CN201833094U - Pressing die head - Google Patents
Pressing die head Download PDFInfo
- Publication number
- CN201833094U CN201833094U CN2010205981896U CN201020598189U CN201833094U CN 201833094 U CN201833094 U CN 201833094U CN 2010205981896 U CN2010205981896 U CN 2010205981896U CN 201020598189 U CN201020598189 U CN 201020598189U CN 201833094 U CN201833094 U CN 201833094U
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- CN
- China
- Prior art keywords
- pressing die
- head
- die head
- installation
- installation head
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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Abstract
The utility model discloses a pressing die head, which comprises an installation head and a pressing die head, wherein the installation head is used for matching with a heating rod, the pressing die head is used for leveling soft solder, and the installation head and the pressing die head are manufactured integrally. An annular radial groove is arranged on the outer periphery of the installation head; the end face of the pressing die head is a pressing die face with concave-convex lines; a pair of mutually symmetric radial clamping grooves are axially arranged on the root of the annular radial groove of the installation head; a positioning ball recess is arranged on the upper face of the installation head; the upper portion of the installation head is cylindrical; the lower portion of the installation head is square; and two lateral faces of each radial clamping groove are connected by the aid of a circular arc face. The pressing die head is accurate in installation and positioning, and pressing die quality is improved.
Description
Technical field
The utility model relates to a kind of pressing die head.
Background technology
Pressing die head described in the utility model is to be used for pressing die head by the slicken solder die Bonder that the leveling of chip and lead frame is bonding.Described pressing die head is equipped mutually with heating rod.
Installation of pressing die head at present and location need be realized by special frock, and installation process is relatively more difficult, also has the possibility of being scalded by high temperature.In process of production, tend to die pressing surface because of pressing die head not on the same level face, and it is uneven to cause slicken solder to press easily, thereby makes that slicken solder moulded section is bad, and directly influence the quality of product.
Summary of the invention
The purpose of this utility model is to provide a kind of pressing die head of accurate positioning being installed and improving the pressing mold quality.
In order to achieve the above object, the technical solution of the utility model is; A kind of pressing die head, comprise and being used for and heating rod installation head that is equipped with and the pressing die head that is used for flattening slicken solder, described installation head and pressing die head are made one, has the annular radial groove on the periphery of installation head, the end face of pressing die head is the die pressing surface with concave convex texture, install on the root of annular radial groove of head and have a pair of radially card holding trough of arranging vertically symmetrically, install on the upper surface of head and have the setting circle spherical pit.
In technique scheme:
The top of described installation head is cylindrical, and the bottom is the square bodily form.
The two sides of described radially card holding trough all connect by arc surface.
After adopting said structure, owing on the root of the annular radial groove that head is installed, have a pair of radially card holding trough of arranging vertically symmetrically, clamp with symmetrical projection on the pressing mold heating rod and to cooperate, controlled the axial rotation of pressing die head, and installed on the upper surface of head and have the setting circle spherical pit, cooperated with hemispherical projections on the pressing mold heating plate, controlled the radial location of pressing die head, therefore accurate positioning is installed, the moulded section of pressing mold workpiece is good, has improved the pressing mold quality.
Description of drawings
Fig. 1 is a structural representation of the present utility model;
Fig. 2 is the left view of Fig. 1;
Fig. 3 is the vertical view of Fig. 1;
Fig. 4 is the upward view of Fig. 1;
Fig. 5 is the A-A cutaway view among Fig. 1;
Fig. 6 is the B-B cutaway view among Fig. 2.
The specific embodiment
The embodiment that provides below in conjunction with accompanying drawing is described in further detail the utility model.
Shown in Fig. 1,2,3,4,5,6, a kind of pressing die head, comprise and be used for the equipped installation of heating rod 1 and be used for flattening the pressing die head 2 of slicken solder, described installation 1 and pressing die head 2 are made one, install on 1 the periphery and have annular radial groove 1-1, the end face of pressing die head 2 is the die pressing surface 2-1 with concave convex texture, install on the root of an annular radial groove 1-1 of 1 and have a pair of radially card holding trough 1-2 that arranges vertically symmetrically, install on 1 the upper surface and have setting circle spherical pit 1-3.
Referring to shown in Figure 3, the cylindrical 1-4 in top of described installation 1, the bottom is square bodily form 1-5.
Referring to shown in Figure 2, the two sides 1-2-1 of described radially card holding trough 1-2 all connects by arc surface 1-2-2.
Claims (3)
1. pressing die head, comprise and be used for the equipped installation head (1) of heating rod and be used for flattening the pressing die head (2) of slicken solder, described installation head (1) and pressing die head (2) are made one, has annular radial groove (1-1) on the periphery of installation head (1), the end face of pressing die head (2) is the die pressing surface (2-1) with concave convex texture, it is characterized in that: have a pair of radially card holding trough of arranging vertically symmetrically (1-2) on the root of the annular radial groove (1-1) of installation head (1), have setting circle spherical pit (1-3) on the upper surface of installation (1).
2. pressing die head according to claim 1 is characterized in that: the described top cylindrical (1-4) that head (1) is installed, the bottom is the square bodily form (1-5).
3. pressing die head according to claim 1 is characterized in that: the two sides (1-2-1) of described radially card holding trough (1-2) all connect by arc surface (1-2-2).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010205981896U CN201833094U (en) | 2010-11-01 | 2010-11-01 | Pressing die head |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010205981896U CN201833094U (en) | 2010-11-01 | 2010-11-01 | Pressing die head |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201833094U true CN201833094U (en) | 2011-05-18 |
Family
ID=44003189
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010205981896U Expired - Lifetime CN201833094U (en) | 2010-11-01 | 2010-11-01 | Pressing die head |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201833094U (en) |
-
2010
- 2010-11-01 CN CN2010205981896U patent/CN201833094U/en not_active Expired - Lifetime
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C56 | Change in the name or address of the patentee | ||
| CP03 | Change of name, title or address |
Address after: 213022 Changzhou, North New District, Jiangsu Yangtze River Road, No. 19 Patentee after: Changzhou Galaxy century microelectronics Limited by Share Ltd Address before: 213022 Chaohu Road, Xinbei District, Jiangsu, China, No. 208, No. Patentee before: Changzhou Galaxy Century Micro-Electronics Co., Ltd. |
|
| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20110518 |