CN201780181U - Pressure transmitter provided with encapsulated sensor - Google Patents

Pressure transmitter provided with encapsulated sensor Download PDF

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Publication number
CN201780181U
CN201780181U CN201020271951XU CN201020271951U CN201780181U CN 201780181 U CN201780181 U CN 201780181U CN 201020271951X U CN201020271951X U CN 201020271951XU CN 201020271951 U CN201020271951 U CN 201020271951U CN 201780181 U CN201780181 U CN 201780181U
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CN
China
Prior art keywords
flange
pressure unit
sensor
flange body
signal processing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201020271951XU
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Chinese (zh)
Inventor
石培飞
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ZHEJIANG ODELI TECHNOLOGY Co Ltd
Original Assignee
ZHEJIANG ODELI TECHNOLOGY Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
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Priority to CN201020271951XU priority Critical patent/CN201780181U/en
Application granted granted Critical
Publication of CN201780181U publication Critical patent/CN201780181U/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Abstract

The utility model relates to a field pressure measuring device and aims to provide a pressure transmitter provided with an encapsulated sensor. The pressure transmitter comprises an encapsulated sensor; the encapsulated sensor comprises a flange with a hollow flange face; an annulated column shaped interface end protruding out of the flange face is arranged at the middle part of the front side of the flange face; a hollow flange body is arranged on the rear side of the flange face; a sensor is mounted at the front end of the inner part of the flange body; a signal wire led out from the sensor is connected to a signal processing unit; a main circuit connection conducting wire is led out from the rear end of the signal processing unit and is connected to a modularized main circuit board; the signal processing unit is hermetically fixed at the rear end of the inner part of the flange body through epoxy resin used for encapsulation; and threads are formed at the outer part of the annulated column shaped interface end. The product has a small volume, is mounted more conveniently, has less field mounting accessories, lowers the cost of field mounting, greatly reduce the maintenance time and the maintenance cost, and brings great convenience and economic benefit.

Description

Pressure unit with encapsulation type sensor
Technical field
The utility model relates to the pressure field measuring instrument, and more particularly, the utility model relates to a kind of pressure unit with encapsulation type sensor.
Background technology
Sensor section, electronic circuit plate portion, housing parts are the main three parts of decomposition pressure transmitter.
Following characteristics are arranged on traditional pressure unit structure:
Former pressure equally adopts the metal capacitance sensor with differential pressure pick-up, and the impulse parts adopt two flange arrangements, material cost, and overall volume, complete machine weight is all similar to differential pressure transmitter, but a side flange is only used at the scene, causes the waste on the cost.
Industry spot often is that dust is more, aqueous vapor is heavier even has corrosive gas, if circuit is not carried out protective treatment, can have influence on the long-term reliability of product in industry spot.In the processing of electronic circuit board, the general spraying three anti-lacquers that adopt carry out three anti-processing.Adopt the circuit board after three anti-lacquers are handled, has reasonable protection effect for general dust and static, but because all components and parts all leak outside in the PCB circuit board top, may install or dismantle in the electronic unit process, owing to reason such as colliding with, drop, cause the damage of components and parts on the circuit board, thereby cause the electronic unit fault.In addition, because the three anti-normally extremely thin protective seams of one deck that coat with lacquer, in use at the scene for a long time; perhaps in the transportation of electronic unit, installation process; all might cause this protective seam local damage, thereby lose three anti-abilities owing to reasons such as colliding, fall.
Traditional transmitter electronic unit and sensor are corresponding one by one.If the electronic unit of a transmitter is changed on another transmitter, just must carry out operations such as linearization, temperature compensation again, these operations are not only wasted time and energy, and also can't carry out at the scene.If at certain scene, because artificial reason, cause the fault of electronic unit, because can not combination in any between electronic unit and the sensor, just can only depot repair, not only can strengthen maintenance cost, prolongation servicing time, and make troubles to the onsite user.
Utility model Inner holds
The technical problems to be solved in the utility model is, overcomes the deficiencies in the prior art, and a kind of pressure unit with encapsulation type sensor is provided.
In order to solve the problems of the technologies described above, the utility model is achieved through the following technical solutions:
The utility model provides a kind of pressure unit with encapsulation type sensor, comprises housing and is located at the interior modularized main circuit board of housing, and this pressure unit has an encapsulation type sensor; Described encapsulation type sensor comprises a flange with hollow flange face, and the central column interface end that protrudes from flange face is established at the middle part, front side of flange face; The rear side of flange face is the flange body of hollow, and a sensor is installed in the front end of described flange body inside, and sensor is drawn signal wire and is connected to signal processing unit; The signal processing unit rear end is drawn main circuit and is connected lead and be connected to described modularized main circuit board; The epoxy resin that is used for embedding is sealingly fastened in signal processing unit the rear end of flange body inside; Screw thread is established in the outside of described central column interface end.
As a kind of improvement, to establish on the inwall of described flange body near first platform of flange face with near second platform of flange body rear end, the surface of two platforms is all perpendicular to the axis direction of flange; Be terminated at the surface of first platform before the sensor, its rear end is provided with a set collar, and is fixed ring and then fixation of sensor by gland nut; Be terminated at the surface of second platform before the signal processing unit.
As a kind of improvement, extend to the flange body rear always on described central column interface end interior bone surface, until joining with first platform.
As a kind of improvement, at least three support fixed orifices are set on the described flange face, establish screw thread in the support fixed orifice.
As a kind of improvement, the outside of described central column interface end is oppositely arranged parallel twice open slot.
As a kind of improvement, the front end of described flange body is provided with housing tightening groove.
As a kind of improvement, on the described flange body bleeder vent is set.
As a kind of improvement, the housing connecting portion is established in described flange body outside, on the housing connecting portion screw thread is set.
As a kind of improvement, the seal groove of annular, the built-in O-ring seals of seal groove are established in described flange body outside.
As a kind of improvement, described electronic circuit plate portion all adopts modular construction.
Compared with prior art, the beneficial effects of the utility model are:
The pressure unit that the utility model provides has realized that with sensor, signal processing unit and built-in memory device be an integral body with the direct embedding of epoxy resin directly.Compare the former pressure unit of two flange arrangements, the volume dexterity is installed more conveniently, and has reduced on-the-spot installation accessories, has reduced on-the-spot installation cost.Need not after like this parts being changed to demarcate, only need carry out simple configuration, can satisfy on-the-spot request for utilization electronic unit.Dwindle servicing time greatly, reduced the cost of maintenance.Simultaneously,, also can reduce the quantity of on-the-spot standby redundancy because electronic unit and sensor exchange, thereby to bringing great convenience property of on-site customer and economic benefit.
The all main chip of the utility model all are potted in the plastic housing by epoxy resin, and the welding pin seldom of exposure has also carried out three anti-processing.General collision, fall the operate as normal that can not have influence on main circuit, not only effectively reduce the influence that on-the-spot dust, aqueous vapor etc. may cause the circuit operate as normal, and improved the shock resistance of circuit board greatly, improved the on-the-spot reliability of instrument.
Description of drawings
Fig. 1 is the sectional view of flange in the utility model;
Fig. 2 is the flange sectional view of diffuse si sensor;
Fig. 3 be among Fig. 1 B to view;
Fig. 4, Fig. 5 are the structural representation with encapsulation type sensor;
Fig. 6 is the structural representation of pressure unit;
Fig. 7 is the theory diagram of the utility model core circuit.
Reference numeral among the figure is: 1. flange face; 2. interface end; 3. screw thread; 4. flange body; 5. housing connecting portion; 6. seal groove; 7. housing tightening groove; 9. open slot; 10. support fixed orifice; 11. sensor; 12. gland nut; 13. signal processing unit; 14. epoxy resin; 15. main circuit connects lead; 16. main casing; 17. bonnet; 18. protecgulum; 19. modular circuit board; 21. connection terminal; 23. first platform; 24. second platform.
Embodiment
Below in conjunction with accompanying drawing the utility model is described in further detail, but not as to qualification of the present utility model.
The flange arrangement of present embodiment pressure unit as shown in Figure 1 to Figure 3.
This flange comprises: the flange face 1 of hollow, and the central column interface end 2 that protrudes from flange face is established at its middle part, front side, and screw thread 3 is established in the outside of interface end 2, and the outside is oppositely arranged parallel twice open slot 9.At least three support fixed orifices 10 are set on the flange face, establish screw thread in the support fixed orifice 10.The rear side of flange face 1 is the flange body 4 of hollow, and the housing connecting portion 5 and the annular seal groove 6 of bleeder vent, annular, seal groove 6 built-in O-ring seals are established in its outside.The front end in flange body 4 outsides is provided with housing tightening groove 7.Establish on the inwall of flange body 4 near first platform 23 of flange face 1 with near second platform of flange body 4 rear inner wall, the surface of two platforms is all perpendicular to the axis direction of flange.Extend to flange main body 4 rear ends always on described central column interface end 2 interior bone surfaces, until joining with first platform 23.
In the present embodiment, O-ring seals can be selected the nitrile rubber material for use.Bleeder vent is used to realize that the sensor reference value is an atmospheric pressure; Housing tightening groove 7 is used for final assembly finish after, use screw that housing is fixed on the flange body 4; The outside of interface end 2 is established screw thread 3 and is used for the field process connection, can select 1/2NPT or other on-the-spot connected mode that needs for use; Open slot 9 is mainly convenient on-the-spot installation and design; Support fixed orifice 10 is used for whole pressure unit is fixed on the on-the-spot support; Housing connecting portion 5 is that sensor flange body 4 is connected with the process of housing.
Fig. 4, the 5th, the application example of flange in the present embodiment promptly has encapsulation type sensor.
Among Fig. 4, sensor 11 (can adopt ceramic capacitive sensor, diffuse si or other) is contained in the inside of flange body 4, is terminated at the surface of first platform 23 before it, by gland nut 12 set collar is compressed its rear end and realizes the fixing of sensor 11.Sensor 11 is drawn signal wire, and detected signal is connected to signal processing unit 13.Signal processing unit 13 also is the inside that is contained in flange body 4, is terminated at the surface of second platform 24 before it, and its rear end is drawn main circuit and connected lead 15; Main circuit connects the socket on the lead 15 connection mode blocking main circuit boards 19, is designed to plug type easily.By epoxy resin 14 with signal processing unit 13 embeddings on flange body 4, realize having the encapsulation type sensor structure.
It among Fig. 6 the structural representation behind setting pressure transmitter accessory and housing.
As can be seen from Figure, pressure unit by have encapsulation type sensor, housing, and circuit board form, its middle shell is made up of main casing 16, protecgulum 18, bonnet 17.Having the connecting thread that encapsulation type sensor is provided with on housing connecting portion 5 is connected with the housing assembling; The DC24V power supply gives modularized main circuit board 19 power supplies by feedthrough capacitor behind connection terminal; Sensor 11 information also connect lead 15 by main circuit and receive modularized main circuit board 19; Adopt modular design at the electronic circuit plate portion, the circuit design of difference in functionality is become different modules, and respectively each module is carried out the epoxy resin embedding.After each module of process embedding is welded to main circuit, carry out three anti-processing again.
Using the pressure transducer product in the present embodiment, is an integral body with the direct embedding of epoxy resin directly with sensor, signal processing unit and built-in memory device.Compare the former pressure unit of two flange arrangements, the volume dexterity is installed more conveniently, and has reduced on-the-spot installation accessories, has reduced on-the-spot installation cost.In addition because built-in independent memory device has been stored all data relevant with sensor.Also there is a memory device modularized main circuit board inside, has preserved information such as the range that electronic unit is correlated with, damping, unit, worker's item.Need not after like this parts being changed to demarcate, only need carry out simple configuration, can satisfy on-the-spot request for utilization electronic unit.Dwindle servicing time greatly, reduced the cost of maintenance.Simultaneously,, also can reduce the quantity of on-the-spot standby redundancy because electronic unit and sensor exchange, thereby to bringing great convenience property of on-site customer and economic benefit.
Because each electronic circuit plate portion is all adopted modular design, after respectively each module being carried out being welded to main circuit after the epoxy resin embedding again, carry out three anti-processing again.Adopt this kind mode, all main chip all are potted in the plastic housing by epoxy resin, and the welding pin seldom of exposure has also carried out three anti-processing.General collision, fall the operate as normal that can not have influence on main circuit, not only effectively reduce the influence that on-the-spot dust, aqueous vapor etc. may cause the circuit operate as normal, and improved the shock resistance of circuit board greatly, improved the on-the-spot reliability of instrument.
At last, it is also to be noted that what more than enumerate only is specific embodiment of the utility model.Obviously, the utility model is not limited to above embodiment, and many distortion can also be arranged.All distortion that those of ordinary skill in the art can directly derive or associate from the disclosed content of the utility model all should be thought protection domain of the present utility model.

Claims (10)

1. the pressure unit with encapsulation type sensor comprises housing and is located at the interior modularized main circuit board of housing, it is characterized in that this pressure unit has an encapsulation type sensor; Described encapsulation type sensor comprises a flange with hollow flange face, and the central column interface end that protrudes from flange face is established at the middle part, front side of flange face; The rear side of flange face is the flange body of hollow, and a sensor is installed in the front end of described flange body inside, and sensor is drawn signal wire and is connected to signal processing unit; The signal processing unit rear end is drawn main circuit and is connected lead and be connected to described modularized main circuit board; The epoxy resin that is used for embedding is sealingly fastened in signal processing unit the rear end of flange body inside; Screw thread is established in the outside of described central column interface end.
2. pressure unit according to claim 1 is characterized in that, establishes on the inwall of described flange body near first platform of flange face with near second platform of flange body rear end, and the surface of two platforms is all perpendicular to the axis direction of flange; Be terminated at the surface of first platform before the sensor, its rear end is provided with a set collar, and is fixed ring and then fixation of sensor by gland nut; Be terminated at the surface of second platform before the signal processing unit.
3. pressure unit according to claim 1 is characterized in that, extend to the flange body rear always on described central column interface end interior bone surface, until joining with first platform.
4. according to the pressure unit described in any one of the claim 1 to 3, it is characterized in that, at least three support fixed orifices are set on the described flange face, establish screw thread in the support fixed orifice.
5. according to the pressure unit described in any one of the claim 1 to 3, it is characterized in that the outside of described central column interface end is oppositely arranged parallel twice open slot.
6. according to the pressure unit described in any one of the claim 1 to 3, it is characterized in that the front end of described flange body is provided with housing tightening groove.
7. according to the pressure unit described in any one of the claim 1 to 3, it is characterized in that, on the described flange body bleeder vent is set.
8. according to the pressure unit described in any one of the claim 1 to 3, it is characterized in that the housing connecting portion is established in described flange body outside, on the housing connecting portion screw thread is set.
9. according to the pressure unit described in any one of the claim 1 to 3, it is characterized in that the seal groove of annular, the built-in O-ring seals of seal groove are established in described flange body outside.
10. according to the pressure unit described in any one of the claim 1 to 3, it is characterized in that described pressure unit electronic circuit plate portion all adopts modular construction.
CN201020271951XU 2010-07-27 2010-07-27 Pressure transmitter provided with encapsulated sensor Expired - Fee Related CN201780181U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201020271951XU CN201780181U (en) 2010-07-27 2010-07-27 Pressure transmitter provided with encapsulated sensor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201020271951XU CN201780181U (en) 2010-07-27 2010-07-27 Pressure transmitter provided with encapsulated sensor

Publications (1)

Publication Number Publication Date
CN201780181U true CN201780181U (en) 2011-03-30

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN201020271951XU Expired - Fee Related CN201780181U (en) 2010-07-27 2010-07-27 Pressure transmitter provided with encapsulated sensor

Country Status (1)

Country Link
CN (1) CN201780181U (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101922988A (en) * 2010-07-27 2010-12-22 浙江欧德利科技有限公司 Pressure transmitter with integrated encapsulation type sensor
CN103487204A (en) * 2012-06-13 2014-01-01 株式会社鹭宫制作所 Pressure sensor
CN103487205A (en) * 2012-06-13 2014-01-01 株式会社鹭宫制作所 Pressure sensor
CN107102104A (en) * 2017-05-17 2017-08-29 南京艾伊科技有限公司 Sensor assembly

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101922988A (en) * 2010-07-27 2010-12-22 浙江欧德利科技有限公司 Pressure transmitter with integrated encapsulation type sensor
CN101922988B (en) * 2010-07-27 2012-07-25 浙江欧德利科技有限公司 Pressure transmitter with integrated encapsulation type sensor
CN103487204A (en) * 2012-06-13 2014-01-01 株式会社鹭宫制作所 Pressure sensor
CN103487205A (en) * 2012-06-13 2014-01-01 株式会社鹭宫制作所 Pressure sensor
CN108375447A (en) * 2012-06-13 2018-08-07 株式会社鹭宫制作所 Pressure sensor
CN107102104A (en) * 2017-05-17 2017-08-29 南京艾伊科技有限公司 Sensor assembly

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C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20110330

Termination date: 20150727

EXPY Termination of patent right or utility model