226U CN201020565622U CN201859841U CN 201859841 U CN201859841 U CN 201859841U CN 2010205656226 U CN2010205656226 U CN 2010205656226U CN 201020565622 U CN201020565622 U CN 201020565622U CN 201859841 U CN201859841 U CN 201859841U
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- China
- Prior art keywords
- cylindrical shell
- mark device
- wafer mark
- absorbing unit
- wafer
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Abstract
The utility model provides a silicon wafer marking device, including a first barrel sleeved to an external side wall of a lens of an optical microscope; a second barrel having a pore on one end, the other end of the second barrel being matched and connected with the first barrel, the position of the pore being corresponded to the position of a lens of the lens; at least one adsorption unit, in which marking articles are stored, and the adsorption unit is distributed on the edge of the pore of the second barrel. The silicon wafer marking device of the utility model can avoid non accuracy of manual marking, and avoid a problem of pollution to the lens in marking by using an ink pen.
Description
Technical field
The utility model relates to the device that wafer detects usefulness, relates in particular to a kind of wafer mark device.
Background technology
General integrated circuit manufacture process can be divided into wafer fabrication stage, wafer sort stage and die package stage in regular turn, and along with present electronic product is particular about compact, therefore the encapsulation technology of present stage is in order to reduce encapsulation volume and to improve integrated circuit effectiveness, trend towards high-order encapsulation technologies such as chip package, multiple grains module gradually, yet these high-order packaged types is with high costs, therefore preferably can before encapsulation, promptly test at crystal grain, before the back segment encapsulation procedure, these poor product crystal grains are rejected, save unnecessary packaging cost.
At present, in the wafer fabrication stage,, need find out the object construction in target crystal grain and the crystal grain for producing on-line analysis wafer fault or the production status of wafer manufacturing being detected.Common way is to utilize printing ink to stamp ink dot around object construction to mark, at first use the low power objective of light microscope to find out target crystal grain on the wafer, and on target crystal grain, find object construction, secondly, whether the detail of confirming object construction with the microscopical high power objective of optics is consistent with actual demand, if meet, just under the low power objective of light microscope, manually around object construction, stamp ink dot and mark with ink pens; If do not meet, just need search again, until finding the object construction that meets demand.
Though light microscope can help to find object construction, the operating optical microscope is very inconvenient, the camera lens of light microscope ceaselessly need be furthered and zoom out crystal column surface, if operation is wrong, damages camera lens easily; In addition, printing ink also might pollute the camera lens of light microscope, adopts the position of manually stamping ink dot also not accurate enough.
The utility model content
The purpose of this utility model is to provide a kind of wafer mark device, and it is not accurate enough manually to mark on crystal circle structure with the solution employing, and adopts ink pens to mark and may pollute the problem of camera lens.
For addressing the above problem, the wafer mark device that the utility model proposes comprises: first cylindrical shell, described first barrel jacket are combined on the lateral wall of camera lens of light microscope; One end has second cylindrical shell of hole, and the other end of described second cylindrical shell is connected with described first cylindrical shell coupling, and described hole is corresponding with the lens position in the described camera lens; At least one absorbing unit stores label in the described absorbing unit, and described absorbing unit is distributed on the hole edge of described second cylindrical shell.
Preferably, described first cylindrical shell is a cylindrical tube, and described second cylindrical shell is a conical shell.
Preferably, when the quantity of described absorbing unit was one, described absorbing unit was circular.
Preferably, when the quantity of described absorbing unit was a plurality of, a plurality of described absorbing units were uniformly distributed on the hole edge of described second cylindrical shell.
Preferably, the quantity of described absorbing unit is at least three.
Preferably, described first cylindrical shell is linked in by adhesive tape on the lateral wall of camera lens of light microscope.
Preferably, described second cylindrical shell and described first cylindrical shell make the other end of described second cylindrical shell be connected with described first cylindrical shell coupling by the double faced adhesive tape adhesion.
Preferably, described absorbing unit sticks on the hole edge of described second cylindrical shell by double faced adhesive tape.
Preferably, described absorbing unit is a sponge.
Preferably, the material of described first cylindrical shell is a paper.
Preferably, the material of described second cylindrical shell is plastics.
Preferably, described plastics are transparent.
Preferably, described label is a printing ink.
Compared with prior art, the wafer mark device that the utility model provides, find out object construction in the wafer earlier in conjunction with light microscope, utilize the wafer mark device that is arranged on the light microscope around object construction, to make marks afterwards, described wafer mark device has been avoided the inaccuracy that manually makes marks, has also avoided adopting ink pens manually to mark simultaneously and may pollute the problem of camera lens.
The material of first cylindrical shell of described wafer mark device is a paper, and the material of second cylindrical shell is plastics, and absorbing unit is a sponge, and it is easy to draw materials, with low cost.
Description of drawings
The wafer mark apparatus structure schematic diagram that Fig. 1 provides for the utility model embodiment;
The position relation looks up structural representation between absorbing unit that Fig. 2 provides for the utility model embodiment and the hole.
Embodiment
Below in conjunction with the drawings and specific embodiments the wafer mark device that the utility model proposes is described in further detail.According to the following describes and claims, advantage of the present utility model and feature will be clearer.It should be noted that accompanying drawing all adopts very the form of simplifying and all uses non-ratio accurately, only be used for conveniently, the purpose of aid illustration the utility model embodiment lucidly.
Core concept of the present utility model is, a kind of wafer mark device is provided, this wafer mark device is installed on the light microscope, earlier find out object construction in the wafer by light microscope, utilize the printing ink of absorbing unit in the wafer mark device around object construction, to make marks afterwards, described wafer mark device has been avoided the inaccuracy that manually makes marks, has also avoided adopting ink pens manually to mark simultaneously and may pollute the problem of camera lens.
Please refer to Fig. 1, the wafer mark apparatus structure schematic diagram that it provides for the utility model embodiment.Described wafer mark device 100 comprises: first cylindrical shell 101, described first cylindrical shell 101 are linked on the lateral wall of camera lens of light microscope; One end has second cylindrical shell 103 of hole 102, and described second cylindrical shell, 103 other ends are connected with described first cylindrical shell, 101 couplings, and described hole 102 is corresponding with the lens position in the described camera lens; At least one absorbing unit 104 stores label in the described absorbing unit 104, and described absorbing unit 104 is distributed on hole 102 edges of described second cylindrical shell 103.
In the present embodiment, the lens shape of described light microscope is cylindrical, and therefore, described first cylindrical shell 101 is a cylindrical tube, and described second cylindrical shell 103 is a conical shell.Yet will be appreciated that the shape of described first cylindrical shell 101 and second cylindrical shell 103 is not limited to foregoing description, as long as described first cylindrical shell 101 can be linked on the lateral wall of camera lens of light microscope.
In the present embodiment, the material of described first cylindrical shell 101 is the paper of common hardness, and fixing by adhesive tape (not shown), and described first cylindrical shell 101 is linked on the lateral wall of described camera lens.Will be understood by those skilled in the art that described first cylindrical shell 101 not only is confined to be linked on the lateral wall of described camera lens by adhesive tape (not shown), described first cylindrical shell 101 can also be wrapped on the lateral wall of camera lens closely outward.Further, the standard of described common hardness is as the criterion with the lens in the not scratch camera lens.
Described second cylindrical shell 103 passes through the double faced adhesive tape adhesion with described first cylindrical shell 101, so that the edge of described second cylindrical shell, 103 other ends is connected with the edge coupling of described first cylindrical shell 101.The material of described second cylindrical shell 103 is plastics, and in the present embodiment, described plastics are transparent, so that observe the distance between camera lens and the crystal column surface, when preventing to meet accident, camera lens is damaged.
Please refer to Fig. 2, the position relation looks up structural representation between absorbing unit that it provides for the utility model embodiment and the hole, in the present embodiment, the quantity of described absorbing unit 104 is a plurality of, more specifically, the quantity of described absorbing unit 104 is four, and is uniformly distributed on hole 102 edges of described second cylindrical shell 103.Described absorbing unit 104 is cube sponges, and promptly four cube sponges are uniformly distributed on hole 102 edges of described second cylindrical shell 103.Further, four cube sponges stick on hole 102 edges of described second cylindrical shell 103 by double faced adhesive tape.
Will be understood by those skilled in the art that in another embodiment of the utility model, the quantity of absorbing unit 104 also can be three, three absorbing units can be uniformly distributed on hole 102 edges of described second cylindrical shell 103 (being equilateral triangle distributes).In the another embodiment of the utility model, the quantity of absorbing unit 104 also can be one, and promptly absorbing unit 104 is on circular hole 102 edges that are distributed in second cylindrical shell 103.The absorbing unit 104 of a plurality of quantity is more saved material than being circular absorption monomer 104.
Store label in the described absorbing unit 104, described label is a printing ink, therefore, has been stained with moderate quantity of ink in the cube sponge, is used for making marks in the object construction zone of wafer.In the present embodiment, make marks is into centering on equally distributed four the square inked areas of objective wafer structural region, dotted line is drawn at center along two relative square inked areas, form two mutually orthogonal dotted lines, and the joining of dotted line is positioned at the center of objective wafer structural region, therefore select for use four cube sponges can draw a circle to approve the objective wafer structural region exactly, adopted cost seldom to use simultaneously, saved expenditure as absorbing unit 104.
Carry out concrete when the objective wafer structural region is made marks, at first use the low power objective of light microscope to find out target crystal grain on the wafer, and on target crystal grain, find object construction, secondly, whether the detail of confirming object construction with the microscopical high power objective of optics is consistent with actual demand, if meet, utilize wafer mark device 100 on the low power objective be installed in light microscope around object construction, to stamp ink dot and mark; If do not meet, just need search again, until finding the object construction that meets demand.The diameter of first cylindrical shell 101 in the described wafer mark device 100 for example is 35mm, and with the diameter coupling of low power objective camera lens, the height of first cylindrical shell 101 is 10mm for example, and the other end of camera lens is flushed with the other end of first cylindrical shell 101.The height of second cylindrical shell 103 is 7mm for example, make wafer mark device 100 bottom absorbing unit 104 and crystal column surface between leave certain space, before preventing from not find the objective wafer structural region, stay wrong mark at crystal column surface.
Wherein, needed light enters by the hole 102 of second cylindrical shell 103 in the wafer mark device 100 when observing the objective wafer structural region, so hole 102 is corresponding with the lens position of camera lens, and the diameter of hole 102 for example is 1.5mm.After light microscope finds the objective wafer structural region, regulating the light microscope dressing table descends, wafer mark device 100 descends thereupon, be positioned at wafer mark device 100 four cube sponges that are stained with printing ink bottom near crystal column surface, until contacting with crystal column surface, and then stayed four square inked areas at crystal column surface, these four square inked areas are the mark that will do on wafer, described mark with objective wafer structural region circle in mark inside.Dotted line is drawn at center along two relative square inked areas, form two mutually orthogonal dotted lines, and the joining of dotted line is positioned at the center of objective wafer structural region, therefore adopts described wafer mark device 100 to make marks, and can draw a circle to approve the objective wafer structural region more accurately.Also avoid simultaneously adopting ink pens manually to mark and to have polluteed the problem of camera lens.
In sum, the wafer mark device 100 that the utility model provides, this device is installed on the light microscope, earlier find out object construction in the wafer by light microscope, utilize the printing ink of absorbing unit 104 in the wafer mark device 100 around object construction, to make marks afterwards, described wafer mark device 100 has been avoided the inaccuracy that manually makes marks, has also avoided adopting ink pens manually to mark simultaneously and may pollute the problem of camera lens.
Obviously, those skilled in the art can carry out various changes and modification to utility model and not break away from spirit and scope of the present utility model.Like this, if of the present utility model these are revised and modification belongs within the scope of the utility model claim and equivalent technologies thereof, then the utility model also is intended to comprise these changes and modification interior.
Claims (13)
1. a wafer mark device is characterized in that, comprising:
First cylindrical shell, described first barrel jacket are combined on the lateral wall of camera lens of light microscope;
One end has second cylindrical shell of hole, and the other end of described second cylindrical shell is connected with described first cylindrical shell coupling, and described hole is corresponding with the lens position in the described camera lens;
At least one absorbing unit stores label in the described absorbing unit, and described absorbing unit is distributed on the hole edge of described second cylindrical shell.
2. wafer mark device as claimed in claim 1 is characterized in that, described first cylindrical shell is a cylindrical tube, and described second cylindrical shell is a conical shell.
3. wafer mark device as claimed in claim 1 is characterized in that, when the quantity of described absorbing unit was one, described absorbing unit was circular.
4. wafer mark device as claimed in claim 1 is characterized in that, when the quantity of described absorbing unit was a plurality of, a plurality of absorbing units were uniformly distributed on the hole edge of described second cylindrical shell.
5. wafer mark device as claimed in claim 4 is characterized in that, the quantity of described absorbing unit is at least three.
6. wafer mark device as claimed in claim 1 is characterized in that, described first cylindrical shell is linked in by adhesive tape on the lateral wall of camera lens of light microscope.
7. wafer mark device as claimed in claim 1 is characterized in that, described second cylindrical shell and described first cylindrical shell make the other end of described second cylindrical shell be connected with described first cylindrical shell coupling by the double faced adhesive tape adhesion.
8. wafer mark device as claimed in claim 1 is characterized in that described absorbing unit sticks on the hole edge of described second cylindrical shell by double faced adhesive tape.
9. wafer mark device as claimed in claim 1 is characterized in that, described absorbing unit is a sponge.
10. wafer mark device as claimed in claim 1 is characterized in that, the material of described first cylindrical shell is a paper.
11. wafer mark device as claimed in claim 1 is characterized in that, the material of described second cylindrical shell is plastics.
12. wafer mark device as claimed in claim 11 is characterized in that described plastics are transparent.
13. wafer mark device as claimed in claim 1 is characterized in that described label is a printing ink.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010205656226U CN201859841U (en) | 2010-10-18 | 2010-10-18 | Silicon wafer marking device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010205656226U CN201859841U (en) | 2010-10-18 | 2010-10-18 | Silicon wafer marking device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201859841U true CN201859841U (en) | 2011-06-08 |
Family
ID=44105642
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010205656226U Expired - Fee Related CN201859841U (en) | 2010-10-18 | 2010-10-18 | Silicon wafer marking device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201859841U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110487800A (en) * | 2019-07-23 | 2019-11-22 | 人本集团有限公司 | Rolling bearing retainer riveting quality detection method |
-
2010
- 2010-10-18 CN CN2010205656226U patent/CN201859841U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110487800A (en) * | 2019-07-23 | 2019-11-22 | 人本集团有限公司 | Rolling bearing retainer riveting quality detection method |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20110608 Termination date: 20161018 |