CN201851935U - LED (light-emitting diode) cylinder lamp bulb - Google Patents
LED (light-emitting diode) cylinder lamp bulb Download PDFInfo
- Publication number
- CN201851935U CN201851935U CN2010205871951U CN201020587195U CN201851935U CN 201851935 U CN201851935 U CN 201851935U CN 2010205871951 U CN2010205871951 U CN 2010205871951U CN 201020587195 U CN201020587195 U CN 201020587195U CN 201851935 U CN201851935 U CN 201851935U
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- Prior art keywords
- led
- heat
- down lamp
- ball bubble
- radiator
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- 238000004020 luminiscence type Methods 0.000 claims description 19
- 239000000758 substrate Substances 0.000 claims description 12
- 239000004411 aluminium Substances 0.000 claims description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 4
- 229910052782 aluminium Inorganic materials 0.000 claims description 4
- 239000000853 adhesive Substances 0.000 claims description 3
- 230000001070 adhesive effect Effects 0.000 claims description 3
- 230000000694 effects Effects 0.000 abstract description 6
- 239000000428 dust Substances 0.000 abstract description 4
- 238000009825 accumulation Methods 0.000 abstract description 2
- 229920003023 plastic Polymers 0.000 description 7
- 239000004033 plastic Substances 0.000 description 7
- 238000013461 design Methods 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 4
- 238000005034 decoration Methods 0.000 description 3
- 230000003287 optical effect Effects 0.000 description 3
- 229910052799 carbon Inorganic materials 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- 238000005538 encapsulation Methods 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 238000004806 packaging method and process Methods 0.000 description 2
- 230000002035 prolonged effect Effects 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 229910001094 6061 aluminium alloy Inorganic materials 0.000 description 1
- 235000001674 Agaricus brunnescens Nutrition 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 241000196324 Embryophyta Species 0.000 description 1
- 240000000569 Musa basjoo Species 0.000 description 1
- 235000000139 Musa basjoo Nutrition 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- JRBRVDCKNXZZGH-UHFFFAOYSA-N alumane;copper Chemical class [AlH3].[Cu] JRBRVDCKNXZZGH-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000003139 buffering effect Effects 0.000 description 1
- 230000002860 competitive effect Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 230000003203 everyday effect Effects 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 230000004313 glare Effects 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000001795 light effect Effects 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 1
- 229910052753 mercury Inorganic materials 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 230000029553 photosynthesis Effects 0.000 description 1
- 238000010672 photosynthesis Methods 0.000 description 1
- 238000009877 rendering Methods 0.000 description 1
- 230000035807 sensation Effects 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 230000003746 surface roughness Effects 0.000 description 1
- 238000010301 surface-oxidation reaction Methods 0.000 description 1
- 238000002834 transmittance Methods 0.000 description 1
- 230000005068 transpiration Effects 0.000 description 1
- 238000009423 ventilation Methods 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Images
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- Non-Portable Lighting Devices Or Systems Thereof (AREA)
Abstract
The utility model provides an LED (light-emitting diode) cylinder lamp bulb which comprises a luminous unit and a radiating unit, wherein the luminous unit is arranged on the radiating unit; the radiating unit comprises a radiator, and the radiator comprises a main body and a plurality of radiating fins, the main body is particularly a cylindrical ring-shaped main body, and the radiating fins are uniformly distributed on the outer surface of the main body along the circumferential direction; and the section shapes of the radiating fins are gradually widened from the inner end part to the outer end part. The LED cylinder lamp bulb is provided with the wide and large radiating fins which can be in sufficient contact with air and the luminous unit, so as to well achieve the radiating effect; in addition, dust accumulation can be avoided after the LED cylinder lamp bulb is used for a long time.
Description
Technical field
The utility model relates to a kind of Down lamp ball bubble, relates in particular to a kind of LED Down lamp ball bubble.
Background technology
Bulb lamp generally is that a screw socket is arranged, and can directly load onto the light fixture of incandescent lamp or electricity-saving lamp.Down lamp is a kind of lighting that is embedded into light down-ejection type in the ceiling.Its maximum characteristics are exactly to keep the integral body of building decoration unified and perfect, can not destroy the perfect unity of furred ceiling art because of the setting of light fixture.This latent the putting property light fixture that is flush-mounted in ceiling inside, all light be projection downwards all, belongs to direct luminous intensity distribution.Can obtain different light effects with different reflectors, eyeglass, shutter, bulb.Down lamp does not take up space, and can increase the soft atmosphere in space, if want to build warm sensation, can try to install many Down lamps, alleviates space constriction.Generally in the hotel, family, coffee shop use more.
High-power LED tube light ball bubble is a kind of lighting that is embedded into light down-ejection type in the ceiling.High-power LED tube light ball bubble is to belong to the directional type lighting, has only its opposite just can be subjected to light, and beam angle belongs to optically focused, and light is more concentrated, and the light and shade contrast is strong.Outstanding more illuminated object, the lumen degree is higher, more sets off out quiet ambiance.
The characteristics of high-power LED tube light ball bubble are as follows:
Keep the integral body of building decoration unified and perfect, do not destroy the setting of light fixture, light source is hidden building decoration inside, and light source does not expose, free from glare, and people's visual effect is soft, even.
Energy saving: equal brightness power consumption is 1/4 of a common energy-saving lamp.The feature of environmental protection: harmful substance such as not mercurous, environmentally safe.(mercury that energy-saving fluorescent lamp contains can pollute 180 tons of water sources)
Economy: because of power saving can reduce electricity charge spendings, a year and a half recoverable light fixture cost.One family can be saved electricity charge dozens of yuan in one month.
Low-carbon (LC): power saving just is equal to and reduces the carbon emission amount.
Long-life type: the life-span of LED light fixture is 50,000 hours, uses every day six hours, is exactly the life-span in 20 years.
In the prior art, the radiating fin of the radiator that uses in the LED Down lamp ball bubble is the straight-tooth shape, and the contact-making surface of radiating fin and luminescence unit is just limited like this, can not reach the effect of heat radiation well, and radiating fin can not contact fully with air, uses dust to pile up for a long time.
Summary of the invention
Main purpose of the present utility model is to provide a kind of LED Down lamp ball bubble, and its heat that luminescence unit can be sent distributes effectively, has prolonged the service life of LED Down lamp ball bubble.
In order to achieve the above object, the utility model provides a kind of LED Down lamp ball bubble, comprises luminescence unit and heat-sink unit, wherein:
Described luminescence unit is arranged on the described heat-sink unit, and described luminescence unit comprises led chip;
Described heat-sink unit comprises radiator, and described radiator comprises body and radiating fin, wherein:
This body is that cylinder is ring-like, and along the circumferential direction is evenly distributed with a plurality of radiating fins at the outer surface of this body;
The cross sectional shape of described radiating fin is gradually wide from the outside end of inner end.
During enforcement, seamlessly transit by circular arc between the outer end of two described radiating fins.
During enforcement, described radiating fin is that aluminium is made.
During enforcement, described heat-sink unit also comprises heat-conducting piece, and described luminescence unit is arranged on the described heat-conducting piece, and described heat-conducting piece and described radiator adopt embedded interference fit.
During enforcement, described luminescence unit also comprises substrate, and described led chip is arranged on the described substrate, and described substrate is arranged on the described heat-sink unit.
During enforcement, described substrate is a pcb board, and described led chip adopts chip on board directly to adorn, and pastes on the described pcb board by adhesive or scolder, realizes electrical interconnection between this led chip and this pcb board by the lead-in wire bonding again.
Compared with prior art, the utility model provides the roomy radiating fin that fully contacts with air and luminescence unit, can reach the effect of heat radiation well, and can avoid permanent the use and the dust accretions of formation.
Description of drawings
Fig. 1 is the STRUCTURE DECOMPOSITION figure of an embodiment of LED Down lamp ball bubble described in the utility model;
Fig. 2 A, Fig. 2 B, Fig. 2 C are the radiator right view of the heat-sink unit that comprises of an embodiment of LED Down lamp described in the utility model, axially cutaway view, left view;
Fig. 3 A, Fig. 3 B are the sectional view of the working of plastics that comprises of an embodiment of LED Down lamp described in the utility model, axial cutaway view;
Fig. 4 A, Fig. 4 B, Fig. 4 C are the right view of the heat-conducting piece that comprises of an embodiment of LED Down lamp described in the utility model, axially cutaway view, left view;
Fig. 5 A, Fig. 5 B are the sectional view of the glass ball bulb that comprises of an embodiment of LED Down lamp described in the utility model, axial cutaway view.
The specific embodiment
The outside drawing of LED Down lamp ball described in the utility model bubble has been broken through the thoughtcast of traditional Down lamp from outward appearance and design concept.
As shown in Figure 1, as LED Down lamp ball bubble described in the utility model, comprise luminescence unit, heat-sink unit, lamp holder spare 13, working of plastics 14 and ball bubble 15;
Wherein, described luminescence unit is arranged at (not shown) on the described heat-sink unit;
Described luminescence unit comprises substrate and led chip, and described led chip is arranged on the described substrate, and described substrate is arranged on the described heat-sink unit.
Described led chip power can choose at random between 1 watt-8 watts.Described led chip can be one, also can be a plurality of, selects as required and arranges, and it also can be the led chip of integrated form.
During enforcement, described led chip is the high-power LED chip, and enough strong brightness can be provided, and satisfies the social demand of energy-conserving and environment-protective.
According to a kind of concrete embodiment, described substrate can be pcb board, described led chip adopts autonomous encapsulation to adopt the straight packing technique of chip on board, by adhesive or scolder this led chip is pasted on the pcb board, realize electrical interconnection between this led chip and pcb board by the lead-in wire bonding again, not only reduce packaging cost, and improved package power density greatly, reduced packaging thermal resistance.
According to a kind of concrete embodiment, described heat-sink unit comprises heat-conducting piece 121 and radiator 122, and described luminescence unit is arranged on the described heat-conducting piece 121, and described heat-conducting piece 121 and described radiator 122 adopt embedded interference fit.
The right view of described heat-conducting piece 121, axial cutaway view are shown in Fig. 4 A, Fig. 4 B.
The design of radiator 122 is subjected to the inspiration of the roomy blade of tropical plants---and the tropical plants blade is greatly to carry out photosynthesis in order more to accept sunlight, also is that the bigger transpiration of carrying out is taken away more moisture and unnecessary heat simultaneously.Come out as the stretching, extension as the branches and leaves, hang down as leaf of Japanese banana, roomy fin can contact fully with air.This moulding is ventilation and heat well, also can avoid the permanent accumulation of using the dust that causes.Ring is seen this radiator, and graceful fashion is brief remarkable.
Described radiator 122 comprises body and radiating fin, this body is the ring-like body of cylinder, and evenly along the circumferential direction be evenly distributed with a plurality of radiating fins at the outer surface of this body, described body and described radiating fin are one, both adopt the aluminium section of hollow to cut off the back one and process, and the cross sectional shape of described radiating fin is gradually wide from the outside end of inner end.
Described radiator 122 can be made for materials such as aluminium, copper, steel or aluminium coppers.
And,, shown in Fig. 2 A, seamlessly transit by circular arc between the outer end of two described radiating fins according to a kind of concrete embodiment;
During enforcement, the cross sectional shape of described radiating fin can also be for trapezoidal, T shape or other by the center of circle to the gradually wide shape of circumference.
The radiator that the utility model adopts compared with prior art, has bigger area of dissipation, can reach better radiating effect.
Inner surface at this body is provided with a plurality of fixed parts, and this fixed part is used for for the embedded interference fit of described heat-conducting piece.
According to a kind of concrete embodiment, shown in Fig. 2 A, Fig. 2 B, the specification requirement of described radiator 122 is as follows: 1, material: 6061 aluminium respectively for the right view of radiator 122 described in the utility model and axial cutaway view; 2, not annotating tolerance determines by GB/T1804-m; 3, surface oxidation treatment; 4, do not annotate chamfering R0.1; 5, surface roughness Ra 0/02.
It is the problem that those skilled in the art are devoted to solve that the heat that led chip in the LED Down lamp ball bubble is sent carries out efficiently radiates heat always, fin by particular design in the LED Down lamp ball bubble described in the utility model, can be so that heat obtain discharging effectively, thus life-span of LED Down lamp ball bubble prolonged.
Described radiator 122 is fixedlyed connected with described lamp holder spare 13 by described working of plastics 14, wherein, adopts screw to fix between described radiator 122 and the described working of plastics 14, passes through the rivet interlock between described working of plastics 14 and the described lamp holder spare 13.
Described working of plastics 14 is for play the effect of buffering between described radiator 122 and described lamp holder spare 13, shown in Fig. 3 A, Fig. 3 B, is the sectional view of a kind of specific embodiment of described working of plastics 14, axial cutaway view.
Described lamp holder spare 13 comprises the power interface that is positioned at the one end, and described power interface is electrically connected with described luminescence unit.
Described power interface can be screw socket, buckle or a socket (socket is used for shot-light more) common on the general bulb.Electrode on the described power interface is used for that point is connected with the contact of extraneous power supply, and this electrode also is electrically connected with described luminescence unit by power line.
Described lamp holder spare 13 can adopt screw socket E27, E14 standard component, is convenient to install and change.
Described ball bubble 15 can be made for glass, adopts the mushroom hair style moulding, and light transmittance reaches 90%, shown in Fig. 5 A, Fig. 5 B, is the sectional view of described ball bubble 15, axial cutaway view.
According to a kind of concrete embodiment, described ball bubble 15 has reflecting effect, can be so that light becomes softer.As required, described ball bubble 15 can be selected shades of colour for use, makes LED ball bubble etc. can send the light of selected color.
The advantage of LED lighting and traditional lighting is as follows:
Compare with the traditional lighting light fixture, the LED light fixture does not need to use optical filtering or optical filter to produce coloured light, efficient height, photochromic pure not only, and can realize dynamically or the color change of gradual change.When changing colour temperature, keep having high colour rendering index, satisfy different application needs.But its encapsulation has also been proposed new requirement, has been embodied in:
(1) modularization:
Can realize good lumen output stack by interconnecting of a plurality of LED lamps (or module), satisfy the requirement of highlight illumination.By modular technology, a plurality of spot lights or led module can be made up according to random shape, satisfy the lighting requirement of different field.
(2) system effectiveness maximization:
Be to improve the light extraction efficiency of LED light fixture, except the suitable LED power supply of needs, also must adopt radiator structure and technology efficiently, and optimize the inside/outside optical design, to improve whole system efficient.
(3) low cost:
The LED light fixture will move towards market, must possess competitive advantage (mainly referring to the initial stage installation cost) on cost, and be encapsulated in accounted in the whole LED light fixture production cost very most of, therefore, adopting novel package structure and technology, improve light efficiency/cost ratio, is to realize the commercial key of LED light fixture.
(4) be easy to replace and safeguard:
Because the led light source life-span is long, maintenance cost is low, and therefore the package reliability to the LED light fixture has proposed higher requirement.Require the LED Design of Luminaires to be easy to improve and encapsulate requirement, and require the interchangeability of led chip to get well, so which kind of chip light fixture manufacturer oneself selects to adopt to adapt to the higher LED chip of following efficient.
More than explanation is just illustrative for the utility model; and it is nonrestrictive; those of ordinary skills understand; under the situation of the spirit and scope that do not break away from following claims and limited; can make many modifications; change, or equivalence, but all will fall in the protection domain of the present utility model.
Claims (6)
1. a LED Down lamp ball bubble is characterized in that, comprises luminescence unit and heat-sink unit, wherein,
Described luminescence unit is arranged on the described heat-sink unit, and described luminescence unit comprises led chip;
Described heat-sink unit comprises radiator, and described radiator comprises body and radiating fin, wherein,
This body is that cylinder is ring-like, and along the circumferential direction is evenly distributed with a plurality of radiating fins at the outer surface of this body;
The cross sectional shape of described radiating fin is gradually wide from the outside end of inner end.
2. LED Down lamp ball bubble according to claim 1 is characterized in that, seamlessly transits by circular arc between the outer end of two described radiating fins.
3. LED Down lamp ball bubble according to claim 2 is characterized in that described radiating fin is that aluminium is made.
4. LED Down lamp ball bubble according to claim 3 is characterized in that described heat-sink unit also comprises heat-conducting piece, and described luminescence unit is arranged on the described heat-conducting piece, and described heat-conducting piece and described radiator adopt embedded interference fit.
5. according to the described LED Down lamp of arbitrary claim ball bubble in the claim 1 to 4, it is characterized in that described luminescence unit also comprises substrate, described led chip is arranged on the described substrate, and described substrate is arranged on the described heat-sink unit.
6. LED Down lamp ball bubble according to claim 5, it is characterized in that described substrate is a pcb board, described led chip adopts chip on board directly to adorn, paste on the described pcb board by adhesive or scolder, realize electrical interconnection between this led chip and this pcb board by the lead-in wire bonding again.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010205871951U CN201851935U (en) | 2010-11-02 | 2010-11-02 | LED (light-emitting diode) cylinder lamp bulb |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010205871951U CN201851935U (en) | 2010-11-02 | 2010-11-02 | LED (light-emitting diode) cylinder lamp bulb |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201851935U true CN201851935U (en) | 2011-06-01 |
Family
ID=44094326
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010205871951U Expired - Fee Related CN201851935U (en) | 2010-11-02 | 2010-11-02 | LED (light-emitting diode) cylinder lamp bulb |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201851935U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102927481A (en) * | 2011-11-25 | 2013-02-13 | 俞国宏 | High-power LED lamp |
-
2010
- 2010-11-02 CN CN2010205871951U patent/CN201851935U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102927481A (en) * | 2011-11-25 | 2013-02-13 | 俞国宏 | High-power LED lamp |
| CN102927481B (en) * | 2011-11-25 | 2013-11-20 | 俞国宏 | High-power LED lamp |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| ASS | Succession or assignment of patent right |
Owner name: CHINA SHIPBUILDING YONGZHI TAIXING ELECTRONICS TEC Free format text: FORMER OWNER: XIONG ZHI Effective date: 20131226 |
|
| C41 | Transfer of patent application or patent right or utility model | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20131226 Address after: 225400, Sanlian Village, Binjiang Town, Taixing, Jiangsu (No. three South 9 Ring Road) Patentee after: ZHONGCHUAN YONGZHI TAIXING ELECTRONIC TECHNOLOGY CO., LTD. Address before: 225400, Jiangsu City, Taixing Province West Industrial Gathering Zone in the boat wing Chi Taixing Electronic Technology Co., Ltd. Patentee before: Xiong Zhi |
|
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20110601 Termination date: 20141102 |
|
| EXPY | Termination of patent right or utility model |