CN201685339U - Diamond saw blade - Google Patents
Diamond saw blade Download PDFInfo
- Publication number
- CN201685339U CN201685339U CN2010202201591U CN201020220159U CN201685339U CN 201685339 U CN201685339 U CN 201685339U CN 2010202201591 U CN2010202201591 U CN 2010202201591U CN 201020220159 U CN201020220159 U CN 201020220159U CN 201685339 U CN201685339 U CN 201685339U
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- China
- Prior art keywords
- saw blade
- diamond
- thickness
- substrate
- matrix
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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Abstract
The utility model discloses a diamond saw blade comprising a substrate, cutting heads and flange plates. The cutting heads are fixedly arranged around the outer circumference of the substrate and the two side walls of the substrate are respectively arranged with flange plates; the substrate has a 12 inch diameter and is about 1.6 millimeters to 2.0 millimeters thick; the cutting heads are around 1.8 millimeters to 2.2 millimeters thick while the flange plates about 2 millimeters to 5 millimeters thick. The diamond saw blade of the utility model are provided with thin cutting heads with narrow kerfs; when used for processing highly hard refractory ceramics, high cutting quality can be gained; the introduction of two flange plates to the two side walls of the substrate increases the strength of the substrate and makes the substrate free of shaking or deforming when cut by the saw blade in a split-second; the vortex type groove can quickly dispense generated chips, therefore, achieving good heat dissipation effects.
Description
Technical field
The utility model relates to a kind of diamond saw blade that is used to cut high hard refractory ceramic material.
Background technology
Diamond saw blade has been widely used in manufacture fields such as stone material, building materials now.When materials such as the high hard pottery of processing, because of such material price height, material is crisp firmly, and difficulty of processing is big, and the cutting of existing diamond saw blade can not take into account working (machining) efficiency (cutting speed) and cutting effect (otch collapse limit), so general the employing step by step cut, slot with low speed earlier, and then the mode of cutting off, complex procedures, machining accuracy is poor, and efficient is lower.
The utility model content
The purpose of this utility model is to provide a kind of cutting speed to reach the diamond saw blade of good cutting effect soon in order to solve the problems of the technologies described above.
To achieve these goals, the utility model is by the following technical solutions:
A kind of diamond saw blade, it comprises: matrix, diamond segment and flange plate at the intrinsic diamond segment of excircle wall ring of this matrix, are installed with flange plate respectively in the two side walls of described matrix.
The diameter of described diamond disc is 12 inches, and its matrix thickness is 1.6-2.0mm, and the thickness of described diamond segment is 1.8-2.2mm, and the thickness of described flange plate is 2-5mm.
The diameter of described diamond disc is the 9-10 inch, and its matrix thickness 1.5-1.7mm, the thickness of its diamond segment are 1.8-2.0mm, and the thickness of its flange plate is 2-5mm.
The diameter of described diamond disc is 8 inches, and its matrix thickness 1.3-1.5mm, the thickness of its diamond segment are 1.6-1.8mm, and the thickness of its flange plate is 2-5mm.
The even spacer ring in the two sides of described diamond segment is provided with some Scroll-type grooves that are.
Described diamond segment pressure sintering is in the excircle wall of described matrix.
Described flange plate spot welding, bonding or be riveted on the two ends wall of described matrix.
The beneficial effects of the utility model: the resulting diamond saw blade of the utility model, its diamond segment thin thickness, joint-cutting is narrow, the high hard refractory ceramic material cutting efficiency height of its processing, cut quality is good; At the both sides of matrix welded flange, to improve matrix strength, matrix can not be out of shape or shake when making the saw blade fly-cutting; Offer the chip removal fast of Scroll-type groove on the cutter head, improve radiating effect.
Description of drawings
Fig. 1 is the structural representation of the utility model diamond saw blade;
Fig. 2 is the side-looking structural representation of Fig. 1.
The specific embodiment
As depicted in figs. 1 and 2, a kind of diamond saw blade, it comprises: matrix 1, diamond segment 2 and flange plate 3, be equipped with diamond segment 2 at the excircle wall of matrix 1, in the two side walls of matrix 1 flange plate 3 is set respectively.
Diamond disc diameter be 12 inches, thickness is 1.6-2.0mm, the thickness of diamond segment 2 is 1.8-2.2mm, the thickness of flange plate 3 is 2-5mm.Its diamond segment thinner thickness, joint-cutting is narrow, good cutting effect.
The diameter of diamond disc is the 9-10 inch, and its matrix thickness 1.5-1.7mm, the thickness of its diamond segment are 1.8-2.0mm, and the thickness of its flange plate is 2-5mm.
The diameter of diamond disc is 8 inches, and its matrix thickness 1.3-1.5mm, the thickness of its diamond segment are 1.6-1.8mm, and the thickness of its flange plate is 2-5mm.
For quick chip removal, improve radiating effect, be provided with some Scroll-type grooves 21 that are at the even spacer ring in the two sides of diamond segment 2.
The mesopore 31 of flange plate 3 and matrix 1 mesopore 11 is concentric with the footpath, flange plate 3 spot welding respectively, bonding or be riveted on the two ends wall of matrix 1.
More than be preferred embodiment of the present utility model and design graphic; above-mentioned preferred embodiment and designing graphicly only illustrates; be not to be used to limit interest field of the present utility model; all with equalization technological means or be the interest field that contained of the application's claim and the implementer does not all break away from protection domain of the present utility model.
Claims (7)
1. diamond saw blade, it is characterized in that: it comprises: matrix, diamond segment and flange plate at the intrinsic cutter head of excircle wall ring of this matrix, are installed with flange plate respectively in the two side walls of described matrix.
2. diamond saw blade according to claim 1, it is characterized in that: the diameter of described diamond saw blade is that 12 inches, the thickness of its described matrix are 1.6-2.0mm, the thickness of its described diamond segment is 1.8-2.2mm, and the thickness of its described flange plate is 2-5mm.
3. diamond saw blade according to claim 1, it is characterized in that: the diameter of described diamond disc is the 9-10 inch, its described matrix thickness 1.5-1.7mm, the thickness of its described diamond segment are 1.8-2.0mm, and the thickness of its described flange plate is 2-5mm.
4. diamond saw blade according to claim 1 is characterized in that: the diameter of described diamond disc is 8 inches, and its described matrix thickness 1.3-1.5mm, the thickness of its described diamond segment are 1.6-1.8mm, and the thickness of its described flange plate is 2-5mm.
5. according to each described diamond saw blade in the claim 1 to 4, it is characterized in that: the even spacer ring in the two sides of described diamond segment is provided with some Scroll-type grooves that are.
6. diamond saw blade according to claim 5 is characterized in that: described diamond segment pressure sintering is in the excircle wall of described matrix.
7. diamond saw blade according to claim 6 is characterized in that: described flange plate spot welding, bonding or be riveted on the two ends wall of described matrix.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010202201591U CN201685339U (en) | 2010-06-09 | 2010-06-09 | Diamond saw blade |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010202201591U CN201685339U (en) | 2010-06-09 | 2010-06-09 | Diamond saw blade |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201685339U true CN201685339U (en) | 2010-12-29 |
Family
ID=43373628
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010202201591U Expired - Lifetime CN201685339U (en) | 2010-06-09 | 2010-06-09 | Diamond saw blade |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201685339U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103950111A (en) * | 2014-05-20 | 2014-07-30 | 江苏锋泰工具有限公司 | Strengthened type ultrathin diamond disc |
| CN104149205A (en) * | 2014-08-15 | 2014-11-19 | 福建万龙金刚石工具有限公司 | Large-span bridge type intelligent stone cutting method and stone cutting machine for large-span bridge type intelligent stone cutting method |
-
2010
- 2010-06-09 CN CN2010202201591U patent/CN201685339U/en not_active Expired - Lifetime
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103950111A (en) * | 2014-05-20 | 2014-07-30 | 江苏锋泰工具有限公司 | Strengthened type ultrathin diamond disc |
| CN103950111B (en) * | 2014-05-20 | 2015-09-30 | 江苏锋泰工具有限公司 | Reinforced superthin diamond circular saw web |
| CN104149205A (en) * | 2014-08-15 | 2014-11-19 | 福建万龙金刚石工具有限公司 | Large-span bridge type intelligent stone cutting method and stone cutting machine for large-span bridge type intelligent stone cutting method |
| CN104149205B (en) * | 2014-08-15 | 2016-04-06 | 福建万龙金刚石工具有限公司 | Wide span bridge type intelligence cuts cubic meter of stone method and stonecutter thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term |
Granted publication date: 20101229 |
|
| CX01 | Expiry of patent term |