CN201717962U

CN201717962U - Cooled CCD image sensor

Info

Publication number: CN201717962U
Application number: CN2010201787365U
Authority: CN
Inventors: 夏志坚
Original assignee: Individual
Current assignee: Individual
Priority date: 2010-04-27
Filing date: 2010-04-27
Publication date: 2011-01-19
Anticipated expiration: 2020-04-27

Abstract

The utility model discloses a cooled CCD image sensor which comprises a light incidence end and a CCD image sensor chip. A heat-conducting component thermally conducted with the CCD image sensor chip, a semiconductor refrigerating block thermally conducted with the heat-conducting component and a heat sink are also arranged in the CCD image sensor. The cooled CCD image sensor chip reduces dark current on an imaging unit of the CCD image sensor chip, increases the sensitivity of the CCD image sensor chip in low light level environment, and increases the sensitivity to ultraviolet radiation and visible light.

Description

A kind of cold ccd image sensor

Technical field

The utility model relates to field of photoelectric technology, is specifically related to a kind of ccd image sensing chip and refrigerating plant thereof.

Technical background

CCD (Charge-coupled Device) is charge coupled cell just, belongs to a kind of semiconductor device, and its function is that optical image is converted into digital signal, and it has been widely used in industry-by-industry since last century, the seventies was born.

Incident light is handled via CCD, inspires the light signal electric charge, and transmits with the form of charge packet, thereby converts light signal to the signal of telecommunication, and these signals of telecommunication meet general video playback requirement, can display by screen; Because CCD has characteristics such as volume is little, spectral response range is wide, sensitivity height, it is widely used in the various high-precision optical instruments.

The imaging effect of existing C CD is subjected to the influence of ambient temperature and scene illumination usually, and when, illumination higher when temperature was low, forming noise on the image easily influenced image quality, and especially when night vision or under the fluorescence imaging situation, this kind defective is particularly outstanding.

In sum, develop a kind of cold ccd image sensor that under common room temperature, low-light (level) environment, can obtain high quality graphic, become the focus of paying close attention in the industry.

Summary of the invention

At the deficiencies in the prior art, the purpose of this utility model is intended to provide a kind of local refrigeration ccd image sensor, can be under normal temperature even higher temperature environment, guarantee image quality, its built-in heat sink, reduced the dark current on each image-generating unit, to promote the sensitiveness of CCD in the low-light (level) environment.

For achieving the above object, the utility model adopts following technical scheme:

A kind of cold ccd image sensor, comprise light incident end, and a ccd image sensing chip, also be provided with the heat-conductive assembly logical in this cold ccd image sensor with described ccd image sensing chip thermal conductance, and the semiconductor refrigerating piece logical, an and heat abstractor with described heat-conductive assembly thermal conductance.

This cold ccd image sensor includes an external shell; Described housing is provided with lower lumen, top inner chamber, and described ccd image sensing chip, heat-conductive assembly, semiconductor refrigerating piece are positioned at described lower lumen, and described heat abstractor is the fan that is arranged in the inner chamber of described top.

Described heat-conductive assembly comprises the heat-conducting plate that is arranged at described semiconductor refrigerating piece top, and the heating column that is arranged at described semiconductor refrigerating piece bottom.

Described heat-conducting plate both sides have a bending section respectively, and described bending section is connected in described external shell inwall by bolt.。

Described heat-conductive assembly outside also is provided with heat-insulation layer.

This cold ccd image sensor is built-in with circuit board.

Be provided with a wind guide tank between described top inner chamber and the lower lumen.

Described ccd image sensing chip is outside equipped with dust guard, and this dust guard comprises isolates dust cover and sealing and dustproof glass.

Described light incident end is provided with filter.

The cold ccd image sensor that the utility model is set forth, its beneficial effect is:

Ccd image sensing chip after the reduction temperature has reduced the dark current on its image-generating unit, promotes its susceptibility under the low-light (level) environment, and the susceptibility of ultraviolet ray and visible light is also promoted thereupon.

Description of drawings

Fig. 1 is the structural representation of a kind of cold ccd image sensor of the utility model.

Embodiment

Below, in conjunction with the accompanying drawings and embodiment, cold ccd image sensor of the present utility model is described further, so that more clearly understand the technological thought that the utility model claim is protected.

As shown in Figure 1, be a kind of cold ccd image sensor of the present utility model, its outside has a housing 1, have top inner chamber A and lower lumen B in housing 1 inside, among the inner chamber A of top fan 2 is installed, between top inner chamber A and lower lumen B, has a wind guide tank 14 on the housing 1, the top of top inner chamber A and external environment conducting, fan 2 can suck air from the top, and the wind guide tank from housing 1 is discharged air, make the air in the housing 1 to circulate, thereby allow housing 1 cooling with the external environment air; Ccd image sensing chip, 6 of semiconductor refrigeratings and heat-conducting plate 5 are installed among the lower lumen B, heat-conducting plate 5 produces semiconductor refrigerating piece 6 in process of refrigerastion heat is transmitted on the aluminium mass shell body 1, and by housing 1 heat is taken away, be reached for the purpose of semiconductor refrigerating piece 6 heat radiations; The incident end of universal optical interface as its imaging light installed in housing 1 bottom.

Signal circuit plate 31, foam thermal insulation thermal insulation layer 41, red copper heat-conducting plate 5, semiconductor refrigerating piece 6, red copper heating column 7, foam thermal insulation thermal insulation layer 42, signal processing circuit board 10, ccd image sensing chip 9 from top to bottom are installed in above-mentioned lower lumen B successively, be equipped with isolation dust cover 11 in ccd image sensing chip 9 outer periphery, the front end of isolating dust cover 11 is provided with sealing and dustproof glass 13; In addition, in order to realize imaging effect preferably, in isolating dust cover 11, filter 12 is housed also; As above-mentioned, semiconductor refrigerating piece 6 is between heat-conducting plate 5 and heating column 7, and its heating face and heat-conducting plate 5 thermal conductances are logical, chill surface leads to heating column 7 thermal conductances, during 6 work of semiconductor refrigerating piece, the two sides can generate heat and freeze respectively, chill surface can reduce the temperature of heating column 7, thereby reduce the temperature of the ccd image sensing chip 9 that leads to heating column 7 thermal conductances, and the heat that semiconductor refrigerating piece 6 produces in process of refrigerastion, then be delivered on the aluminium mass shell body, and heat distributed by fan 2 inhaled airs via heat-conducting plate 5.Isolating dust cover 11 is enclosed within outside the ccd image sensing chip 9,13 in filter 12 and sealing and dustproof glass have been realized allowing visible light pass through again simultaneously to the double-layer seal isolation of the photosurface of ccd image sensing chip 9, isolate dust cover 11 inside and need vacuumize or filling with inert gas; In addition, isolate the effect that dust cover 11 also plays dust-proof fog-free.

For making above-mentioned cold ccd image sensor reach better effect, the upper end of its heating column 7 is the bigger red copper platy structure in a cross section, with the bottom surface size coupling of semiconductor refrigerating piece 6, passes through journey to realize comparatively smooth thermal conductance; And, in the periphery of semiconductor refrigerating piece 6 and heating column 7,, be provided with foam heat-insulation layer 42, to realize effect of heat insulation preferably along the short transverse of cold ccd image sensor; The cross section of above-mentioned heat-conducting plate 5 is a C shape structure, two ends are bending section, the bending section at its two ends extends upward along the short transverse of cold ccd image sensor, bolt 51 passes its bending section the heat-conducting plate 5 and the inwall of external shell 1 is combined closely, the foam heat-insulation layer 41 that lay on heat-conducting plate 5 tops is wrapped in heat-conducting plate 5 tops, the bending section that exposes its two ends, thus, the heat that is produced in semiconductor refrigerating piece 6 process of refrigerastions, be passed to the first half of lower lumen B via heat-conducting plate 5 both ends, and from then on housing is arrived with heat transferred in the position, the air of wind guide tank carries out the convection current displacement by the normal temperature air in fan and the external environment condition on the housing, makes heat be discharged from beyond the external shell.

The inventor select for use heat conductivility preferably red copper make above-mentioned heat-conducting plate 5, heating column 7, to realize more good effect.

Ccd image sensing chip 9 after the reduction temperature has reduced the dark current on its image-generating unit, promotes its susceptibility under the low-light (level) environment, and the susceptibility of ultraviolet ray and visible light is also promoted thereupon.

The top that is positioned at foam heat-insulation layer 41 in the above-mentioned cold ccd image sensor also is provided with a signal circuit plate 31, be provided with a signal processing circuit board 32 in the bottom of foam heat-insulation layer 42, ccd image sensing chip 9 is welded on the signal processing circuit board 32, signal circuit plate 31 and signal processing circuit board 32 interconnect by the multicore contact pin, signal circuit plate 31 possesses the function that picture signal is delivered to external equipment, wherein external equipment such as display etc.。

In foam heat-insulation layer 42, also inlay and be provided with bakelite liner plate 8, in order to keep the collimation of semiconductor refrigerating piece 6.

For a person skilled in the art, can make other various corresponding changes and distortion, and these all changes and distortion should belong within the protection range of the utility model claim all according to technical scheme described above and design.

Claims

1. cold ccd image sensor, comprise light incident end, an and ccd image sensing chip, it is characterized in that, also be provided with the heat-conductive assembly logical in this cold ccd image sensor with described ccd image sensing chip thermal conductance, and the semiconductor refrigerating piece logical, an and heat abstractor with described heat-conductive assembly thermal conductance.

2. cold ccd image sensor as claimed in claim 1 is characterized in that, this cold ccd image sensor includes an external shell; Described housing is provided with lower lumen, top inner chamber, and described ccd image sensing chip, heat-conductive assembly, semiconductor refrigerating piece are positioned at described lower lumen, and described heat abstractor is the fan that is arranged in the inner chamber of described top.

3. cold ccd image sensor as claimed in claim 2 is characterized in that, described heat-conductive assembly comprises the heat-conducting plate that is arranged at described semiconductor refrigerating piece top, and the heating column that is arranged at described semiconductor refrigerating piece bottom.

4. cold ccd image sensor as claimed in claim 3 is characterized in that, described heat-conducting plate both sides have a bending section respectively, and described bending section is connected in described external shell inwall by bolt.。

5. cold ccd image sensor as claimed in claim 1 is characterized in that, described heat-conductive assembly outside also is provided with heat-insulation layer.

6. cold ccd image sensor as claimed in claim 1 is characterized in that, this cold ccd image sensor is built-in with circuit board.

7. cold ccd image sensor as claimed in claim 2 is characterized in that, is provided with a wind guide tank between described top inner chamber and the lower lumen.

8. cold ccd image sensor as claimed in claim 1 is characterized in that, described ccd image sensing chip is outside equipped with dust guard, and this dust guard comprises isolates dust cover and sealing and dustproof glass.

9. cold ccd image sensor as claimed in claim 1 is characterized in that, described light incident end is provided with filter.