CN201695611U - Novel structure of ceramic plate - Google Patents
Novel structure of ceramic plate Download PDFInfo
- Publication number
- CN201695611U CN201695611U CN2010200264488U CN201020026448U CN201695611U CN 201695611 U CN201695611 U CN 201695611U CN 2010200264488 U CN2010200264488 U CN 2010200264488U CN 201020026448 U CN201020026448 U CN 201020026448U CN 201695611 U CN201695611 U CN 201695611U
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- ceramic wafer
- ceramic plate
- enhancement layer
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- utility
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Abstract
The utility model discloses a novel structure of a ceramic plate, which comprises a ceramic plate body, wherein the back side of the ceramic plate body is provided with a reinforcing layer which is combined into a whole body with the ceramic plate body. The reinforcing layer is a braided bag or other fiber cloth, the braided bag or the fiber cloth is combined into a whole body with the ceramic plate body, the intensity is increased by more than five times, and the brittleness of the ceramic plate can be reduced. The utility model has the characteristics of environment protection, no radiation, high hardness, low brittleness and the like.
Description
Technical field
The utility model discloses a kind of new structure of ceramic wafer, belongs to constructional materials manufacturing technology field, refers in particular to the architectural pottery plate that can improve intensity.
Background technology
Ceramic wafer is the adjustment that homogenizes of raw materials such as natural potter's clay, forms through high pressure extrusion molding, low temperature drying and high-temperature firing, have environmental protection, radiationless, color and luster is gentle, can not bring characteristics such as light pollution, is one of modern architecture material.
Existing ceramic wafer adds other compositions such as quartz, float stone, feldspar and colorant on a small quantity owing to all be to be primary raw material with natural potter's clay, and the ceramic wafer that is made into is more crisp, and hardness is lower, use or breakage when installation process, usually occurs, not only increased cost, also delayed the building time.
The inventor creates novel ceramic wafer structure, so proposition of the present utility model is just arranged through long term test and research.
Summary of the invention
At the deficiencies in the prior art, the utility model provides a kind of new structure of rational in infrastructure, ceramic wafer that the high fragility of intensity is low.
For achieving the above object, the utility model is achieved through the following technical solutions:
A kind of new structure of ceramic wafer comprises the ceramic wafer main body, and wherein the back side of ceramic wafer main body is provided with an enhancement Layer, and this enhancement Layer and ceramic wafer body junction are integrated.
Further, described enhancement Layer is the back side that is adhered to the ceramic wafer main body, so that each raw material of ceramic wafer fixes as one more closely.
Further, described enhancement Layer is a woven bag, and this woven bag and ceramic wafer body junction are integrated, and has increased the intensity more than five times, and the fragility of ceramic wafer is reduced.
Further, described enhancement Layer is nonwoven or other cloth, and purpose is to strengthen the intensity of ceramic wafer.
The utility model is to add one deck woven bag or other fibrous material at the back side of ceramic wafer, having increased the intensity more than five times, and reduces the fragility of ceramic wafer.
The utlity model has environmental protection, radiationless, characteristics such as the high fragility of hardness is low.
Description of drawings
Fig. 1 is the utility model structural representation;
Fig. 2 is the utility model lateral view.
The specific embodiment
The utility model is described in further detail below in conjunction with accompanying drawing:
Embodiment: structure as shown in Figures 1 and 2, a kind of new structure of ceramic wafer comprises ceramic wafer main body 1, wherein the back side of ceramic wafer main body 1 is provided with an enhancement Layer, this enhancement Layer and ceramic wafer main body 1 are combined as a whole.
Enhancement Layer is the back side that is adhered to the ceramic wafer main body, so that each raw material of ceramic wafer fixes as one more closely.
Enhancement Layer is a woven bag 2, and this woven bag 2 is combined as a whole with ceramic wafer main body 1, has increased the intensity more than five times, and the fragility of ceramic wafer is reduced.
In addition, enhancement Layer also can be nonwoven or other cloth, and purpose is to strengthen the intensity of ceramic wafer.
The utility model is to add one deck woven bag or other fibrous material at the back side of ceramic wafer, having increased the hardness more than five times, and reduces the fragility of ceramic wafer.
Technical data of the present utility model is as follows:
◇ water absorption rate: 0～10%;
The ◇ radionuclide is limited the quantity of and is belonged to the requirement of category-A finishing material, and its production and marketing and the scope of application are unrestricted;
◇ frost resistance: flawless and peeling off behind 100 circulating freezing resistances;
◇ fracture strength: 4mm thickness 4.01KN, 13mm thickness 6.64KN;
The ◇ fireproof performance: fire-protection rating is A1;
◇ resistance to acids and bases: GA level;
The ◇ abrasion resistance: 4 grades/2100 change;
The anti-glaze fragility of ◇: no glaze splits;
◇ shock resistance: surpass 10 degree and provide fortification against earthquakes;
The ◇ pressure decay test: reaching 4KPa does not have destruction;
The average 16.5Mpa of the ◇ modulus of rupture: 4mm, minimum 14.4Mpa; The average 18.5Mpa of 13mm, minimum 18.0Mpa.
The above record only for utilizing the embodiment of this origination techniques content, anyly is familiar with modification, the variation that this skill person uses this creation to do to do, and all belongs to the claim of this creation opinion, and is not limited to those disclosed embodiments.
Claims (4)
1. the new structure of a ceramic wafer comprises the ceramic wafer main body, it is characterized in that: the back side of described ceramic wafer main body is provided with an enhancement Layer, and this enhancement Layer and ceramic wafer body junction are integrated.
2. the new structure of a kind of ceramic wafer according to claim 1, it is characterized in that: described enhancement Layer is the back side that is adhered to the ceramic wafer main body, so that each raw material of ceramic wafer fixes as one more closely.
3. the new structure of a kind of ceramic wafer according to claim 1, it is characterized in that: described enhancement Layer is a woven bag, this woven bag and ceramic wafer body junction are integrated.
4. the new structure of a kind of ceramic wafer according to claim 1, it is characterized in that: described enhancement Layer is nonwoven or other cloth.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010200264488U CN201695611U (en) | 2010-01-04 | 2010-01-04 | Novel structure of ceramic plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010200264488U CN201695611U (en) | 2010-01-04 | 2010-01-04 | Novel structure of ceramic plate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201695611U true CN201695611U (en) | 2011-01-05 |
Family
ID=43396850
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010200264488U Expired - Fee Related CN201695611U (en) | 2010-01-04 | 2010-01-04 | Novel structure of ceramic plate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201695611U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103739268A (en) * | 2013-12-13 | 2014-04-23 | 深圳大学 | Fiber composite material reinforced ceramic plate and preparation method thereof |
-
2010
- 2010-01-04 CN CN2010200264488U patent/CN201695611U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103739268A (en) * | 2013-12-13 | 2014-04-23 | 深圳大学 | Fiber composite material reinforced ceramic plate and preparation method thereof |
| CN103739268B (en) * | 2013-12-13 | 2016-07-06 | 深圳大学 | Fibrous composite strengthens ceramic wafer and manufacture method thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20110105 Termination date: 20180104 |