CN201697983U - Heat-dissipation test single board - Google Patents
Heat-dissipation test single board Download PDFInfo
- Publication number
- CN201697983U CN201697983U CN201020224566XU CN201020224566U CN201697983U CN 201697983 U CN201697983 U CN 201697983U CN 201020224566X U CN201020224566X U CN 201020224566XU CN 201020224566 U CN201020224566 U CN 201020224566U CN 201697983 U CN201697983 U CN 201697983U
- Authority
- CN
- China
- Prior art keywords
- power
- control
- module
- thermal load
- switch unit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Images
Landscapes
- Testing Electric Properties And Detecting Electric Faults (AREA)
Abstract
The utility model discloses a heat-dissipation test single board, which is used for the heat dissipation test of a single board. With the single board, a remaking of a new single board is of no need when a test scheme is changed. The heat-dissipation test single board comprises a control module, a power module connected to the control module and a thermal load module. The thermal load module comprises a control switch unit, a power device and a temperature sensor. The control switch unit is connected to the power module; the temperature output end of the temperature sensor is connected to the control module; one end of the power device is connected to the ground and the other end of the power device is connected to the control switch unit. The control module is used for sending communication control signal for the power module. The power module is used for sending power control signal for the control switch unit based on the communication control signal. The control switch unit of the thermal load module controls the power of the signal control power device based on the power. The temperature sensor of the thermal load module detects the temperature of the thermal load module and sends a temperature signal to the control module.
Description
Technical field
The utility model relates to electronic technology field, particularly relates to the heat radiation testing single-board.
Background technology
In electronic applications, can the temperature of device directly affect device and normally move and serviceable life, so the heat radiation situation of device receives publicity always.Along with the large-scale application of high speed, high power loss device, the heat dissipation design of high power consumption veneer becomes more and more important.
Prior art mainly contains three kinds of heat radiation test modes, and first kind is directly to the test of dispelling the heat of the veneer of reality.If test result is undesirable, need redesign and produce veneer, and then test, make test period long, and device resource such as waste veneer.
Second kind is to adopt special-purpose thermal load test board to replace actual veneer, can install and the actual identical device of veneer on special-purpose thermal load test board, and the installation site is also identical.Be that chip on the special-purpose thermal load test board does not need to realize actual function, can support the heat radiation test to get final product.Similar with first kind of mode, if test result is undesirable, needs redesign and produce special-purpose thermal load test board, and then test, make test period long, and device resource such as waste veneer.
The third is to adopt hot simulation software to set up hot realistic model, estimates the heat radiation situation on the veneer.This mode is higher to the accuracy requirement of model, and the actual heat radiation situation of veneer is subjected to many-sided factor affecting, thus the software emulation result usually and the actual heat radiation situation of veneer have deviation.
To sum up, there is the inaccurate or problem such as test period is long, and implementation procedure is loaded down with trivial details of test in prior art when the degree of heat radiation of testing single-board.
The utility model content
The utility model embodiment provides a kind of heat radiation testing single-board, is used to realize the heat radiation test to veneer, and does not need to make again veneer when changing testing scheme.
A kind of heat radiation testing single-board comprises: control module, the power model that is connected with control module and thermal load module; The thermal load module comprises control switch unit, power device and temperature sensor; Control switch unit is connected with power model, and the temperature output terminal of temperature sensor is connected with control module, an end ground connection of power device, and the other end connects control switch unit; Wherein
Control module is used for sending the Communication Control signal to power model, with the power control signal of notifying power model to export;
Power model is used for according to the Communication Control signal to the control switch unit transmitting power control signal, with the power on the control thermal load module;
Control switch unit in the thermal load module is according to the power of power control signal power controlling device;
Temperature sensor in the thermal load module detects the temperature of thermal load module, and temperature signal is sent to control module.
The thermal load module comprises a plurality of power devices.
Control module also is connected with control switch unit, and sends the break-make control signal to control switch unit, with the conducting or the disconnection of power controlling device and control switch unit.
Control module is connected with the outer test platform of testing single-board that dispels the heat, and the communication signal that the acceptance test platform sends is to control the Communication Control signal that need export.
The thermal load module is a plurality of.
A kind of heat radiation testing single-board comprises: control module, power model and thermal load module; The thermal load module comprises control switch unit, temperature sensor and a plurality of power device; Control switch unit is connected with power model with control module, and the temperature output terminal of temperature sensor is connected with control module, an end ground connection of power device, and the other end connects control switch unit; Wherein
Control module is used for sending the break-make control signal to control switch unit, with the conducting or the disconnection of power controlling device and control switch unit;
Power model is used for to the control switch unit transmitting power control signal, with the power on the control thermal load module;
Control switch unit in the thermal load module is according to the power of power control signal power controlling device;
Temperature sensor in the thermal load module detects the temperature of thermal load module, and temperature signal is sent to control module.
Control module also is used for sending the Communication Control signal to power model, with the power control signal of notifying power model to export.
Control module is connected with the outer test platform of testing single-board that dispels the heat, and the communication signal that the acceptance test platform sends is to control the Communication Control signal that need export.
The thermal load module is a plurality of.
The utility model embodiment increases control module and power model on the heat radiation testing single-board, power model sends different power control signals to the thermal load module, power with control thermal load module, and then detecting the degree of heat radiation of thermal load module under different power, control module is come power controlling module transmitting power control signal by the Communication Control signal.And/or the utility model embodiment increases control module and power model on the heat radiation testing single-board, and a plurality of power devices are set in the thermal load module.Power model is to thermal load module transmitting power control signal.Control module sends the break-make control signal to the thermal load module, with conducting or the disconnection of controlling a plurality of power devices, and then resistance, size and the position of control thermal load module, thereby detect the degree of heat radiation of thermal load module under different resistances (being equivalent to different capacity), size and position.
Description of drawings
The structural drawing of Fig. 1 heat radiation testing single-board when between control module among the utility model embodiment and the power model annexation being arranged;
Fig. 2 is the structural drawing of heat radiation testing single-board during no annexation between control module and the power model among the utility model embodiment;
Fig. 3 is the detailed structure view of heat radiation testing single-board among the utility model embodiment;
Fig. 4 is the structural drawing of control switch unit among the utility model embodiment.
Embodiment
The utility model embodiment increases control module and power model on the heat radiation testing single-board, power model sends different power control signals to the thermal load module, power with control thermal load module, and then detecting the degree of heat radiation of thermal load module under different power, control module is come power controlling module transmitting power control signal by the Communication Control signal.And/or the utility model embodiment increases control module and power model on the heat radiation testing single-board, and a plurality of power devices are set in the thermal load module.Power model is to thermal load module transmitting power control signal.Control module sends the break-make control signal to the thermal load module, with conducting or the disconnection of controlling a plurality of power devices, and then resistance, size and the position of control thermal load module, thereby detect the degree of heat radiation of thermal load module under different resistances (being equivalent to different capacity), size and position.
Referring to Fig. 1, the heat radiation testing single-board comprises when between control module and the power model annexation being arranged in the present embodiment: control module 101, power model 102 and thermal load module 103.
One end ground connection of power device 1032, the other end connects control switch unit 1031.Power device 1032 can be the device that resistance (especially power resistor) etc. has certain resistance.
The temperature output terminal of temperature sensor 1033 is connected with control module 101, is used to detect the temperature of thermal load module 103, and temperature signal is sent to control module 101.
Wherein, power device 1032 and single board design (comprise the design configuration of veneer or structure etc., do not need actual production to go out veneer) in the resistance of device identical, the position of thermal load module 103 on the heat radiation testing single-board is identical with the position of this device in single board design, and the size of thermal load module 103 is identical with this size of devices in the single board design.Thermal load module 103 can have a plurality of, with chip or other device of diverse location in the analog veneer design.M thermal load module 103 for example arranged, then m control switch unit 1032 difference received power control signal PWM1 ... PWMm, m temperature sensor 1033 is respectively with temperature signal T1 ... Tm sends to control module 101.
When carrying out dispelling the heat test the first time, control module 101 sends the first Communication Control signal to power model 102.Power model 102 sends first power control signal according to the first Communication Control signal to control switch unit 1031.Control switch unit 1031 provides the voltage of first magnitude of voltage for power device 1032 according to first power control signal.Temperature sensor detects the temperature of current thermal load module 103, and temperature signal is sent to control module 101.Sustainable a period of time of this testing process, control module 101 can periodically be sampled to temperature signal, obtains temperature value by temperature signal, to know the degree of heat radiation of thermal load module.
The temperature value that control module 101 also is used to judge the temperature signal correspondence whether in default scope, if, determine that then test passes through, otherwise adjust Communication Control signal and output, test to carry out next time.
When carrying out dispelling the heat test the second time, control module 101 sends the second Communication Control signal different with the first Communication Control signal to power model 102.Power model 102 sends second power control signal according to the second Communication Control signal to control switch unit 1031.Second power control signal is different with the dutycycle of first power control signal.Control switch unit 1031 provides the voltage of second magnitude of voltage for power device 1032 according to second power control signal.Temperature sensor detects the temperature of current thermal load module 103, and temperature signal is sent to control module 101.Sustainable a period of time of this testing process, control module 101 can periodically be sampled to temperature signal, obtains temperature value by temperature signal, to know the degree of heat radiation of thermal load module.
Can also carry out third and fourth, five ... inferior test, similar with above process, repeat no more herein.By above description as can be known, present embodiment can by changing control signal, be realized the heat radiation test of thermal load module 103 under different capacity reduced test period under the situation of the structure that does not change the heat radiation testing single-board.
Because control module 101 can send different Communication Control signals, in order to control the Communication Control signal that control module 101 sends, control module 101 can also be connected with the test platform outside the heat radiation testing single-board.Test platform can be realized by one or more computer equipments.Test platform sends different communication signal Sig1 to control module 101 and sends different Communication Control signals with control control module 101.
It is possible that the power control signal that power model 102 sends can be contained institute, as contain all possible dutycycle, perhaps contains all possible dutycycle in the adjustable voltage scope.In order to reduce testing time, can simulate by software mode earlier, obtain preferable voltage range, in this scope, attempt sending the power control signal of all possible dutycycle correspondence.
Referring to Fig. 2, in the present embodiment between control module and the power model during no annexation the heat radiation testing single-board comprise: control module 101, power model 102 and thermal load module 103.
When carrying out dispelling the heat test the first time, control module 101 sends the first break-make control signal to control switch unit 1031.Power model 102 sends first power control signal according to the first break-make control signal to control switch unit 1031.Control switch unit 1031 provides the voltage of first magnitude of voltage for power device 1032 according to first power control signal, and determine first kind of annexation with power device 1032, and carry out the make-break operation with power device 1032 according to the first break-make control signal.It is 001011 that 6 power devices, 1032, the first break-make control signals are for example arranged, and then control switch unit 1031 and the 1st, 2 and 4 power devices 1032 disconnect, and are communicated with the 3rd, 5 and 6 power devices 1032.Temperature sensor detects the temperature of current thermal load module 103, and temperature signal is sent to control module 101.Sustainable a period of time of this testing process, control module 101 can periodically be sampled to temperature signal, obtains temperature value by temperature signal, to know the degree of heat radiation of thermal load module.
The temperature value that control module 101 also is used to judge the temperature signal correspondence whether in default scope, if, determine that then test passes through, otherwise adjust Communication Control signal and output, test to carry out next time.
When carrying out dispelling the heat test the second time, control module 101 sends the second break-make control signal to control switch unit 1031.Power model 102 sends first power control signal to control switch unit 1031.Control switch unit 1031 provides the voltage of first magnitude of voltage for power device 1032 according to first power control signal, and determine second kind of annexation with power device 1032, and carry out the make-break operation with power device 1032 according to the second break-make control signal.It is 101011 that 6 power devices, 1032, the second break-make control signals are for example arranged, and then control switch unit 1031 and the 2nd and 4 power devices 1032 disconnect, and are communicated with the 1st, 3,5 and 6 power devices 1032.Temperature sensor detects the temperature of current thermal load module 103, and temperature signal is sent to control module 101.Sustainable a period of time of this testing process, control module 101 can periodically be sampled to temperature signal, obtains temperature value by temperature signal, to know the degree of heat radiation of thermal load module.
By changing the annexation of control switch unit 1031 and power device 1032, can the analog veneer design in position, size and the resistance (and then simulated power) of device.For example, 6 power devices 1032 are arranged, and resistance is all identical, adopt annexation 111000 and at 000111 o'clock, the resistance of twice connection is identical, and all is that three continuous power devices 1032 are connected, and the overall dimensions of the power device 1032 that is communicated with during twice connection is identical, because variation has taken place so be equivalent to the position in power device 1032 differences of twice connection.Perhaps, adopt annexation 100011 and at 000111 o'clock, the resistance of twice connection is identical, when adopting annexation 100011, the overall dimensions of the power device 1032 that is communicated with is equivalent to the size of thermal load module 103, when adopting annexation 000111, the overall dimensions of the power device 1032 of connection is equivalent to half size of thermal load module 103, has promptly changed the size of analog device in twice test.Perhaps, to the resistance difference between the small part power device 1032, then can under not varying sized situation, change resistance in 6 power devices 1032 by changing annexation.
By above description as can be known, present embodiment can be under the situation of the structure that does not change the heat radiation testing single-board, by changing control signal (as the break-make control signal), realize the heat radiation test of thermal load module 103 under diverse location, size and power reduced test period.
Because control module 101 can send different break-make control signals, in order to control the break-make control signal that control module 101 sends, control module 101 can also be connected with the test platform outside the heat radiation testing single-board.Test platform can be realized by one or more computer equipments.Test platform sends different communication signal Sig1 to control module 101 and sends different break-make control signals with control control module 101.
More than two kinds of test modes can also in conjunction with, referring to shown in Figure 3, the heat radiation testing single-board comprises: control module 101, power model 102 and thermal load module 103.
Wherein, the structure of control switch unit 1031 is referring to shown in Figure 4.Control switch unit 1031 comprises multi-channel switch driver and switch (K1 ... Kn).After the multi-channel switch driver is received break-make control signal Ctrl m (to the break-make control signal that m thermal load module 103 sends), by switch controlling signal Out 1 ... Out n (high level or low level signal) controls the break-make of n switch.When each switch control power device 1032 and switch closure, power control signal PWMm (to the pwm signal of m thermal load module 103 transmissions) is resistance (R1 ... Rn) provide voltage, and recently regulate average voltage by different duties.If there is not switch controlling signal Out 1 ... Out n, then switch is in closure state all the time.
The utility model embodiment increases control module and power model on the heat radiation testing single-board, power model sends different power control signals to the thermal load module, power with control thermal load module, and then detecting the degree of heat radiation of thermal load module under different power, control module is come power controlling module transmitting power control signal by the Communication Control signal.And/or the utility model embodiment increases control module and power model on the heat radiation testing single-board, and a plurality of power devices are set in the thermal load module.Power model is to thermal load module transmitting power control signal.Control module sends the break-make control signal to the thermal load module, with conducting or the disconnection of controlling a plurality of power devices, and then resistance, size and the position of control thermal load module, thereby detect the degree of heat radiation of thermal load module under different resistances (being equivalent to different capacity), size and position.
Obviously, those skilled in the art can carry out various changes and modification to the utility model and not break away from spirit and scope of the present utility model.Like this, if of the present utility model these are revised and modification belongs within the scope of the utility model claim and equivalent technologies thereof, then the utility model also is intended to comprise these changes and modification interior.
Claims (9)
1. a heat radiation testing single-board is characterized in that, comprising: control module, the power model that is connected with control module and thermal load module; The thermal load module comprises control switch unit, power device and temperature sensor; Control switch unit is connected with power model, and the temperature output terminal of temperature sensor is connected with control module, an end ground connection of power device, and the other end connects control switch unit; Wherein
Control module is used for sending the Communication Control signal to power model, with the power control signal of notifying power model to export;
Power model is used for according to the Communication Control signal to the control switch unit transmitting power control signal, with the power on the control thermal load module;
Control switch unit in the thermal load module is according to the power of power control signal power controlling device;
Temperature sensor in the thermal load module detects the temperature of thermal load module, and temperature signal is sent to control module.
2. heat radiation testing single-board as claimed in claim 1 is characterized in that the thermal load module comprises a plurality of power devices.
3. heat radiation testing single-board as claimed in claim 2 is characterized in that control module also is connected with control switch unit, and sends the break-make control signal to control switch unit, with the conducting or the disconnection of power controlling device and control switch unit.
4. heat radiation testing single-board as claimed in claim 1 is characterized in that, control module is connected with the outer test platform of testing single-board that dispels the heat, and the communication signal that the acceptance test platform sends is to control the Communication Control signal that need export.
5. as each described heat radiation testing single-board in the claim 1 to 4, it is characterized in that the thermal load module is a plurality of.
6. a heat radiation testing single-board is characterized in that, comprising: control module, power model and thermal load module; The thermal load module comprises control switch unit, temperature sensor and a plurality of power device; Control switch unit is connected with power model with control module, and the temperature output terminal of temperature sensor is connected with control module, an end ground connection of power device, and the other end connects control switch unit; Wherein
Control module is used for sending the break-make control signal to control switch unit, with the conducting or the disconnection of power controlling device and control switch unit;
Power model is used for to the control switch unit transmitting power control signal, with the power on the control thermal load module;
Control switch unit in the thermal load module is according to the power of power control signal power controlling device;
Temperature sensor in the thermal load module detects the temperature of thermal load module, and temperature signal is sent to control module.
7. heat radiation testing single-board as claimed in claim 6 is characterized in that, control module also is used for sending the Communication Control signal to power model, with the power control signal of notifying power model to export.
8. heat radiation testing single-board as claimed in claim 6 is characterized in that, control module is connected with the outer test platform of testing single-board that dispels the heat, and the communication signal that the acceptance test platform sends is to control the Communication Control signal that need export.
9. as each described heat radiation testing single-board in the claim 6 to 8, it is characterized in that the thermal load module is a plurality of.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201020224566XU CN201697983U (en) | 2010-06-07 | 2010-06-07 | Heat-dissipation test single board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201020224566XU CN201697983U (en) | 2010-06-07 | 2010-06-07 | Heat-dissipation test single board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201697983U true CN201697983U (en) | 2011-01-05 |
Family
ID=43399230
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201020224566XU Expired - Lifetime CN201697983U (en) | 2010-06-07 | 2010-06-07 | Heat-dissipation test single board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201697983U (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102706386A (en) * | 2012-05-23 | 2012-10-03 | 烽火通信科技股份有限公司 | Single disc used for simulating heat consumption of IC (integrated circuit) chip |
| CN103995556A (en) * | 2014-05-30 | 2014-08-20 | 深圳市伟佰利科技有限公司 | Thermal load with power capable of being continuously adjusted and method |
| CN104236845A (en) * | 2013-06-08 | 2014-12-24 | 上海宽带技术及应用工程研究中心 | ATCA board wind resistance test method and system based on PICMG 3.0 standard |
| CN106338375A (en) * | 2015-07-08 | 2017-01-18 | 上海宽带技术及应用工程研究中心 | Equipment cabinet board card heat testing method and device |
-
2010
- 2010-06-07 CN CN201020224566XU patent/CN201697983U/en not_active Expired - Lifetime
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102706386A (en) * | 2012-05-23 | 2012-10-03 | 烽火通信科技股份有限公司 | Single disc used for simulating heat consumption of IC (integrated circuit) chip |
| CN104236845A (en) * | 2013-06-08 | 2014-12-24 | 上海宽带技术及应用工程研究中心 | ATCA board wind resistance test method and system based on PICMG 3.0 standard |
| CN104236845B (en) * | 2013-06-08 | 2016-11-23 | 上海宽带技术及应用工程研究中心 | ATCA board windage method of testing based on PICMG 3.0 standard and system |
| CN103995556A (en) * | 2014-05-30 | 2014-08-20 | 深圳市伟佰利科技有限公司 | Thermal load with power capable of being continuously adjusted and method |
| CN103995556B (en) * | 2014-05-30 | 2016-01-20 | 深圳市伟佰利科技有限公司 | A kind of can the heat load of regulating power and method continuously |
| CN106338375A (en) * | 2015-07-08 | 2017-01-18 | 上海宽带技术及应用工程研究中心 | Equipment cabinet board card heat testing method and device |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| EP1870796A3 (en) | Storage system and storage control method achieving both power saving and good performance | |
| CN101907689B (en) | Generation method and device of test circuit and power supply testing system | |
| CN201697983U (en) | Heat-dissipation test single board | |
| WO2009143487A3 (en) | Thermal management for data modules | |
| WO2008088732A3 (en) | Temperature sensing system | |
| CN103092147B (en) | There is the process control field device of circuit protection | |
| CN103364742B (en) | Sub-circuit board of testing and monitoring system of aged vehicle | |
| CN101359305B (en) | Computer power measuring device | |
| CN103403559A (en) | Voltage detection apparatus and method of reducing dispersion of dark currents | |
| CN202337812U (en) | Temperature control system for quenching furnace | |
| CN201001123Y (en) | Wireless sensor network node | |
| CN202535392U (en) | Protocol conversion device | |
| CN103344800B (en) | Program-control electronic load for relay protection | |
| CN203276994U (en) | Multi-range electronic resistor | |
| CN203118698U (en) | Precise digital regulation rheostat circuit | |
| CN203274783U (en) | Automobile instrument debugging system | |
| CN207664958U (en) | A kind of high precision numerical control attenuator | |
| CN105203232A (en) | Two-wire system pressure acquisition transmitter | |
| CN204761160U (en) | Feeder protection equipment | |
| CN204131496U (en) | A kind of intelligent RS-232 turns RS-485/RS-422 device | |
| CN202337802U (en) | Temperature control system of extrusion quenching machine tool | |
| CN201984305U (en) | Electric equipment control device capable of presetting operation | |
| CN204392571U (en) | Sound detection circuit system | |
| WO2013143461A1 (en) | An all-in-one wireless weighing module | |
| CN204513704U (en) | Multifunctional air duct formula humiture transducer |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20110105 |