CN201681816U - 树脂线路板芯片倒装外接散热器封装结构 - Google Patents
树脂线路板芯片倒装外接散热器封装结构 Download PDFInfo
- Publication number
- CN201681816U CN201681816U CN2010201187987U CN201020118798U CN201681816U CN 201681816 U CN201681816 U CN 201681816U CN 2010201187987 U CN2010201187987 U CN 2010201187987U CN 201020118798 U CN201020118798 U CN 201020118798U CN 201681816 U CN201681816 U CN 201681816U
- Authority
- CN
- China
- Prior art keywords
- chip
- circuit board
- radiator
- resin circuit
- packaging structure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49171—Fan-out arrangements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73253—Bump and layer connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
本实用新型涉及一种树脂线路板芯片倒装外接散热器封装结构,包含有芯片(3)、芯片下方的所承载的单层或多层树脂线路板(9)、芯片到单层或多层树脂线路板的信号互连用的金属凸块(10)和芯片与所述单层或多层树脂线路板之间的导电或不导电的导热粘结物质I(2),其特征在于在所述芯片(3)上方设置有散热器(11),该散热器(11)与所述芯片(3)之间嵌置有导电或不导电的导热粘结物质II(6);该散热器(11)将所述芯片(3)和金属凸块(10)包封在由该散热器(11)与所述单层或多层树脂线路板(9)围成的区域内。本实用新型能够提供散热的能力强,使芯片的热量能快速的传导到封装体外界。
Description
(一)技术领域
本实用新型涉及一种树脂线路板芯片倒装外接散热器封装结构。属于半导体封装技术领域。
(二)背景技术
传统的芯片封装形式的散热方式,主要是采用了芯片下方的金属基岛作为散热传导工具或途径,而这种传统封装方式的散热传导存在以下的不足点:
1、金属基岛体积太小
金属基岛在传统封装形式中,为了追求封装体的可靠性安全,几乎都采用了金属基岛埋入在封装体内,而在有限的封装体内,同时要埋入金属基岛及信号、电源传导用的金属内脚(如图1及图2所示),所以金属基岛的有效面积与体积就显得非常的小,而同时金属基岛还要来担任高热量的散热的功能,就会显得更为的不足了。
2、埋入型金属基岛(如图1及图2所示)
金属基岛在传统封装形式中,为了追求封装体的可靠性安全,几乎都采用了金属基岛埋入在封装体内,而金属基岛是依靠左右或是四个角落细细的支撑杆来固定或支撑金属基岛,也因为这细细的支撑杆的特性,导致了金属基岛从芯片上所吸收到的热量,无法快速的从细细的支撑杆传导出来,所以芯片的热量无法或快速的传导到封装体外界,致了芯片的寿命快速老化甚至烧伤或烧坏。
3、金属基岛露出型(如图3及图4所示)
虽然金属基岛是露出的,可以提供比埋入型的散热功能还要好的散热能力,但是因为金属基岛的体积及面积在封装体内还是非常的小,所以能够提供散热的能力,还是非常有限。
(三)发明内容
本实用新型的目的在于克服上述不足,提供一种能够提供散热的能力强的树脂线路板芯片倒装外接散热器封装结构。
本实用新型的目的是这样实现的:一种树脂线路板芯片倒装外接散热器封装结构,包含有芯片、芯片下方的所承载的单层或多层树脂线路板、芯片到单层或多层树脂线路板的信号互连用的金属凸块和芯片与所述单层或多层树脂线路板之间的导电或不导电的导热粘结物质I,其特征在于在所述芯片上方设置有散热器,该散热器与所述芯片之间嵌置有导电或不导电的导热粘结物质II;该散热器将所述芯片和金属凸块包封在由该散热器与所述单层或多层树脂线路板围成的区域内。
本实用新型的有益效果是:
本实用新型通过在芯片上方增置散热器,来担任高热量的散热的功能,能够提供散热的能力强,使芯片的热量能快速的传导到封装体外界。可以应用在一般的封装形式的封装体及封装工艺上使其成为高或是超高散热(High Thermal or Super High Thermal)能力,如FBP可以成为SHT-FBP/QFN可以成为SHT-QFN/BGA可以成为SHT-BGA/CSP可以成为SHT-CSP……。避免了芯片的寿命快速老化甚至烧伤或烧坏。
(四)附图说明
图1为以往金属基岛埋入型芯片封装结构示意图。
图2为图1的俯视图。
图3为以往金属基岛露出型芯片封装结构示意图。
图4为图3的俯视图。
图5为本实用新型树脂线路板芯片倒装外接散热器封装结构示意图。
图中附图标记:
导电或不导电的导热粘结物质I2、芯片3、导电或不导电的导热粘结物质II6、树脂线路板9、金属凸块10、散热器11。
(五)具体实施方式
参见图5,图5为本实用新型树脂线路板芯片倒装外接散热器封装结构示意图。由图5可以看出,本实用新型树脂线路板芯片倒装外接散热器封装结构,包含有芯片3、芯片下方的所承载的单层或多层树脂线路板9、芯片到单层或多层树脂线路板的信号互连用的金属凸块10和芯片3与所述单层或多层树脂线路板之间的导电或不导电的导热粘结物质I 2,在所述芯片3上方设置有散热器11,该散热器11与所述芯片3之间嵌置有导电或不导电的导热粘结物质II6;该散热器11将所述芯片3和金属凸块10包封在由该散热器11与所述单层或多层树脂线路板9围成的区域内。
所述金属凸块10的材质可以是锡、金或合金等。
所述散热器11的材质可以是铜、铝、陶瓷或合金等。
Claims (3)
1.一种树脂线路板芯片倒装外接散热器封装结构,包含有芯片(3)、芯片下方的所承载的单层或多层树脂线路板(9)、芯片到单层或多层树脂线路板的信号互连用的金属凸块(10)和芯片与所述单层或多层树脂线路板之间的导电或不导电的导热粘结物质I(2),其特征在于在所述芯片(3)上方设置有散热器(11),该散热器(11)与所述芯片(3)之间嵌置有导电或不导电的导热粘结物质II(6);该散热器(11)将所述芯片(3)和金属凸块(10)包封在由该散热器(11)与所述单层或多层树脂线路板(9)围成的区域内。
2.根据权利要求1所述的一种树脂线路板芯片倒装外接散热器封装结构,其特征在于所述金属凸块(10)的材质是锡、金或合金。
3.根据权利要求1所述的一种树脂线路板芯片倒装外接散热器封装结构,其特征在于所述散热器(11)的材质是铜、铝、陶瓷或合金。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2010201187987U CN201681816U (zh) | 2010-01-30 | 2010-01-30 | 树脂线路板芯片倒装外接散热器封装结构 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2010201187987U CN201681816U (zh) | 2010-01-30 | 2010-01-30 | 树脂线路板芯片倒装外接散热器封装结构 |
Publications (1)
Publication Number | Publication Date |
---|---|
CN201681816U true CN201681816U (zh) | 2010-12-22 |
Family
ID=43346852
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2010201187987U Expired - Fee Related CN201681816U (zh) | 2010-01-30 | 2010-01-30 | 树脂线路板芯片倒装外接散热器封装结构 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN201681816U (zh) |
-
2010
- 2010-01-30 CN CN2010201187987U patent/CN201681816U/zh not_active Expired - Fee Related
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN101770997A (zh) | 树脂线路板芯片倒装带散热块封装结构 | |
CN201623107U (zh) | 印刷线路板芯片倒装散热块外接散热板封装结构 | |
CN201623022U (zh) | 印刷线路板芯片倒装外接散热板封装结构 | |
CN201681816U (zh) | 树脂线路板芯片倒装外接散热器封装结构 | |
CN201629318U (zh) | 印刷线路板芯片倒装倒t型锁定孔散热块封装结构 | |
CN201751995U (zh) | 印刷线路板芯片倒装散热块外接散热器封装结构 | |
CN201623065U (zh) | 树脂线路板芯片倒装散热块外接散热器封装结构 | |
CN201629319U (zh) | 树脂线路板芯片倒装带散热块封装结构 | |
CN201751988U (zh) | 树脂线路板芯片倒装外接散热板封装结构 | |
CN201751992U (zh) | 印刷线路板芯片倒装矩型散热块外接散热器封装结构 | |
CN201629325U (zh) | 印刷线路板芯片倒装散热块全包覆封装结构 | |
CN201623077U (zh) | 树脂线路板芯片倒装散热块外接散热板封装结构 | |
CN201623098U (zh) | 印刷线路板芯片倒装外接散热器封装结构 | |
CN201623062U (zh) | 树脂线路板芯片倒装散热块外接散热帽封装结构 | |
CN201623120U (zh) | 印刷线路板芯片倒装带散热块封装结构 | |
CN201751989U (zh) | 树脂线路板芯片倒装倒t型散热块外接散热器封装结构 | |
CN201623095U (zh) | 树脂线路板芯片倒装矩型散热块外接散热器封装结构 | |
CN201623081U (zh) | 印刷线路板芯片倒装倒t型散热块外接散热器封装结构 | |
CN201623069U (zh) | 树脂线路板芯片正装散热块外接散热板封装结构 | |
CN201623100U (zh) | 印刷线路板芯片倒装锁孔散热块外接散热器封装结构 | |
CN201623066U (zh) | 印刷线路板芯片倒装散热块外接散热帽封装结构 | |
CN201623074U (zh) | 树脂线路板芯片倒装锁定孔散热块外接散热器封装结构 | |
CN201751994U (zh) | 印刷线路板芯片正装散热块外接散热板封装结构 | |
CN201623117U (zh) | 印刷线路板芯片倒装倒t型散热块全包覆封装结构 | |
CN201623112U (zh) | 内脚露出芯片倒装散热块外接散热板封装结构 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C17 | Cessation of patent right | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20101222 Termination date: 20140130 |