CN201682693U - Electromagnetic band gap structure - Google Patents
Electromagnetic band gap structure Download PDFInfo
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- CN201682693U CN201682693U CN2010202099979U CN201020209997U CN201682693U CN 201682693 U CN201682693 U CN 201682693U CN 2010202099979 U CN2010202099979 U CN 2010202099979U CN 201020209997 U CN201020209997 U CN 201020209997U CN 201682693 U CN201682693 U CN 201682693U
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Abstract
The utility model relates to an electromagnetic band gap structure which comprises a plurality of circuit units formed on a circuit board and distributed peripherally; the circuit board is multi-layered, each circuit unit comprises an equivalent capacitor structure and an inductor connected with the equivalent capacitor structure; and the inductor is formed by construction of the wires distributed on a plurality of metal layers. The electromagnetic band gap structure can be flexibly realized on the circuit board conveniently, and can be applicable to a microwave circuit with lower frequency.
Description
Technical field
The utility model relates to microwave circuit, relates in particular to the control of the propagation of the electromagnetic field in the microwave circuit.
Background technology
1987, Yablonovitch and John respectively discuss the periodic dielectric structure to material in during the influencing of light dissemination, " photonic crystal " these new ideas have been proposed independently of one another.Photonic crystal is exactly a kind of medium artificial crystal that periodic arrangement is formed in another kind of medium, and this arrangement cycle is a wavelength magnitude.The cycle of photonic crystal medium refractive index changes periodically potential field is similar to the influence of electronics in the influence of photon and the semi-conducting material.In photonic crystal,, dielectric constant is similar to the such periodicity potential field of semiconductor crystal because in the cyclic variation in space, also existing.When big and period of change was with light wavelength comparability plan when the amplitude of variation of dielectric constant, the Bragg diffraction of medium will produce band gap, promptly photon band gap (photonic bandgap, PBG).Photonic crystal also is electromagnetic crystals (electromagnetic crystals) or photon band gap (electro-magnetic bandgap) material.The essential characteristic of photonic crystal is to have photon band gap, and the electromagnetic wave that frequency drops in the band gap is forbidden propagating.
(Electromagnetic Band Gap is again from PBG development EBG) to electromagnetic bandgap structure, and it is a kind ofly to have periodic structure, the electromagnetic wave of some frequency range can't therefrom be passed through, and has tangible forbidden band characteristic.Utilize this specific character, the road that can suppress circuit is asked coupling, improves the Q value of resonator, is made microwave devices such as low pass filter, power splitter, can also be used to the suppressing antenna secondary lobe, improves antenna gain and bandwidth, and its application prospect is very wide.
The EBG structure be in essence by unit such as different medium, metal and mixtures by band stop filter that periodic arrangement constitutes, the characteristic frequency electromagnetic wave is had band resistance characteristic, also have the slow wave effect simultaneously, high impedance surface characteristic etc.The EBG structure can be divided into many types according to its different characteristics and performance, and main sorting technique has: be divided into and be used for microstrip line, complanar line, the line of rabbet joint, the first-class electromagnetic bandgap structure of co-planar waveguide by being applied to dissimilar transmission lines; Space dimensionality by periodic structure is divided into one dimension, two dimension, three-dimensional structure; Shape by the cycle is divided into cube, triangle, spiral type and diamond etc.; Be divided into medium, metal, reach medium/metal mixture etc. by medium material; Character by material is divided into isotropism, each same opposite sex, revolves the ripple medium, reaches two anisotropy etc.; Structure by periodic unit realizes being divided into boring on ground plate pit pbg structure (being used for microwave circuit), the substrate, medium or Metallic rod arrangement (being used for antenna) etc.Although the kind and the form of EBG structure are various, its common-base present principles can both suppress the electromagnetic wave in the stopband range effectively, so as to improving the performance of circuit element.Because the EBG structure can suppress surface current, therefore can form inner or outside surface by choosing suitable EBG structure, reduce the coupling that causes by surface current in the public ground, thereby reach the purpose of isolating interference source and disturbed equipment.
Existing a kind of EBG structure is high impedance surface (HIGP) type, and the surface current ground connection of medium is equivalent to short circuit, and surface current, surface wave are inhibited.Dielectric upper surface square-shaped metal paster that periodically distributing, square paster central authorities make it to be connected with the metal base plate of dielectric lower surface with the metallic conductor post, and in its structure there be concrete parameter: metal patch width=5mm, adjacent metal paster interval=0.3mm, metallic conductor post height=1.5mm, metallic conductor column diameter=0.5mm, adjacent metal conductor pin centre-to-centre spacing=2.65mm.This structure can equivalence be a lc circuit in parallel, can equivalence be capacitor C between the metal patch, and L mainly is that the metallic conductor post links to each other with metal base plate and the inductance that produces around.The value of C and L is the function of the architectural feature of metal patch and metallic conductor post, can estimate by certain formula.
Normally, when on printed circuit board (PCB), realizing the EBG structure, a kind of distortion of above-mentioned EBG structure also can appear, that is exactly: change square paster into diameter bigger metallic conductor post, so, can be the bigger metallic conductor post of first height and the metallic conductor post of second height in the thickness direction zoning of printed circuit board (PCB), can equivalence be capacitor C between the bigger metallic conductor post, and obviously the metal patch that C value at this moment will be more above-mentioned is big.Yet even if this structure, its band resistance frequency points corresponding still can be more than 5GHz, and below 2.4GHz, even frequency is difficult to be suitable in the application of hundreds of MHz.
The utility model content
The technical problems to be solved in the utility model is to overcome above-mentioned the deficiencies in the prior art, and proposes a kind of EBG structure that goes for the microwave circuit of lower frequency.
The utility model solves the problems of the technologies described above the technological means that is adopted and comprises, a kind of electromagnetic bandgap structure is proposed, be included in a plurality of circuit units of the period profile that forms on the circuit board, this circuit board is a multilayer, each circuit unit comprises an equivalent capacitance structure and the inductance that links to each other with this equivalence capacitance structure, and this inductance is to form by the lead structure that is distributed on a plurality of metal levels.
By on circuit board, directly making up inductance, such as: coil inductance, can design the inductance L in the LC equivalent electric circuit easily, thereby simplify the realization of EBG structure in the practical application.
Compared with prior art, electromagnetic bandgap structure of the present utility model can be realized on circuit board easily flexibly, can be applicable to the microwave circuit of lower frequency.
Description of drawings
Fig. 1 is the facade structures schematic diagram of electromagnetic bandgap structure embodiment of the present utility model.
Fig. 2 is the planar structure schematic diagram of electromagnetic bandgap structure embodiment of the present utility model.
Embodiment
In order to further specify principle of the present utility model and structure, now in conjunction with the accompanying drawings preferred embodiment of the present utility model is elaborated.
As illustrated in fig. 1 and 2, electromagnetic bandgap structure embodiment of the present utility model, be included in a plurality of circuit units 2 of the period profile that forms on the circuit board 1, this circuit board 1 is a multilayer, and each circuit unit 2 comprises an equivalent capacitance structure 21 and the inductance 22 that links to each other with this equivalence capacitance structure 21.This circuit board 1 is LTCC (LTCC) material.Because the characteristic of LTCC material itself relatively is applicable to microwave circuit.
This equivalence capacitance structure 21 in each circuit unit 2 comprises at least two sheet metals 211,212 that are distributed at least two metal levels, these sheet metals the 211, the 212nd, mutual conduction.
This structure is the metallic conductor rod structure realization capacitor C of imitating prior art with the structure of multilayer, than the capacitor C of metal patch, bigger value can be arranged.
In this equivalence capacitance structure 21, in at least two metal levels 211,212 at these sheet metal places, wherein have at least the sheet metal 211 in the equivalent capacity structure 21 that belongs to another circuit unit 2 on sheet metal 212 and other at least one metal levels in the equivalent capacity structure 21 that belongs to a circuit unit 2 on the metal level to have space overlap.
This structure, staggered by forming between the sheet metal between the different aspects, can increase the coupling between the equivalent capacity structure of adjacent circuit unit, thereby increase the value of capacitor C, to adapt to application than the microwave circuit of low frequency.
These sheet metals are rectangles, or the combination pattern of two and two above rectangles.
This structure, implement more convenient, need to prove, the equivalent capacity structure that constitutes with two-layer sheet metal is an example, the sheet metal that is in the ground floor and the second layer in the equivalent capacity structure of a circuit unit is a mutual conduction, and the sheet metal that is in second layer intermediate layer then can laterally protrude into the ground floor below in the equivalent capacity structure of another adjacent circuit unit, thereby spatially, with the equivalent capacity structure of another circuit unit in the sheet metal of ground floor have space overlap.The equivalent capacity structure that constitutes with three layers sheet metals is an example, the sheet metal that is in ground floor and the 3rd layer in the equivalent capacity structure of a circuit unit can be a space coincidence, the sheet metal that is in the second layer then can laterally protrude between ground floor in the equivalent capacity structure of adjacent another or more than one circuit unit and the 3rd layer, thereby spatially, with the equivalent capacity structure of another circuit unit in ground floor and the 3rd layer sheet metal have space overlap.With four layers be example, can be that first and third layer sheet metal shape is identical with the position, second, four layer sheet metal shape is identical with the position, but there is space overlap in the sheet metal of first and third layer sheet metal and second, four layer.With five layers is example, as shown in Figure 1, the sheet metal 211,213,215 that can be first and third, five layer is rectangle, their shape is identical with the position, the second, four layers sheet metal 212,214 is the combination of two rectangles, their shape is identical with the position, but there is space overlap in second, four layer sheet metal 212,214 in first and third, five layer the sheet metal 211,213,215 in circuit unit 2 and adjacent two circuit units 2 (comprising that row is that row is gone up adjacent one and listed adjacent).
This inductance 22 is to form by lead 221,222,223,224 structures that are distributed on a plurality of metal levels.
This circuit board 1 can also comprise the base plate 3 that is made of metal level, an end of the inductance 22 in these each circuit units 2 by lead 23 link to each other with equivalent capacity structure 21, the other end passes through lead 4 and links to each other with this base plate 3.This structure by direct structure one base plate 3, constructs a defect grounding structure (DGS) jointly with these circuit units 2, suppressing electromagnetic interference to the microwave circuit on this circuit board, such as: the influence of antenna, filter etc.
In another embodiment of electromagnetic bandgap structure of the present utility model, this equivalence capacitance structure 21 in each circuit unit 2 can be the sheet metal that is distributed in a metal level (scheming not shown) as the metal patch of prior art.This structure, the metal patch of continuing to use prior art is realized the capacitor C in the LC equivalent electric circuit, is easy to realize that cost is also very low.
It below only is preferable possible embodiments of the present utility model; and unrestricted protection range of the present utility model; so the equivalent structure that all utilization the utility model specifications and accompanying drawing content are made changes; such as: the shape of above-mentioned sheet metal is comprised that by comprising that at least one rectangle changes at least one hexagon or rectangle and hexagon get combination pattern, all are included in the protection range of the present utility model.
Claims (8)
1. electromagnetic bandgap structure, be included in a plurality of circuit units of the period profile that forms on the circuit board, it is characterized in that, this circuit board is a multilayer, each circuit unit comprises an equivalent capacitance structure and the inductance that links to each other with this equivalence capacitance structure, and this inductance is to form by the lead structure that is distributed on a plurality of metal levels.
2. according to the described electromagnetic bandgap structure of claim 1, it is characterized in that this equivalence capacitance structure in each circuit unit comprises a sheet metal that is distributed in a metal level.
3. according to the described electromagnetic bandgap structure of claim 1, it is characterized in that this equivalence capacitance structure in each circuit unit comprises at least two sheet metals that are distributed at least two metal levels, these sheet metals are mutual conduction.
4. according to the described electromagnetic bandgap structure of claim 3, it is characterized in that, in at least two metal levels at these sheet metal places, wherein have at least the sheet metal in the equivalent capacity structure that belongs to adjacent at least one circuit unit on sheet metal in the equivalent capacity structure that belongs to a circuit unit on the metal level and other at least one metal levels to have space overlap.
5. according to the described electromagnetic bandgap structure of claim 4, it is characterized in that these sheet metals comprise at least one rectangle.
6. according to the described electromagnetic bandgap structure of claim 4, it is characterized in that these sheet metals comprise at least one hexagon.
7. according to the described electromagnetic bandgap structure of claim 1, it is characterized in that this circuit board is the LTCC material.
8. according to the arbitrary described electromagnetic bandgap structure of claim 1 to 7, it is characterized in that this circuit board also comprises the base plate that is made of metal level, an end of the inductance in these each circuit units links to each other with the equivalent capacity structure, the other end links to each other with this base plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010202099979U CN201682693U (en) | 2010-05-31 | 2010-05-31 | Electromagnetic band gap structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010202099979U CN201682693U (en) | 2010-05-31 | 2010-05-31 | Electromagnetic band gap structure |
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| Publication Number | Publication Date |
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| CN201682693U true CN201682693U (en) | 2010-12-22 |
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| CN2010202099979U Expired - Lifetime CN201682693U (en) | 2010-05-31 | 2010-05-31 | Electromagnetic band gap structure |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102479998A (en) * | 2011-03-15 | 2012-05-30 | 深圳光启高等理工研究院 | Electromagnetic transparent metamaterial |
| CN109411889A (en) * | 2018-10-26 | 2019-03-01 | 扬州市伟荣新材料有限公司 | Antenna regular hexagon type EBG structure and its manufacturing process |
| CN110690179A (en) * | 2019-09-29 | 2020-01-14 | 成都航天科工微电子系统研究院有限公司 | Laminated low-loss chip integrated waveguide packaging structure |
| CN111052509A (en) * | 2017-08-30 | 2020-04-21 | 株式会社村田制作所 | Antenna module |
| CN114245564A (en) * | 2021-11-30 | 2022-03-25 | 苏州浪潮智能科技有限公司 | Printed circuit board |
-
2010
- 2010-05-31 CN CN2010202099979U patent/CN201682693U/en not_active Expired - Lifetime
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102479998A (en) * | 2011-03-15 | 2012-05-30 | 深圳光启高等理工研究院 | Electromagnetic transparent metamaterial |
| CN111052509A (en) * | 2017-08-30 | 2020-04-21 | 株式会社村田制作所 | Antenna module |
| CN109411889A (en) * | 2018-10-26 | 2019-03-01 | 扬州市伟荣新材料有限公司 | Antenna regular hexagon type EBG structure and its manufacturing process |
| CN109411889B (en) * | 2018-10-26 | 2021-04-16 | 扬州市伟荣新材料有限公司 | Regular hexagon type EBG structure for antenna and manufacturing process thereof |
| CN110690179A (en) * | 2019-09-29 | 2020-01-14 | 成都航天科工微电子系统研究院有限公司 | Laminated low-loss chip integrated waveguide packaging structure |
| CN114245564A (en) * | 2021-11-30 | 2022-03-25 | 苏州浪潮智能科技有限公司 | Printed circuit board |
| CN114245564B (en) * | 2021-11-30 | 2023-07-14 | 苏州浪潮智能科技有限公司 | Printed circuit board |
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term |
Granted publication date: 20101222 |
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| CX01 | Expiry of patent term |