CN201704808U - Organic high-molecular foaming heat-insulating material with covering layer made of inorganic light material - Google Patents
Organic high-molecular foaming heat-insulating material with covering layer made of inorganic light material Download PDFInfo
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- CN201704808U CN201704808U CN2010201380700U CN201020138070U CN201704808U CN 201704808 U CN201704808 U CN 201704808U CN 2010201380700 U CN2010201380700 U CN 2010201380700U CN 201020138070 U CN201020138070 U CN 201020138070U CN 201704808 U CN201704808 U CN 201704808U
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- insulating material
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Abstract
The utility model belongs to the field of building materials, and particularly relates to an organic high-molecular heat-insulating material with a covering layer made of an inorganic light material. The heat-insulating material comprises three layers, wherein a middle layer is a resin foaming layer, and an upper layer and a lower layer are the covering layers, wherein at least one layer in the covering layers of the upper layer and the lower layer is the covering layer made of the inorganic light material. The resin foaming layer is made of one or more in phenolic resin, modified phenolic resin, melamine-formaldehyde resin, modified melamine-formaldehyde resin, urea-formaldehyde resin, modified urea-formaldehyde resin and polyurethane. The covering layer is made of inorganic light incombustible materials, such as perlite, expanded perlite, vermiculite, expanded vermiculite and the like. The utility model has the advantages of low price, no combustion and the like.
Description
Technical field
The utility model belongs to building materials field, is specifically related to a kind of foaming thermal-insulating.
Background technology
It is facing material that existing phenolic resins heat insulating material all adopts nonwoven, aluminium foil, glass fabric etc.But these materials are limited with the bonding force of phenolic resins expanded material under many circumstances, and price is higher, may reduce the fire resistance of heat insulating material, and follow-up construction is made troubles.
The utility model content
The purpose of this utility model provides a kind of organic polymer heat insulating material of being made of overlay inorganic lightweight material, this heat insulating material is low price not only, be convenient to decorate, can improve the burning grade of heat insulating material integral body, can also effectively get rid of the influence of facing material, and follow-up construction is had no adverse effects properties of product.
To achieve these goals, the utility model is taked following design scheme:
The organic polymer heat insulating material of forming overlay by inorganic lightweight material, this heat insulating material is three layers, and its intermediate layer is resin expanded layer, and it is two-layer up and down to be overlay, wherein, the one deck at least in the bilevel overlay is the overlay that inorganic lightweight material is formed.
In the organic polymer heat insulating material of being made of overlay inorganic lightweight material of the present utility model, described bilevel overlay can one deck be the inorganic lightweight material layer, also can two-layerly be the inorganic lightweight material layer:
In the organic polymer heat insulating material of being made of overlay inorganic lightweight material of the present utility model, described bilevel overlay is inorganic lightweight material and forms overlay.
In the organic polymer heat insulating material of being made of overlay inorganic lightweight material of the present utility model, the one deck in the described bilevel overlay is the overlay that inorganic lightweight material is formed; Its another layer is the overlay that nonwoven, aluminium foil or glass fabric are formed.
In the organic polymer heat insulating material of being made of overlay inorganic lightweight material of the present utility model, described inorganic lightweight material is one or more in expanded perlite, expanded vermiculite, perlite and the vermiculite.Wherein, can be the single component in the above-mentioned inorganic lightweight material, also can be several composition arbitrary proportion product of mixing in the above-mentioned inorganic lightweight material.Above-mentioned inorganic lightweight material is incombustible material.
In the organic polymer heat insulating material of being made of overlay inorganic lightweight material of the present utility model, the resin in the described resin expanded layer is one or more in phenolic resins, phenol-formaldehyde resin modified, melamine resin, modified melamine-formaldehyde resin, Lauxite, modified urea-formaldehyde resin and the polyurethane.Wherein, can be the single component in the above-mentioned resin, also can be several composition arbitrary proportion product of mixing in the above-mentioned resin.
In the organic polymer heat insulating material of being made of overlay inorganic lightweight material of the present utility model, the overlay that described inorganic lightweight material is formed is by the bonding overlay that forms of the powder of inorganic lightweight material.Just, the bonding overlay that forms of powder of one or more in employing expanded perlite, expanded vermiculite, perlite and the vermiculite.This bonding be by organic polymer expanded material (being the resin in the resin expanded layer) in foaming process with the bonding together of above-mentioned inorganic lightweight material powder, form overlay.
In the organic polymer heat insulating material of being made of overlay inorganic lightweight material of the present utility model, described resin expanded layer is bonding automatically and make inorganic lightweight material consist of overlay with the inorganic lightweight material powder.Just, at described resin expanded layer in the resin molded foam process, the automatic bonding inorganic lightweight material powder of organic polymer expanded material (being the resin in the resin expanded layer), on the one hand, making the inorganic lightweight material powder bonding is overlay, on the other hand, the formed resin expanded layer of organic polymer expanded material (being the resin in the resin expanded layer) is bonded together automatically with the overlay that inorganic lightweight material is formed.
In the organic polymer heat insulating material of being made of overlay inorganic lightweight material of the present utility model, the shape of described heat insulating material is based on writing board shape, but also can be other shape.
In the organic polymer heat insulating material of forming overlay by inorganic lightweight material of the present utility model, on described overlay, floral designs can be arranged.Wherein, can the printing pattern pattern on the overlay that nonwoven, aluminium foil or glass fabric are formed; Can the printing pattern pattern on the bonding overlay that forms of inorganic lightweight material powder, also can the carved pattern pattern, the inorganic lightweight material powder can also be laid or spreading at mold bottom, on overlay, duplicate floral designs by the mould that has floral designs.
The utility model has the advantages that:
Advantage such as that the organic polymer heat insulating material of forming overlay by inorganic lightweight material of the present utility model has is inexpensive, do not burn; The utility model can also effectively be got rid of the influence of facing material to properties of product, and follow-up construction is had no adverse effects.
Description of drawings
Fig. 1 is an organic polymer heat insulating material structural representation of being made of overlay inorganic lightweight material.Number in the figure: 1-overlay, the resin expanded layer of 2-.
The specific embodiment
The organic polymer heat insulating material structural representation of forming overlay by inorganic lightweight material of the present utility model as shown in Figure 1, in Fig. 1, heat insulating material of the present utility model be shaped as tabular, this heat insulating material is three layers, wherein, the intermediate layer of heat insulating material is resin expanded layer 2, the two-layer up and down of this resin expanded layer 2 is overlay 1, overlay 1 can be the one side of inorganic lightweight material layer, it also can be the two sides of inorganic lightweight material layer, that is, two-layer overlay 1 is the bonding overlay that forms of inorganic lightweight material powder; Or the one deck in the two-layer overlay 1 is the bonding overlay that forms of inorganic lightweight material powder; Its another layer is the overlay that nonwoven, aluminium foil or glass fabric are formed.
The preparation method of heat insulating material of the present utility model can adopt batch process production, also can adopt continuity method production:
Adopt batch process to produce organic polymer foaming thermal-insulating process to be: 1. the inorganic lightweight material powder is laid or spreading at mold bottom; 2. add the expandability macromolecular material; 3. lay or spreading inorganic lightweight material powder at the expandability polymer surface; 4. foaming under certain condition; 5. the organic polymer expanded material bonds together above-mentioned inorganic powder in foaming process, forms overlay; 6. take out the expanded material of above-mentioned moulding, 7. expanded material such as is cut out at processing, can obtain the organic polymer foaming thermal-insulating that two-layer overlay is inorganic lightweight material.
Adopt continuity method to produce organic polymer foaming thermal-insulating process to be: 1. the inorganic lightweight material powder is laid or spreading in the streamline bottom; 2. spray into the expandability macromolecular material; 3. lay or spreading inorganic lightweight material powder at the expandability polymer surface; 4. foaming under certain condition; 5. the organic polymer expanded material bonds together above-mentioned inorganic powder in foaming process, forms overlay; 6. dispose the unnecessary inorganic lightweight material in surface; 7. expanded material such as is cut out at processing, can obtain the organic polymer foaming thermal-insulating that two-layer overlay is the overlay of inorganic lightweight material.
No matter be batch process, or continuity method, all can simultaneously adopt above-mentioned inorganic lightweight material, promptly, in batch process production or continuity method production, delete step 3., can obtain one deck overlay is the organic polymer foaming thermal-insulating of inorganic lightweight material, and another side adopts nonwoven, aluminium foil or glass fabric etc.
Claims (7)
1. be made of the organic polymer heat insulating material of overlay inorganic lightweight material, it is characterized in that, this heat insulating material is three layers, its intermediate layer is resin expanded layer, it is two-layer up and down to be overlay, and wherein, the one deck at least in the bilevel overlay is that inorganic lightweight material is formed overlay.
2. according to claim 1ly form the organic polymer heat insulating material of overlay, it is characterized in that described bilevel overlay is inorganic lightweight material and forms overlay by inorganic lightweight material.
3. according to claim 1ly form the organic polymer heat insulating material of overlay, it is characterized in that the one deck in the described bilevel overlay is that inorganic lightweight material is formed overlay by inorganic lightweight material; Its another layer is the overlay that nonwoven, aluminium foil or glass fabric are formed.
4. the organic polymer heat insulating material of forming overlay by inorganic lightweight material according to claim 1, it is characterized in that the inorganic lightweight material in the described inorganic lightweight material powder constituent overlay is a kind of in expanded perlite, expanded vermiculite, perlite and the vermiculite.
5. the organic polymer heat insulating material of forming overlay by inorganic lightweight material according to claim 1, it is characterized in that the resin in the described resin expanded layer is a kind of in phenolic resins, phenol-formaldehyde resin modified, melamine resin, modified melamine-formaldehyde resin, Lauxite, modified urea-formaldehyde resin and the polyurethane.
6. according to claim 1ly form the organic polymer heat insulating material of overlay by inorganic lightweight material, it is characterized in that, described resin expanded layer is bonding automatically and make inorganic lightweight material consist of overlay with the inorganic lightweight material powder.
7. according to claim 1ly form the organic polymer heat insulating material of overlay, it is characterized in that by inorganic lightweight material, described heat insulating material be shaped as tabular.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010201380700U CN201704808U (en) | 2010-03-19 | 2010-03-19 | Organic high-molecular foaming heat-insulating material with covering layer made of inorganic light material |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010201380700U CN201704808U (en) | 2010-03-19 | 2010-03-19 | Organic high-molecular foaming heat-insulating material with covering layer made of inorganic light material |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201704808U true CN201704808U (en) | 2011-01-12 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN2010201380700U Expired - Fee Related CN201704808U (en) | 2010-03-19 | 2010-03-19 | Organic high-molecular foaming heat-insulating material with covering layer made of inorganic light material |
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| CN (1) | CN201704808U (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102190856A (en) * | 2011-04-01 | 2011-09-21 | 北京联合大学生物化学工程学院 | Melamine formaldehyde resin foaming material modified by inorganic lightweight material and preparation method thereof |
| CN102501413A (en) * | 2011-10-01 | 2012-06-20 | 滕州市华海新型保温材料有限公司 | Organic polymer heat insulating material with covering layers made of natural fiber gridding cloth |
| CN102587521A (en) * | 2012-03-21 | 2012-07-18 | 北京亚特化工有限公司 | Fireproof and heat-insulating material and preparation method |
| CN105415826A (en) * | 2015-12-21 | 2016-03-23 | 常熟市佳泰金属材料有限公司 | Flame-retardant functional composite material |
| CN112902570A (en) * | 2021-01-22 | 2021-06-04 | 机械工业第九设计研究院有限公司 | Intelligent energy-saving emission-reducing system of drying furnace |
-
2010
- 2010-03-19 CN CN2010201380700U patent/CN201704808U/en not_active Expired - Fee Related
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102190856A (en) * | 2011-04-01 | 2011-09-21 | 北京联合大学生物化学工程学院 | Melamine formaldehyde resin foaming material modified by inorganic lightweight material and preparation method thereof |
| CN102501413A (en) * | 2011-10-01 | 2012-06-20 | 滕州市华海新型保温材料有限公司 | Organic polymer heat insulating material with covering layers made of natural fiber gridding cloth |
| CN102587521A (en) * | 2012-03-21 | 2012-07-18 | 北京亚特化工有限公司 | Fireproof and heat-insulating material and preparation method |
| CN105415826A (en) * | 2015-12-21 | 2016-03-23 | 常熟市佳泰金属材料有限公司 | Flame-retardant functional composite material |
| CN112902570A (en) * | 2021-01-22 | 2021-06-04 | 机械工业第九设计研究院有限公司 | Intelligent energy-saving emission-reducing system of drying furnace |
| CN112902570B (en) * | 2021-01-22 | 2023-03-28 | 机械工业第九设计研究院股份有限公司 | Intelligent energy-saving and emission-reducing system of drying furnace |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20110112 Termination date: 20120319 |