CN201823674U - Glue feeding mechanism - Google Patents
Glue feeding mechanism Download PDFInfo
- Publication number
- CN201823674U CN201823674U CN2010202659218U CN201020265921U CN201823674U CN 201823674 U CN201823674 U CN 201823674U CN 2010202659218 U CN2010202659218 U CN 2010202659218U CN 201020265921 U CN201020265921 U CN 201020265921U CN 201823674 U CN201823674 U CN 201823674U
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- mentioned
- pin
- jacking block
- plate
- groove
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Abstract
The utility model provides a glue feeding mechanism which is applied in an upper fixing plate, a cavity plate and a core plate of a die. The glue feed mechanism is characterized in that the feed mechanism includes a flow channel, a convex piece, a grabbing pin and an elastic element. The flow channel is arranged in the upper fixing plate and the cavity plate; the convex piece is arranged in the cavity plate in a sliding way; a first groove is arranged in the convex piece; one end of the grabbing pin is arranged in a core insert in a sliding way and is matched with a limiting part arranged in a cavity insert; the other end of the grabbing pin is arranged in the convex piece, is matched with the convex piece through a pin, and is matched with the flow channel; and the elastic element is arranged in the first groove of the convex piece and a second groove of the cavity plate, and is externally sheathed on the grabbing pin. The glue feeding mechanism has simple structure and low cost, is convenient to process, and does not need to consider limiting to the stroke of third die sinking; moreover, a vertical flow channel in a sprue bushing is short and small, which is easy to be cooled without water channel cooling, thus greatly shortening the shaping period and being convenient to assemble and disassemble.
Description
[technical field]
The relevant a kind of gluing mechanism that advances of the utility model particularly a kind ofly advances gluing mechanism about two plate half module pin marks.
[background technology]
When product needed pin mark mode is advanced glue, we can adopt three template die pin marks to advance gluing mechanism to be directed to some products, because of the glue point that advances of these products requires restricted, so can only adopt the above-mentioned gluing mechanism that advances, and three template die pin marks advance gluing mechanism and advance gluing mechanism with respect to two plate half module pin marks and increased part mechanisms such as switch-plate, and it is as follows that existing three template die pin marks advance gluing mechanism:
Fig. 1 illustrates the structural representation that existing three template die pin marks advance gluing mechanism.
With reference to shown in Figure 1, existing three template die pin marks advance gluing mechanism, die sinking for the first time, promotion upper mounted plate 101 at injection moulding board (not indicating among the figure) separates caster 103 with switch-plate 102, make pull bar 11 cooperate fully with caster 103, at this moment, runner 12 breaks away from caster 103 fully, die sinking for the second time, thereby pull bar 11 drives limited block 13 and promotes switch-plate 102 motions, limiting section 1011 behind the motion certain distance in limited block 13 and the upper mounted plate 101 matches, and this moment, upper mounted plate 101 separated with switch-plate 102, and material grasping pin 14 separates fully with runner 12, and runner 12 also breaks away from upper mounted plate 101 fully, next take out runner 12, carry out die sinking for the third time, finally take out product.
In present embodiment, mould need increase switch-plate 102, makes mould structure comparatively complicated, increases the die holder expense of getting the raw materials ready; Mold height increases, and increases the die holder expense of getting the raw materials ready; Perpendicular runner is long, and cool time is long, must adopt the water route cooling just can guarantee to shorten molding cycle.
[summary of the invention]
In view of this, the purpose of this utility model is to provide a kind of gluing mechanism that advances, and is short and small to realize the perpendicular runner in the geat cover, is easy to cooling, need not the water route cooling, shortens molding cycle greatly, and the stroke that need not to consider to limit die sinking for the third time simple in structure.
For reaching above-mentioned purpose, of the present utility modelly advance gluing mechanism, it is applied in upper mounted plate, caster and the male model plate of a mould, and this advances gluing mechanism and comprises:
Runner, it is located in said fixing plate and the caster;
Jacking block, its slip are located in the above-mentioned caster, are provided with one first groove in this jacking block;
Material grasping pin, one end slide and to be located in the male model benevolence, and the limiting section that is provided with in this end and the mother module core matches, and the other end is located in the above-mentioned jacking block, and matches with jacking block by a pin, and cooperates with above-mentioned runner;
Flexible member, it is located in second groove of first groove of above-mentioned jacking block and mother module core, and is sheathed on above-mentioned material grasping pin outward;
Wherein, this jacking block contacts with above-mentioned runner near an end face of upper mounted plate during matched moulds.
Especially, above-mentioned flexible member is a spring.
Compared to prior art, of the present utility model to advance gluing mechanism simple in structure, and cost is low, is convenient to processing, need not to consider to limit the stroke of die sinking for the third time; Perpendicular runner in the geat cover is short and small, is easy to cooling, need not the water route cooling, shortens molding cycle greatly, dismounting convenient for assembly.
[description of drawings]
Fig. 1 illustrates the structural representation that existing three template die pin marks advance gluing mechanism.
Fig. 2 illustrates the structural representation that advances the matched moulds state of gluing mechanism of the present utility model.
The structural representation of first state when Fig. 3 illustrates die sinking of advancing gluing mechanism of the present utility model.
The structural representation of second state when Fig. 4 illustrates die sinking of advancing gluing mechanism of the present utility model.
The structural representation of third state when Fig. 5 illustrates die sinking of advancing gluing mechanism of the present utility model.
[specific embodiment]
See also shown in Figure 2ly, it is the structural representation that advances the matched moulds state of gluing mechanism of the present utility model.
Of the present utility modelly advance gluing mechanism, be applied in upper mounted plate 201, caster 202 and the male model plate 203 of a mould, this advances gluing mechanism and comprises:
Runner 21, it is located in said fixing plate 201 and the caster 202;
With reference to shown in Figure 3, the structural representation of its first state during for die sinking of advancing gluing mechanism of the present utility model.In present embodiment, after the die sinking, upper mounted plate 201 separates with caster 202, runner 21 drives material grasping pins 23 and slides, the stop motion when distance of separating with caster 202 when upper mounted plate 201 is S, at this moment, one end of material grasping pin 23 contacts with limiting section 2022, in this process, spring 24 elongations promote jacking block 22 and break away from caster 202 motions; And runner 21 breaks away from product (not indicating among the figure), withdraws from mother module core 2021.
With reference to shown in Figure 4, the structural representation of its second state during for die sinking of advancing gluing mechanism of the present utility model.One end of above-mentioned material grasping pin 23 is subjected to limiting section 2022 card posts, so runner 21 can not be with upper mounted plate 201 motions, material grasping pin 23 drives runner 21 and breaks away from upper mounted plate 201, make runner 21 break away from upper mounted plate 201 fully, when the pull bar in the mould 204 be subjected to caster 202 spacing after stop motion, finish die sinking for the first time.
With reference to shown in Figure 5, the structural representation of its third state during for die sinking of advancing gluing mechanism of the present utility model.During die sinking for the second time, runner 21 and shaped article 205 are taken out in product 205 moulding this moment.
Claims (2)
1. one kind is advanced gluing mechanism, and it is applied to it is characterized in that this advances gluing mechanism and comprises in upper mounted plate, caster and the male model plate of a mould:
Runner, it is located in said fixing plate and the caster;
Jacking block, its slip are located in the above-mentioned caster, are provided with one first groove in this jacking block;
Material grasping pin, one end slide and to be located in the male model benevolence, and the limiting section that is provided with in this end and the mother module core matches, and the other end is located in the above-mentioned jacking block, and matches with jacking block by a pin, and cooperates with above-mentioned runner;
Flexible member, it is located in second groove of first groove of above-mentioned jacking block and mother module core, and is sheathed on above-mentioned material grasping pin outward;
Wherein, this jacking block contacts with above-mentioned runner near an end face of upper mounted plate during matched moulds.
2. as claimed in claim 1ly advance gluing mechanism, it is characterized in that above-mentioned flexible member is a spring.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010202659218U CN201823674U (en) | 2010-07-21 | 2010-07-21 | Glue feeding mechanism |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010202659218U CN201823674U (en) | 2010-07-21 | 2010-07-21 | Glue feeding mechanism |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201823674U true CN201823674U (en) | 2011-05-11 |
Family
ID=43962234
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010202659218U Expired - Fee Related CN201823674U (en) | 2010-07-21 | 2010-07-21 | Glue feeding mechanism |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201823674U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103660152A (en) * | 2012-09-25 | 2014-03-26 | 汉达精密电子(昆山)有限公司 | Bi-color mold lapping and gluing mechanism |
-
2010
- 2010-07-21 CN CN2010202659218U patent/CN201823674U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103660152A (en) * | 2012-09-25 | 2014-03-26 | 汉达精密电子(昆山)有限公司 | Bi-color mold lapping and gluing mechanism |
| CN103660152B (en) * | 2012-09-25 | 2016-04-20 | 汉达精密电子(昆山)有限公司 | Double color mould overlaps into gluing mechanism |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20110511 Termination date: 20150721 |
|
| EXPY | Termination of patent right or utility model |