CN201655764U - Stained point die structure - Google Patents
Stained point die structure Download PDFInfo
- Publication number
- CN201655764U CN201655764U CN2010201170238U CN201020117023U CN201655764U CN 201655764 U CN201655764 U CN 201655764U CN 2010201170238 U CN2010201170238 U CN 2010201170238U CN 201020117023 U CN201020117023 U CN 201020117023U CN 201655764 U CN201655764 U CN 201655764U
- Authority
- CN
- China
- Prior art keywords
- stained
- hole
- orifice plate
- plate
- lower platen
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000002699 waste material Substances 0.000 abstract description 5
- 230000004907 flux Effects 0.000 abstract 2
- 238000004140 cleaning Methods 0.000 abstract 1
- 239000000843 powder Substances 0.000 description 30
- 239000004065 semiconductor Substances 0.000 description 13
- 238000004806 packaging method and process Methods 0.000 description 6
- 229920001971 elastomer Polymers 0.000 description 4
- 239000000806 elastomer Substances 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000011159 matrix material Substances 0.000 description 3
- 238000013461 design Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000012356 Product development Methods 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 230000006378 damage Effects 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 230000008646 thermal stress Effects 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Images
Landscapes
- Photographic Developing Apparatuses (AREA)
Abstract
The utility model relates to a stained point die structure, which is mainly fixedly provided with a lower needle plate on the lower portion of a die body, wherein a plurality of holes which are arranged on the lower needle plate are respectively penetrated with needle bodies, the lower portion of the lower needle plate is provided with a stained point hole plate, the stained point hole plate is provided with a plurality of stained point holes, the upper portion of the die body is orderly provided with non-stained point hole plates and an upper needle plate, the positions of non-stained point holes which are arranged on the non-stained point hole plates correspond to the position of flux which does not need stained points, thereby leading a part of needle bodies to be penetrated from the stained point holes, preventing from touching unnecessary flux to cause waste and inconvenient cleaning, being capable of being exchanged into corresponding stained point hole plates and non-stained point hole plates when changing the stained point mode, and achieving the purpose of convenient operation and cost economization.
Description
Technical field
The utility model is relevant for a kind of mould structure of being stained with, and refers in particular to a kind ofly to avoid picking unnecessary scaling powder and cause the mould structure of being stained with of scaling powder waste.
Background technology
In recent years because the semiconductor product development trend strided forward towards light, thin, short, little direction, the design that impels IC (Integrated Circuit) is many towards the changes of I/O (I/O) number, the direction of function increase and size decreases develops; The design of semiconductor packages need be considered electrical functionality, heat dispersion, manufacturing reliability and structural intergrity (structural integrity); and so-called semiconductor packages; be about to semiconductor element packaging protecting in addition outward; purpose is to finish the combination of semiconductor element and other necessary circuit part; to transmit electric energy and circuit signal, functions such as heat radiation approach, carrying and structural defence be provided; good package quality; help to promote radiating efficiency; lower the destruction that thermal stress is derived and caused, improve production reliability and life cycle.
Above-mentioned semiconductor element is many when carrying out packaging operation can to use scaling powder, this is a part important on many production of electronic components, because scaling powder is played the part of two important roles in the welding processing procedure, one is oxide and other impurity of removing face of weld, and another is to produce to help the surface tension environment that welds.
Yet, above-mentioned semiconductor element is when being stained with the operation of a scaling powder, because required position of being stained with a little is all different on the various semiconductor elements, cause the technical staff to make corresponding mould at various semiconductor elements, and must cause technical staff's inconvenience in being stained with a replacing of operation previous crops mould.
The utility model content
Technical problem to be solved in the utility model be in view of aforesaid drawbacks so that a kind of mould structure of being stained with to be provided, this is stained with a mould structure and has and be stained with an orifice plate, be stained with that an orifice plate offers be stained with a hole site corresponding to packaging operation the time required position of being stained with a scaling powder, only can pass from being stained with a hole for the needle body of part, cause the waste of scaling powder and the inconvenience of removing scaling powder to avoid picking unnecessary scaling powder, and only need be replaced by a corresponding orifice plate and the non-orifice plate of being stained be stained with when point mode is stained with in change, be convenient to operation, cost-effective purpose to reach.
The utility model provides a kind of mould structure of being stained with, and comprises:
Die ontology offers and wears groove;
Following needle plate is fixedly arranged on the below of this die ontology, and following needle plate offers a plurality of holes, is equipped with needle body in the hole respectively;
Be stained with an orifice plate, be fixedly arranged on the below of this time needle plate, be stained with an orifice plate and offer a plurality of hole of being stained with;
A non-orifice plate of being stained with, be located at the top of this die ontology, offer an a plurality of non-hole of being stained with on the orifice plate but not be stained with, non-position of being stained with a hole is all not corresponding with this position of being stained with a hole, and the position that just is equal to this hole behind non-position of being stained with a hole and this location overlap of being stained with a hole, and be provided with lower platen in non-top of being stained with an orifice plate;
Needle body is arranged in groove, and a non-orifice plate of being stained with is pressed in the needle body of part and is stained with a hole certainly and passes, and remaining needle body passes and presss from both sides and pull in lower platen and be stained with between the orifice plate from a non-hole of being stained with.
In preferred embodiment, this non-being stained with between an orifice plate and this lower platen is provided with needle plate, and last needle plate offers a plurality of holes corresponding to the hole place of this time needle plate.
In preferred embodiment, two sides of needle plate are formed with turn section respectively on this, and turn section is placed in this lower platen.
In preferred embodiment, the top of this lower platen is provided with top board, presss from both sides the flexible body of pulling between top board and this lower platen.
In preferred embodiment, this die ontology offers tank, is provided with in the tank that this non-ly is stained with an orifice plate, needle plate, this lower platen and this top board on this.
In preferred embodiment, this die ontology offers tank, is provided with in the tank that this non-ly is stained with an orifice plate, needle plate, this lower platen and top board on this.
In preferred embodiment, the top of this lower platen is provided with top board, and presss from both sides the flexible body of pulling between top board and this lower platen.
In preferred embodiment, this die ontology offers tank, and this a non-orifice plate, last needle plate, this lower platen and top board be stained with is set in the tank.
By above-mentioned element form with implementation as can be known, the utility model and existing structure the utlity model has following advantage in comparison:
A mould structure of being stained with of the present utility model comprises:
Die ontology offers a tank, and this non-ly is stained with an orifice plate for being provided with, needle plate, this lower platen and this top board on this, and two sides of tank are formed with a plurality of fixed parts respectively, establish this top board for lock, and offer one in the centre of tank and wear groove, for the needle body that this time needle plate is set;
Following needle plate offers a plurality of holes that are arranged, is equipped with a needle body slidably in the hole respectively, and for picking scaling powder, and two sides of needle plate offer a plurality of perforation respectively down, is fixedly arranged on the bottom surface of this die ontology to utilize bolting element etc.;
Be stained with an orifice plate, offer a plurality of hole of being stained with, the position of being stained with a hole is corresponding to required position of being stained with a scaling powder in the packaging operation, for example paired a plurality of matrixes, pass thus for the needle body of this time needle plate and be stained with a scaling powder, and offer a plurality of perforation respectively in two sides of being stained with an orifice plate, be fixedly arranged on this die ontology to utilize bolting element etc.;
A non-orifice plate of being stained with, offer an a plurality of non-hole of being stained with, non-position of being stained with a hole is corresponding to the position that need not be stained with a scaling powder (being the rectangle frame between a hole be stained with that is that matrix and rectangle frame arrange), and the arranged that just is equal to this hole behind non-position of being stained with a hole and this location overlap of being stained with a hole penetrates thus and can not do be stained with a little in the position that need not be stained with a scaling powder for the needle body of this time needle plate;
Last needle plate is formed with a turn section respectively and is the U font in two sides, and offers a plurality of holes that are arranged equally in last needle plate, penetrates and can be arranged in this afterwards from should be non-being stained with a hole for this needle body;
Lower platen offers a plurality of hole slots in the periphery of end face, is respectively equipped with an elastomer in the hole slot, and the elastomeric other end is butted on this top board, extrudes this needle body to help lower platen;
Top board is formed with a plurality of portions that wear in periphery, for wearing bolting element etc. and be fixedly arranged on the fixed part of this die ontology.
The utility model is provided with in the below of needle body correspondence is stained with an orifice plate, be stained with that an orifice plate offers be stained with a hole site corresponding to packaging operation the time required position of being stained with a scaling powder, only can pass from being stained with a hole, cause the waste of scaling powder and the inconvenience of removing scaling powder to avoid picking unnecessary scaling powder for the needle body of part.
The utility model only need be replaced by a corresponding orifice plate and the non-orifice plate of being stained be stained with when point mode is stained with in change, be convenient to operation, cost-effective purpose to reach.
Description of drawings
The three-dimensional exploded view of Fig. 1 the utility model one embodiment.
The assembled sectional view of Fig. 2 the utility model one embodiment.
The combination cutaway view Amplified image of Fig. 3 the utility model one embodiment.
The combination cutaway view Amplified image of another embodiment of Fig. 4 the utility model.
The component symbol explanation
1 ... die ontology 11 ... tank
12 ... fixed part 13 ... wear groove
2 ... following needle plate 21 ... hole
22 ... needle body 23 ... perforation
3 ... be stained with an orifice plate 31 ... be stained with a hole
32 ... perforation 4 ... a non-orifice plate of being stained with
41 ... the non-hole 5 of being stained with ... last needle plate
51 ... turn section 52 ... hole
6 ... lower platen 61 ... hole slot
62 ... elastomer 7 ... top board
71 ... wear portion 8 ... semiconductor element
Embodiment
For technology contents that the utility model is used, creation purpose and the effect reached thereof have more complete and clearly disclose, see also graphic and figure number is described in detail as follows:
At first, please refer to shown in Figure 1, be the schematic diagram of being stained with a preferred embodiment of a mould structure of the present utility model, it comprises a die ontology 1, once needle plate 2, is stained with that an orifice plate 3, is non-is stained with needle plate 5, a lower platen 6 and a top board 7 on the orifice plate 4,, wherein:
The centre of this die ontology 1 offers a tank 11, this non-ly is stained with an orifice plate 4 for being provided with, needle plate 5, this lower platen 6 and this top board 7 on this, and two sides of tank 11 are formed with a plurality of fixed parts 12 respectively, establish this top board 7 for lock, and offer one in the centre of tank 11 and wear groove 13, for the needle body 22 that this time needle plate 2 is set;
Offer a plurality of holes 21 that are arranged on this time needle plate 2, be equipped with a needle body 22 slidably in the hole 21 respectively, for picking scaling powder, and two sides of needle plate 2 offer a plurality of perforation 23 respectively down, are fixedly arranged on the bottom surface of this die ontology 1 to utilize bolting element etc.;
This is stained with and offers a plurality of hole 31 of being stained with on the orifice plate 3, the position of being stained with a hole 31 is corresponding to required position of being stained with a scaling powder in the packaging operation, the rectangle frame in a matrix and its outside for example, pass thus for the needle body 22 of this time needle plate 2 and be stained with a scaling powder, and offer a plurality of perforation 32 respectively in two sides of being stained with an orifice plate 3, be fixedly arranged on this die ontology 1 to utilize bolting element etc.;
This non-being stained with offers a plurality of non-hole 41 of being stained with on the orifice plate 4, the non-position in a hole 41 of being stained with is corresponding to the position that need not be stained with a scaling powder (being the rectangle frame of being stained with 31 in a hole that is matrix and rectangle frame arrangement), and the arranged that just is equal to this hole 21 behind non-position of being stained with a hole 41 and this location overlap of being stained with a hole 31 penetrates thus and can not do be stained with a little in the position that need not be stained with a scaling powder for the needle body 22 of this time needle plate 2;
Two sides that should go up needle plate 5 are formed with a turn section 51 respectively and are the U font, and offer a plurality of holes 52 that are arranged equally in last needle plate 5, penetrate and can be arranged in this afterwards from should non-ly being stained with a hole 41 for this needle body 22;
The periphery of these lower platen 6 end faces offers a plurality of hole slots 61, is respectively equipped with an elastomer 62 in the hole slot 61, and the other end of elastomer 62 is butted on this top board 7, extrudes this needle body 22 to help lower platen 6;
The periphery of this top board 7 is formed with a plurality of portions 71 that wear, for wearing bolting element etc. and be fixedly arranged on the fixed part 12 of this die ontology 1.
When implementing assembling, see also Fig. 1 and Fig. 2, it will play needle plate 2 and be stained with the bottom surface that an orifice plate 3 is fixedly arranged on die ontology 1 in regular turn, and down each needle body 22 2 end of needle plate 2 respectively with die ontology 1 wear groove 13, be stained with an orifice plate 3 respectively to be stained with a hole 31 corresponding, and with the non-orifice plate 4 of being stained with, last needle plate 5, lower platen 6 and top board 7 are inserted in the tank 11 of die ontology 1 central authorities in regular turn, and non-bottom surface correspondence of being stained with an orifice plate 4 presses in the top of needle body 22, make the needle body 22 of part pass downwards from respectively being stained with a hole 31, the needle body 22 that does not pass upwards passes and presss from both sides and pull in lower platen 6 and be stained with between the orifice plate 3 from each non-hole 41 of being stained with, wear bolting element respectively in the portion that respectively wears 71 of top board 7 again and be fixedly arranged on each fixed part 12 of die ontology 1, can be with the non-orifice plate 4 of being stained with, last needle plate 5, lower platen 6 and top board 7 all are fixed in the end face of die ontology 1.
When implementing to use, please refer to shown in Figure 3, can be prior to being stained with after needle body 22 most advanced and sophisticated places that respectively being stained with of an orifice plate 3 passed in the hole 31 pick scaling powder, make die ontology 1 corresponding to the top of semiconductor element 8 and be stained with a scaling powder, because only having the needle body 22 of part can be stained with a hole 31 certainly passes, and be stained with a hole 31 corresponding to required position of being stained with a scaling powder on this semiconductor element 8, can avoid picking unnecessary scaling powder and the inconvenience that causes the waste of scaling powder and remove scaling powder.
Referring again to shown in Figure 4, be the schematic diagram of being stained with another preferred embodiment of a mould structure of the present utility model, it is interlaced corresponded manner with the non-hole 41 of being stained with that should non-ly be stained with on the orifice plate 4 that the difference of itself and above-mentioned preferred embodiment is in this hole 31 of being stained with of being stained with on the orifice plate 3, be stained with the diverse location of a scaling powder on this semiconductor element 8 with cooperation, and only need be replaced by a corresponding orifice plate 3 and the non-orifice plate 4 of being stained be stained with when point mode is stained with in change, be convenient to operation, cost-effective purpose to reach.
Aforesaid embodiment or graphic and non-limiting product aspect of the present utility model, fixed structure or be stained with a hole site; suitable variation or the modification that the technical staff did that have art technology knowledge in the technical field under any all should be considered as not breaking away from protection range of the present utility model.
Claims (8)
1. be stained with a mould structure for one kind, it is characterized in that, comprise:
Die ontology offers and wears groove;
Following needle plate is fixedly arranged on the below of this die ontology, and following needle plate offers a plurality of holes, is equipped with needle body in the hole respectively;
Be stained with an orifice plate, be fixedly arranged on the below of this time needle plate, be stained with an orifice plate and offer a plurality of hole of being stained with;
A non-orifice plate of being stained with, be located at the top of this die ontology, offer an a plurality of non-hole of being stained with on the orifice plate but not be stained with, non-position of being stained with a hole is all not corresponding with this position of being stained with a hole, and the position that just is equal to this hole behind non-position of being stained with a hole and this location overlap of being stained with a hole, and be provided with lower platen in non-top of being stained with an orifice plate;
Needle body is arranged in groove, and a non-orifice plate of being stained with is pressed in the needle body of part and is stained with a hole certainly and passes, and remaining needle body passes and presss from both sides and pull in lower platen and be stained with between the orifice plate from a non-hole of being stained with.
2. a mould structure of being stained with according to claim 1 is characterized in that, this non-being stained with between an orifice plate and this lower platen is provided with needle plate, and last needle plate offers a plurality of holes corresponding to the hole place of this time needle plate.
3. a mould structure of being stained with according to claim 2 is characterized in that two sides of needle plate are formed with turn section respectively on this, and turn section is placed in this lower platen.
4. a mould structure of being stained with according to claim 2 is characterized in that the top of this lower platen is provided with top board, presss from both sides the flexible body of pulling between top board and this lower platen.
5. a mould structure of being stained with according to claim 4 is characterized in that this die ontology offers tank, is provided with in the tank that this non-ly is stained with an orifice plate, needle plate, this lower platen and this top board on this.
6. a mould structure of being stained with according to claim 2 is characterized in that this die ontology offers tank, is provided with in the tank that this non-ly is stained with an orifice plate, needle plate, this lower platen and top board on this.
7. a mould structure of being stained with according to claim 1 is characterized in that the top of this lower platen is provided with top board, and presss from both sides the flexible body of pulling between top board and this lower platen.
8. a mould structure of being stained with according to claim 1 is characterized in that this die ontology offers tank, and this a non-orifice plate, last needle plate, this lower platen and top board be stained with is set in the tank.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010201170238U CN201655764U (en) | 2010-02-04 | 2010-02-04 | Stained point die structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010201170238U CN201655764U (en) | 2010-02-04 | 2010-02-04 | Stained point die structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201655764U true CN201655764U (en) | 2010-11-24 |
Family
ID=43121008
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010201170238U Expired - Lifetime CN201655764U (en) | 2010-02-04 | 2010-02-04 | Stained point die structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201655764U (en) |
-
2010
- 2010-02-04 CN CN2010201170238U patent/CN201655764U/en not_active Expired - Lifetime
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP6857690B2 (en) | Electronic device with flexible I / O components | |
| CN102779677B (en) | Keyboard safety protection device | |
| ATE520291T1 (en) | TECHNOLOGY FOR PRODUCING AN EMBROIDERED ELECTRONIC ASSEMBLY | |
| CN201655764U (en) | Stained point die structure | |
| CN201927650U (en) | Ejection device and electronic device thereof | |
| CN108422447A (en) | A kind of anticollision backplate of robot | |
| CN202780360U (en) | Multidirectional three-dimensional rotary welding auxiliary device | |
| CN102486976A (en) | Key module and electronic device with key module | |
| CN204067591U (en) | Switch terminal holder structure | |
| CN204857522U (en) | A button structure for protection switch button | |
| CN203277156U (en) | Key structure | |
| CN201467619U (en) | Integral type shield spring | |
| CN201158199Y (en) | Laser marking apparatus of lithium ion battery | |
| CN202094866U (en) | Capacitor touch switch and sensing plate | |
| CN105023787A (en) | Key structure used for protecting switch button | |
| CN207117591U (en) | The temperature controller of optoelectronic switch control | |
| CN202150895U (en) | Housing apparatus for digital television converter | |
| CN203714330U (en) | Camera module tray | |
| CN205092177U (en) | Flexible mining membrane switch | |
| CN203434240U (en) | Battery board nickel sheet welding product | |
| CN203141983U (en) | Structure of device for pressing paste | |
| CN201563303U (en) | PCB (Printed Circuit Board) electric heating hot melt machine and heating head thereof | |
| CN104380488A (en) | Electrical component and method for producing electrical components | |
| CN212623820U (en) | Electronic equipment protective housing | |
| CN204206650U (en) | A kind of IC-card seat operator guards |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20181227 Address after: No. 22 Xingshun Road, Zhongyi Ningbo Ecological Park, Yuyao City, Ningbo City, Zhejiang Province Patentee after: Ningbo silicon electronics (Ningbo) Limited by Share Ltd Address before: Taiwan County, Kaohsiung, China Patentee before: Wei Xurong |
|
| TR01 | Transfer of patent right | ||
| CX01 | Expiry of patent term |
Granted publication date: 20101124 |
|
| CX01 | Expiry of patent term |