CN201749804U - Ultra-thin conductive base substrate - Google Patents
Ultra-thin conductive base substrate Download PDFInfo
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- CN201749804U CN201749804U CN2010202573768U CN201020257376U CN201749804U CN 201749804 U CN201749804 U CN 201749804U CN 2010202573768 U CN2010202573768 U CN 2010202573768U CN 201020257376 U CN201020257376 U CN 201020257376U CN 201749804 U CN201749804 U CN 201749804U
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- adhesive layer
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Abstract
The utility model discloses an ultra-thin conductive base substrate which comprises a PET (polyester) thin layer, an adhesive layer, a cement layer and an ultraviolet curing adhesive layer, wherein the PET thin layer comprises opposite first and second surfaces, the adhesive layer is formed on the first surface of the PET thin layer, the cement layer is formed on the second surface of the PET thin layer, the ultraviolet curing adhesive layer is formed on the cement layer, and the other surface of the ultraviolet curing adhesive layer connected with the cement layer protrudes outwards to form a convex part. The ultra-thin conductive base substrate adopts independent structural design, has the characteristics of being ultra-thin, not easy to damage, and high in strength and transparency, occupying few space and having on influence on transmittance, the ultraviolet curing adhesive layer can be attached on the PET thin layer by the cement layer, and the conductive base substrate can be stuck on a key directly by the adhesive layer, so that the original double sided tape used for assembly is replaced, thus saving materials and being more convenient for the assemble with the key.
Description
Technical field
The utility model relates to a kind of conduction base of button, relates in particular to a kind of ultra-thin conduction substrate.
Background technology
Continuous development along with scientific and technological level, improving constantly of people's level of consumption, all kinds of high-tech electronic products are widely used in people's the life, mobile phone is as a kind of mobile terminals, become main contact and tool of communications that people be unable to do without, also increasingly mature to the technology of mobile phone research, in the face of the powerful market competitive pressure, to the improvement of mobile phone parts, constantly striding forward to thinner more exquisite target is the pursuit of current phone research and development.Button is a part important on the mobile phone as a kind of input, can realize and being connected of mobile phone inside chip by conducting electricity base, in order to reach target microminiaturized, sheet, the conductive base branch is separated making separately, assembling space is saved in the assembling that so not only is mobile phone, also make the button inner space be more convenient for designing, on the basis that does not influence function of use how the basic substrate sections of conduction do thinner be the current technical barrier that solves of needing, therefore, be necessary to provide a kind of ultra-thin conduction base substrate that does not account for assembling space to solve the demand.
The utility model content
The purpose of this utility model is to provide a kind of assembling space, high transparent ultra-thin conduction substrate of not accounting for.
To achieve these goals, the technical solution of the utility model is: a kind of ultra-thin conduction substrate is provided, comprise the PET thin layer, adhesive layer, adhesion agent layer and ultraviolet light polymerization glue-line, described PET thin layer has opposite first and second surface, described adhesive layer is formed on the first surface of described PET thin layer, described adhesion agent layer is formed on the second surface of described PET thin layer, described ultraviolet light polymerization glue-line is formed on the described adhesion agent layer, and the another side that links to each other with described adhesion agent layer on the described ultraviolet light polymerization glue-line outwards protrudes out and is formed with protuberance.
Preferably, the thickness of described conduction substrate is less than 0.05 millimeter, and the height of described protuberance is 0.2 millimeter, and described protuberance forms the conduction base, and the gross thickness of described conduction substrate and protuberance part can be controlled in below 0.25 millimeter.
Preferably, the thickness of described PET thin layer is between 0.018 millimeter to 0.025 millimeter.
Preferably, the thickness of described ultraviolet light polymerization glue-line is less than 0.01 millimeter.
Compared with prior art, because ultra-thin conduction substrate of the present utility model is by the PET thin layer, adhesive layer, adhesion agent layer and ultraviolet light polymerization glue-line form successively, adopt the structure of independent design, realize ultra-thin specification requirement, described ultra-thin conduction substrate has ultra-thin, high strength, cracky not, high transparent, account for assembling space hardly, do not influence the characteristics of printing opacity, described adhesion agent layer can be attached to the ultraviolet light polymerization glue-line on the PET film, can directly paste the conduction substrate on the button by adhesive layer, replace and assembled the double faced adhesive tape of usefulness in the past, save material, more convenient and button is realized assembling.
Description of drawings
Fig. 1 is the structural representation of ultra-thin conduction substrate of the present utility model.
Fig. 2 is the structural representation of ultra-thin conduction substrate of the present utility model with the PET release film.
Embodiment
In order to describe technology contents of the present utility model, structural feature in detail, be described further below in conjunction with execution mode and conjunction with figs., label identical among the wherein different figure is represented identical parts.As shown in Figure 1, a kind of ultra-thin conduction substrate is disclosed among the embodiment of the present utility model, comprise PET (PETG, chemical formula is OCH2-CH2OCOC6H4CO, English name: polyethylene terephthalate, be called for short PET) thin layer 1, adhesive layer 2, adhesion agent layer 3 and ultraviolet light polymerization glue-line 4, described PET thin layer 1 has opposite first 11 and second surface 12, described adhesive layer 2 is formed on the first surface 11 of described PET thin layer 1, described adhesion agent layer 3 is formed on the second surface 12 of described PET thin layer 1, described ultraviolet light polymerization glue-line 4 is formed on the described adhesion agent layer 3, and described ultraviolet light polymerization glue-line 4 must be selected suitable toughness, hardness, transparency and solidification process do not have bubble UV glue to form.After adhering to after ultraviolet light polymerization glue-line 4 and the described adhesion agent layer 3, the thrust test of conduction Ji Jipianchu is greater than 1.5kgf.The another side that links to each other with described adhesion agent layer 3 on the described ultraviolet light polymerization glue-line 4 outwards protrudes out and is formed with protuberance 41, described protuberance 41 forms the conduction base, the I of the height h of described protuberance 41 is accomplished 0.2 millimeter, the thickness d of described conduction substrate is less than 0.05 millimeter, and the gross thickness of described conduction substrate and protuberance 41 parts can be controlled in below 0.25 millimeter.The thickness of described PET thin layer 1 is preferably 0.025 millimeter between 0.018 millimeter to 0.025 millimeter.The thickness of described ultraviolet light polymerization glue-line 4 is less than 0.01 millimeter.
With reference to figure 2, when processing ultra-thin conduction substrate, adopt the PET release film 5 of 0.075 millimeter～0.125 millimeter thickness to invest on the adhesive layer 2, be used to support described PET thin layer 1, make PET thin layer 1 in the course of processing, can not produce distortion, influence product quality, finish and to throw away this PET release film 5 after product is assembled.Seal adhesion agent layer 3 on the non-release face 5 of 0.025 millimeter PET, will have PET thin layer 1 and the conduction base substrate of ultraviolet light polymerization glue-line 4 place be light-cured into type on the template after, by the basic substrate of the just plastic described ultra-thin conduction of Punching Technology.Adhesion agent layer 2 printings of described PET thin layer 1 and 4 combinations of ultraviolet light polymerization glue-line are keys of this manufacturing technology, and UV glue and common PET are inadhering, and only process special processing on the PET film just can make UV glue be combined in the PET film surface preferably.
Compared with prior art, because ultra-thin conduction substrate of the present utility model is by PET thin layer 1, adhesive layer 2, adhesion agent layer 3 and ultraviolet light polymerization glue-line 4 form successively, adopt the structure of independent design, realize ultra-thin specification requirement, described ultra-thin conduction substrate has ultra-thin, high strength, cracky not, high transparent, account for assembling space hardly, do not influence the characteristics of printing opacity, described adhesion agent layer 3 can be attached to ultraviolet light polymerization glue-line 4 on the PET thin layer 1, can directly paste the conduction substrate on the button by adhesive layer 2, replace and assembled the double faced adhesive tape of usefulness in the past, save material, more convenient and button is realized assembling.
Above disclosed only is preferred embodiments of the present utility model, can not limit the interest field of the utility model certainly with this, and therefore the equivalent variations of being done according to the utility model claim still belongs to the scope that the utility model is contained.
Claims (4)
1. a ultra-thin conduction substrate is characterized in that, comprising:
The PET thin layer, described PET thin layer has opposite first and second surface;
Adhesive layer, described adhesive layer are formed on the first surface of described PET thin layer;
Adhesion agent layer, described adhesion agent layer are formed on the second surface of described PET thin layer;
The ultraviolet light polymerization glue-line, described ultraviolet light polymerization glue-line is formed on the described adhesion agent layer, and the another side that links to each other with described adhesion agent layer on the described ultraviolet light polymerization glue-line outwards protrudes out and is formed with protuberance.
2. ultra-thin conduction substrate as claimed in claim 1 is characterized in that, the thickness of described conduction substrate is less than 0.05 millimeter, and the height of described protuberance is 0.2 millimeter.
3. ultra-thin conduction substrate as claimed in claim 2 is characterized in that the thickness of described PET thin layer is between 0.018 millimeter to 0.025 millimeter.
4. ultra-thin conduction substrate as claimed in claim 2 is characterized in that the thickness of described ultraviolet light polymerization glue-line is less than 0.01 millimeter.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010202573768U CN201749804U (en) | 2010-07-13 | 2010-07-13 | Ultra-thin conductive base substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010202573768U CN201749804U (en) | 2010-07-13 | 2010-07-13 | Ultra-thin conductive base substrate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201749804U true CN201749804U (en) | 2011-02-16 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010202573768U Expired - Fee Related CN201749804U (en) | 2010-07-13 | 2010-07-13 | Ultra-thin conductive base substrate |
Country Status (1)
| Country | Link |
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| CN (1) | CN201749804U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102306581A (en) * | 2011-07-19 | 2012-01-04 | 惠州Tcl移动通信有限公司 | Mobile phone key and manufacturing method thereof |
| CN112795963A (en) * | 2020-12-28 | 2021-05-14 | 青岛大学 | Method for simply and rapidly preparing ultramicro electrode array |
-
2010
- 2010-07-13 CN CN2010202573768U patent/CN201749804U/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102306581A (en) * | 2011-07-19 | 2012-01-04 | 惠州Tcl移动通信有限公司 | Mobile phone key and manufacturing method thereof |
| CN102306581B (en) * | 2011-07-19 | 2013-11-06 | 惠州Tcl移动通信有限公司 | Mobile phone key and manufacturing method thereof |
| CN112795963A (en) * | 2020-12-28 | 2021-05-14 | 青岛大学 | Method for simply and rapidly preparing ultramicro electrode array |
| CN112795963B (en) * | 2020-12-28 | 2022-05-27 | 青岛大学 | Method for simply and rapidly preparing ultramicro electrode array |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20110216 Termination date: 20130713 |