CN201820745U - Cutting type split die for IC products - Google Patents

Abstract

The utility model discloses a cutting type split die for IC products, which comprises a split upper die, a split lower die and a pre-split die, wherein the pre-split die is composed of a precutting upper die (1) and a precutting lower die (3), and the precutting lower die (3) is provided with a V-shaped knife edge (2). A V-shaped notch (4) is precut on the lower part of a pin (5) by using the V-shaped knife edge (2), and the upper die and lower die of the split die are closed to pull the pin (5) apart at the V-shaped notch (4), so that the pin can be easily pulled apart, and the residual part of the pin is short and uniform.

Description

Shearing IC product peel of mould

Technical field

The utility model relates to a kind of shearing IC product peel of mould, comprises separating patrix and separating counterdie.

Background technology

The IC product peel of mould that the applicant produces use in early days comprises the separation patrix and separates counterdie, adopts the mode of breaking that shaped article is separated with lead frame during the upper and lower mould matched moulds, with sucker product sucking-off mould is put into the array platform, and sabot is dispatched from the factory.Because the colloid thickness of present encapsulating products is more and more thinner, pin outward appearance and dimensional requirement are also more and more stricter, adopt this peel of mould carry out the IC product separate usually cause the residual excessive of pin and up and down plastic-sealed body peel off, so just be difficult to satisfy the growth requirement in market.

The utility model content

The technical problems to be solved in the utility model provides residual little, the IC product peel of mould do not peeled off of plastic-sealed body up and down of a kind of pin.

In order to solve the problems of the technologies described above, shearing IC product peel of mould of the present utility model comprises and separates patrix and separate counterdie, described separation patrix with separate counterdie outside set up the pre-separation mould, by cutting patrix in advance and downcutting mould in advance and form, downcut in advance the V-arrangement edge of a knife is set on the mould.Increase above-mentioned pre-separation mould, be used for below pin, cutting in advance a V-shaped part, make that like this IC product pin that separates is residual little and consistent; Help separating patrix simultaneously and separate the counterdie matched moulds and break pin, be unlikely to make up and down plastic-sealed body to be peeled off.

Description of drawings

Fig. 1 is the longitudinal section of pre-separation mould.

Fig. 2 cuts schematic diagram in advance for V-arrangement.

Embodiment

Below in conjunction with accompanying drawing embodiment of the present utility model is elaborated.

Fig. 1, Fig. 2 show the concrete structure of pre-separation mould of the present utility model, comprise cutting patrix 1 in advance, downcutting mould 3 and be arranged on the V-arrangement edge of a knife 2 on the pre-cutting-out mould 3 in advance.The pre-separation mould is used for cutting in advance a V-shaped part 4 below pin 5.Then by the upper and lower mould matched moulds of peel of mould, adopt the mode broken shaped article to be separated with lead frame from V-shaped part 4, so just break and be easy to and residual weak point of pin and unanimity.With sucker product sucking-off mould is put into the array platform at last, sabot is dispatched from the factory.

Claims (1)

1. a shearing IC product peel of mould comprises and separates patrix and separate counterdie, it is characterized in that: set up the pre-separation mould, by cutting patrix (1) in advance and downcutting mould (3) in advance and form, downcut in advance the V-arrangement edge of a knife (2) is set on the mould (3).

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