CN201774738U - 能进行辐射型散热的pcb板 - Google Patents
能进行辐射型散热的pcb板 Download PDFInfo
- Publication number
- CN201774738U CN201774738U CN2010205260958U CN201020526095U CN201774738U CN 201774738 U CN201774738 U CN 201774738U CN 2010205260958 U CN2010205260958 U CN 2010205260958U CN 201020526095 U CN201020526095 U CN 201020526095U CN 201774738 U CN201774738 U CN 201774738U
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- Prior art keywords
- pcb board
- heat dissipation
- implementing
- pcb
- electromagnetic radiation
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Description
功率(瓦) | 测试内容 | 单位 | 环境温度 | 电子组件的PC板温度 |
4 | 传统PCB板 | ℃ | 29.45 | 87.94 |
4 | 本实用新型PCB板 | ℃ | 29.861 | 80.497 |
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Priority Applications (1)
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CN2010205260958U CN201774738U (zh) | 2010-09-02 | 2010-09-02 | 能进行辐射型散热的pcb板 |
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CN2010205260958U CN201774738U (zh) | 2010-09-02 | 2010-09-02 | 能进行辐射型散热的pcb板 |
Publications (1)
Publication Number | Publication Date |
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CN201774738U true CN201774738U (zh) | 2011-03-23 |
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CN2010205260958U Expired - Fee Related CN201774738U (zh) | 2010-09-02 | 2010-09-02 | 能进行辐射型散热的pcb板 |
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CN (1) | CN201774738U (zh) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10390421B2 (en) | 2015-10-01 | 2019-08-20 | At & S Austria Technologie & Systemtechnik Aktiengesellschaft | Electronic component carrier for carrying and cooling a heat generating electronic component |
CN110586935A (zh) * | 2019-10-29 | 2019-12-20 | 追信数字科技有限公司 | 一种用于cpu散热的铜-电气石复合散热材料的制造方法 |
US10905016B2 (en) | 2015-10-22 | 2021-01-26 | AT & Austria Technologie & Systemtechnik Aktiengesellschaft | Using a partially uncured component carrier body for manufacturing component carrier |
-
2010
- 2010-09-02 CN CN2010205260958U patent/CN201774738U/zh not_active Expired - Fee Related
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10390421B2 (en) | 2015-10-01 | 2019-08-20 | At & S Austria Technologie & Systemtechnik Aktiengesellschaft | Electronic component carrier for carrying and cooling a heat generating electronic component |
US10905016B2 (en) | 2015-10-22 | 2021-01-26 | AT & Austria Technologie & Systemtechnik Aktiengesellschaft | Using a partially uncured component carrier body for manufacturing component carrier |
CN110586935A (zh) * | 2019-10-29 | 2019-12-20 | 追信数字科技有限公司 | 一种用于cpu散热的铜-电气石复合散热材料的制造方法 |
CN110586935B (zh) * | 2019-10-29 | 2021-12-17 | 常州品睿电子科技有限公司 | 一种用于cpu散热的铜-电气石复合散热材料的制造方法 |
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Legal Events
Date | Code | Title | Description |
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C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
ASS | Succession or assignment of patent right |
Owner name: CHDS LTD. Free format text: FORMER OWNER: CHDS TECHNOLOGY LTD. Effective date: 20130924 |
|
C41 | Transfer of patent application or patent right or utility model | ||
TR01 | Transfer of patent right |
Effective date of registration: 20130924 Address after: Box 957, postal BVI Todd Lalude town overseas business center Patentee after: Chen Wah International Company Limited Address before: Futian District Yitian road Shenzhen city Guangdong province 518000 B Royal Plaza, No. 3008 room 602 Patentee before: CHDS Technology Limited |
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CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20110323 Termination date: 20160902 |
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CF01 | Termination of patent right due to non-payment of annual fee |