CN201663153U - Packaging structure of imaging module - Google Patents
Packaging structure of imaging module Download PDFInfo
- Publication number
- CN201663153U CN201663153U CN2010201241549U CN201020124154U CN201663153U CN 201663153 U CN201663153 U CN 201663153U CN 2010201241549 U CN2010201241549 U CN 2010201241549U CN 201020124154 U CN201020124154 U CN 201020124154U CN 201663153 U CN201663153 U CN 201663153U
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- CN
- China
- Prior art keywords
- packaging body
- imaging
- encapsulating structure
- imaging system
- imaging modules
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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Abstract
The utility model discloses a packaging structure of an imaging module, comprising a packaging body, an imaging system and a base plate, wherein the packaging body and base plate package the imaging system therein by a binding agent layer; the imaging system comprises a glass sheet and a wafer which are connected; and the packaging body is provided with more than two contact angles which are directly contacted and laminated with the glass sheet. The packaging structure of the imaging module can improve the parallelism of an imaging surface and an optical system plane and picture uniformity of the imaging system, simultaneously, is beneficial to dust control in the manufacturing process and greatly improves the cleanness degree in the imaging system.
Description
Technical field
The utility model relates to the image sensing process field, relates in particular to a kind of encapsulating structure of imaging modules.
Background technology
At present, imaging system is made up of photo-sensitive cell and optical system usually, and the parallel degree of photosensitive surface and optical system plane directly influences imaging effect, particularly the picture uniformity.In high pixel field, this respect just becomes more important.Traditional mounting technology because photo-sensitive cell and optical system all need the third party plane as substrate, but owing to the evenness of this substrate is subjected to the influence of factors such as size, temperature, humidity, is difficult to guarantee the relative horizontal parallel of photo-sensitive cell and optical system.Thereby be necessary to seek better mounting technology, reduce or reduce the factor that influences this kind opposing parallel, and do not influencing efficiency of assembling and optical design, do not improving under the prerequisite of assembly difficulty and cost, new assembly method preferably makes photo-sensitive cell as much as possible directly contact assembling with optical system, thereby promotes imaging effect.
The utility model content
At above-mentioned defective, the technical problem that the utility model solves is to provide a kind of encapsulating structure of imaging modules, can improve imaging surface and the parallel degree of optical system plane and the picture uniformity of imaging system, simultaneously, help the dust control in the manufacture process, greatly promoted the clean level of imaging system inside.
In order to solve above technical problem, the encapsulating structure of the imaging modules that the utility model provides, comprise packaging body, imaging system and substrate, in described packaging body and described substrate are encapsulated in described imaging system by adhesive phase, described imaging system comprises sheet glass and wafer, described wafer links to each other with described sheet glass, and described packaging body is provided with the feeler more than two, and described feeler directly contacts pressing with described sheet glass.
Preferably, described packaging body is made by plastic material or metal material.
Preferably, described packaging body and optical system make up or are structure as a whole.
Preferably, described packaging body and optical system and electrical micro-machine make up or are structure as a whole.
Preferably, described glass sheet surface plated film.
Preferably, the pad of described substrate is printed with one deck tin slurry, and described sheet glass is connected with described substrate by the tin ball.
Preferably, described adhesive phase is a glue layer.
Preferably, described feeler is four.
The encapsulating structure of the imaging modules that the utility model provides, compared with prior art, described packaging body is provided with the feeler more than two, described feeler directly contacts pressing with described sheet glass, utilize interstructural direct contact, greatly improved imaging surface and the parallel degree of optical system plane and the picture uniformity of imaging system, simultaneously, help the dust control in the manufacture process, greatly promoted the clean level of imaging system inside.
Description of drawings
Fig. 1 is the structural representation of the encapsulating structure of imaging modules in the utility model.
Respectively be labeled as among the figure:
1---packaging body
2---feeler
3---sheet glass
4---glue layer
5---the tin ball
6---wafer
7---substrate
Embodiment
For those skilled in the art can understand technical scheme provided by the utility model better, set forth below in conjunction with specific embodiment.
See also Fig. 1, this figure is the structural representation of the encapsulating structure of imaging modules in the utility model.
Embodiment 1
The encapsulating structure of the imaging modules that the utility model provides, comprise packaging body 1, imaging system and substrate 7, in packaging body 1 is encapsulated in imaging system by glue layer 4 with substrate 7, imaging system comprises sheet glass 3 and wafer 6, wafer 6 links to each other with sheet glass 3, packaging body 1 is provided with four feeler 2, and feeler 2 directly contacts pressing with sheet glass 3.Sheet glass 3 surface coatings, the pad of substrate 7 are printed with one deck tin slurry, and sheet glass 3 is connected with substrate 7 by tin ball 5.Packaging body 1 is made by plastic material or metal material.Packaging body 1 makes up with optical system and electrical micro-machine (not marking among the figure) or is structure as a whole.
The encapsulating structure of the imaging modules that the utility model provides, compared with prior art, described packaging body is provided with four feeler, described feeler directly contacts pressing with described sheet glass, utilize interstructural direct contact, greatly improved imaging surface and the parallel degree of optical system plane and the picture uniformity of imaging system, simultaneously, help the dust control in the manufacture process, greatly promoted the clean level of imaging system inside.
Embodiment 2
The encapsulating structure of the imaging modules that the utility model provides, comprise packaging body 1, imaging system and substrate 7, in packaging body 1 is encapsulated in imaging system by glue layer 4 with substrate 7, imaging system comprises sheet glass 3 and wafer 6, wafer 6 links to each other with sheet glass 3, packaging body 1 is provided with four feeler 2, and feeler 2 directly contacts pressing with sheet glass 3.Sheet glass 3 surface coatings, the pad of substrate 7 are printed with one deck tin slurry, and sheet glass 3 is connected with substrate 7 by tin ball 5.Packaging body 1 is made by plastic material or metal material.Packaging body 1 makes up with optical system or is structure as a whole.
The encapsulating structure of the imaging modules that the utility model provides, compared with prior art, described packaging body is provided with four feeler, described feeler directly contacts pressing with described sheet glass, utilize interstructural direct contact, greatly improved imaging surface and the parallel degree of optical system plane and the picture uniformity of imaging system, simultaneously, help the dust control in the manufacture process, greatly promoted the clean level of imaging system inside.
To the above-mentioned explanation of the disclosed embodiments, make this area professional and technical personnel can realize or use the utility model.Multiple modification to these embodiment will be conspicuous concerning those skilled in the art, and defined herein General Principle can realize under the situation that does not break away from spirit or scope of the present utility model in other embodiments.Therefore, the utility model will can not be restricted to these embodiment shown in this article, but will meet and principle disclosed herein and features of novelty the wideest corresponding to scope.
Claims (8)
1. the encapsulating structure of an imaging modules, comprise packaging body, imaging system and substrate, in described packaging body and described substrate are encapsulated in described imaging system by adhesive phase, described imaging system comprises sheet glass and wafer, described wafer links to each other with described sheet glass, it is characterized in that described packaging body is provided with the feeler more than two, described feeler directly contacts pressing with described sheet glass.
2. the encapsulating structure of imaging modules according to claim 1 is characterized in that, described packaging body is made by plastic material or metal material.
3. the encapsulating structure of imaging modules according to claim 1 is characterized in that, described packaging body and optical system make up or be structure as a whole.
4. the encapsulating structure of imaging modules according to claim 1 is characterized in that, described packaging body and optical system and electrical micro-machine make up or be structure as a whole.
5. the encapsulating structure of imaging modules according to claim 1 is characterized in that, described glass sheet surface plated film.
6. the encapsulating structure of imaging modules according to claim 1 is characterized in that, the pad of described substrate is printed with one deck tin slurry, and described sheet glass is connected with described substrate by the tin ball.
7. the encapsulating structure of imaging modules according to claim 1 is characterized in that, described adhesive phase is a glue layer.
8. the encapsulating structure of imaging modules according to claim 1 is characterized in that, described feeler is four.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010201241549U CN201663153U (en) | 2010-02-26 | 2010-02-26 | Packaging structure of imaging module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010201241549U CN201663153U (en) | 2010-02-26 | 2010-02-26 | Packaging structure of imaging module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201663153U true CN201663153U (en) | 2010-12-01 |
Family
ID=43233574
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010201241549U Expired - Lifetime CN201663153U (en) | 2010-02-26 | 2010-02-26 | Packaging structure of imaging module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201663153U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106144218A (en) * | 2016-06-30 | 2016-11-23 | 信利光电股份有限公司 | A kind of blister plastic packaging |
-
2010
- 2010-02-26 CN CN2010201241549U patent/CN201663153U/en not_active Expired - Lifetime
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106144218A (en) * | 2016-06-30 | 2016-11-23 | 信利光电股份有限公司 | A kind of blister plastic packaging |
| CN106144218B (en) * | 2016-06-30 | 2019-03-08 | 信利光电股份有限公司 | A kind of blister packaging |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C56 | Change in the name or address of the patentee |
Owner name: TRULY OPTO-ELECTRONICS LTD. Free format text: FORMER NAME: TRULY OPTO-ELECTRONICS LIMITED |
|
| CP03 | Change of name, title or address |
Address after: 516600 Guangdong Industrial Zone, Shanwei City Road, Lee Lee Industrial City, a district of the building fifteenth Patentee after: Truly Opto-Electronics Ltd. Address before: 516600 Xinli industrial city, Guangdong, Shanwei Patentee before: Truly Semiconductors (Shanwei) Co., Ltd. |
|
| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20101201 |