CN201639911U - Heat conducting module and radiating device with same - Google Patents
Heat conducting module and radiating device with same Download PDFInfo
- Publication number
- CN201639911U CN201639911U CN2010201436320U CN201020143632U CN201639911U CN 201639911 U CN201639911 U CN 201639911U CN 2010201436320 U CN2010201436320 U CN 2010201436320U CN 201020143632 U CN201020143632 U CN 201020143632U CN 201639911 U CN201639911 U CN 201639911U
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- heat
- section
- heat pipe
- pipe
- transfer segment
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Abstract
The utility model relates to a heat conducting module used for conducting heat for an electronic heating element. The heat conducting module comprises a heat pipe and a temperature equalization plate, wherein the temperature equalization plate is provided with an evaporation section in thermal contact with the electronic heating element and a heat transfer section that is far away from the evaporation section but covers the heat pipe in a curly manner. With the structure, the contact area and the heat conduction efficiency between the temperature equalization plate and the heat pipe are greatly increased. Therefore, the heat conduction efficiency of the heat conducting module is extraordinary. In addition, the utility model can provide a radiating device with the heat conducting module by connecting a radiating fin group and a fan onto the heat pipe, and the radiating device can fast dissipate the heat of the temperature equalization plate and the heat pipe to the outside.
Description
Technical field
The utility model relates to heat abstractor, refers to a kind of heat conduction module especially and has the heat abstractor of this heat conduction module.
Background technology
Along with making rapid progress of science and technology, the power and the usefulness of electronic component promote day by day, also produce more heat jointly when operation; Accumulate on the inside of this electronic component if these heats fail in time to conduct, will cause this temperature of electronic component rising and influence its usefulness, even severe patient will cause this electronic component damage.So industry is researched and developed various heat conduction members all the time to solve the problem of electronic component, temperature-uniforming plate and heat pipe are exactly very common heat conduction member.
Temperature-uniforming plate mainly comprises a flat-shaped closed shell, take shape in the capillary structure in this flat-shaped closed shell and fill in a working fluid in this flat-shaped closed shell; Temperature-uniforming plate has an evaporation section and away from a heat transfer segment of this evaporation section, evaporation section is in order to contact an electronic heating element, and the heat that the electronic heating element is produced by the liquid-gas phase transitionization of the working fluid in the temperature-uniforming plate conducts to heat transfer segment from evaporation section.
Similarly, heat pipe mainly comprises a tubulose closed shell, takes shape in the capillary structure in this tubulose closed shell and fills in a working fluid in this tubulose closed shell; Heat pipe has an endotherm section and away from a heat release section of this endotherm section, endotherm section is in order to contact an electronic heating element, and the heat that the electronic heating element is produced by the liquid-gas phase transitionization of the working fluid in the heat pipe conducts to heat release section from endotherm section.
Though temperature-uniforming plate and heat pipe all belong to heat conduction member, owing to the difference on both profiles has different application scenarios; More particularly, the contact area of temperature-uniforming plate is big, can conduct heat fast; And the contact area of heat pipe is little, but its extended distance is long, therefore is fit to be positioned at the heat that is produced than electronic heating element at a distance and conducts.
In general, by the combination utilization of temperature-uniforming plate and heat pipe, can integrate both heat-conducting effect.Therefore, how the lasting always research of industry increases the contact area between temperature-uniforming plate and the heat pipe, to increase heat transfer efficiency between the two.Early stage temperature-uniforming plate is with plane contact heat pipe in a tubular form, so almost linear between the two contact, heat-conducting area is little, thereby heat transfer efficiency is poor; Afterwards, some temperature-uniforming plate was provided with the heat pipe of the groove of semicircular arc with a ccontaining part, though this mode can increase heat-conducting area between the two, temperature-uniforming plate but must be made thicklyer, and did not meet the design requirement of slimming.
Therefore, how to solve the above problems a little, promptly become the target that the utility model is improved.
Summary of the invention
A purpose of the present utility model is to provide a kind of heat conduction module, and it can increase the contact area between temperature-uniforming plate and the heat pipe, and strengthens heat-conducting effect between the two.
Another purpose of the present utility model, be to provide a kind of heat abstractor with this heat conduction module, the contact area that wherein has increase between temperature-uniforming plate and the heat pipe, and the heat of temperature-uniforming plate and heat pipe can be dissipated to the external world fast by connecting a radiating fin group.
In order to reach above-mentioned purpose, the utility model provides a kind of heat conduction module, in order to an electronic heating element heat conduction to be provided, comprising: a heat pipe; And a temperature-uniforming plate, have an evaporation section of the described electronic heating element of thermo-contact and coat a heat transfer segment of this heat pipe away from this evaporation section but to curl.
In order to reach above-mentioned purpose, the utility model provides a kind of heat abstractor with heat conduction module, in order to an electronic heating element radiating to be provided, comprising: a heat conduction module, and it comprises: a heat pipe has an endotherm section and away from a heat release section of this endotherm section; And a temperature-uniforming plate, the evaporation section with the described electronic heating element of thermo-contact reaches away from this evaporation section but with a curling heat transfer segment that coats this heat pipe; And a radiating fin group, be connected in this heat release section.
Compared to prior art, the utlity model has following effect:
In heat conduction module of the present utility model, because having an evaporation section of the described electronic heating element of thermo-contact, temperature-uniforming plate reaches away from this evaporation section but with a curling heat transfer segment that coats this heat pipe, by this heat transfer segment of curling, can increase the contact area between temperature-uniforming plate and the heat pipe, and strengthen heat-conducting effect between the two.
In heat abstractor of the present utility model, because having an evaporation section of the described electronic heating element of thermo-contact, temperature-uniforming plate reaches away from this evaporation section but with a curling heat transfer segment that coats this heat pipe, by this heat transfer segment of curling, can increase the contact area between temperature-uniforming plate and the heat pipe, add the heat release section of utilizing a radiating fin group to connect heat pipe, so the heat of temperature-uniforming plate and heat pipe can be dissipated to the external world fast.
Description of drawings
Fig. 1 is the side cutaway view of coiled-type temperature-uniforming plate of the present utility model.
Fig. 2 is the exploded perspective view that slimming temperature-uniforming plate of the present utility model is desired cross-under one heat pipe.
Fig. 3 is the combination stereogram of slimming temperature-uniforming plate of the present utility model cross-under one U type heat pipe.
Fig. 4 is Fig. 3 side cutaway view.
Fig. 5 makes the operation chart of heat abstractor for the utility model.
Fig. 6 is another operation chart of the utility model heat abstractor.
Fig. 7 is the exploded perspective view of another embodiment of the utility model.
Fig. 8 is the combination stereogram of another embodiment of the utility model.
Fig. 9 is Fig. 8 side cutaway view.
Figure 10 is the operation chart of the heat abstractor of another embodiment of the utility model.
[main element symbol description]
1 heat conduction module
2 heat abstractors
10 heat pipes
11,11 ' endotherm section
12,12 ' heat release section
13 ' adiabatic section
20 temperature-uniforming plates
21 evaporation sections
22 heat transfer segment
30 radiating fin groups
40 fans
50,50 ' heat-conducting cream layer
100 electronic heating elements
110 electronic heating elements
Embodiment
The detailed description of relevant utility model and technology contents will cooperate graphic being described as follows, yet appended graphic only purposes as an illustration is not to be used to limit to the utility model.
Please refer to Fig. 1 to Fig. 6, the utility model provides a kind of heat conduction module 1 (hereinafter to be referred as " heat conduction module 1 ") and has the heat abstractor 2 (hereinafter to be referred as " heat abstractor 2 ") of this heat conduction module 1.
As shown in Figure 1, temperature-uniforming plate 20 has in order to the evaporation section 21 that attaches electronic heating element (not shown), and coats a heat transfer segment 22 of this heat pipe 10 away from evaporation section 21 but to curl.Utilize a tool (not shown), heat transfer segment 22 bendings of temperature-uniforming plate 20 can be curled.More particularly, as shown in Figure 2, a straight heat pipe 10 can be positioned on the heat transfer segment 22 of temperature-uniforming plate 20, with the tool (not shown) this heat transfer segment 22 is got up around the curling coating of circumferential surface of heat pipe 10 then, increase the heat transfer segment 22 of temperature-uniforming plate 20 and the contact area between the heat pipe 10 with this, and significantly increase heat-conducting effect between the two.
Then, can utilize another tool (not shown) that heat pipe 10 is bent into Any shape with realistic demand, for example: U type heat pipe 10 shown in Figure 3 or S type heat pipe 10 ' shown in Figure 7.
As shown in Figure 4, clearly, according to the utility model, heat transfer segment 22 is with this heat pipe 10 of coating mode thermo-contact that curls, and contact area between the two is the surface area of this a part of heat pipe 10 no better than; On the other hand because the very thin thickness of temperature-uniforming plate 20 itself, even curl be coated on the thickness that also can not make heat pipe 10 on the heat pipe 10 increase too many, so can't hinder the design requirement of slimming.Be noted that especially between the contact site of heat transfer segment 22 and heat pipe 10 and can coat a heat-conducting cream layer 50, to reduce thermal resistance between the two.
As shown in Figure 5, when the evaporation section 21 thermo-contacts one electronic heating element 100 of end cross-under radiating fin group 30 of heat pipe 10 and temperature-uniforming plate 20, working fluid in the evaporation section 21 absorbs the heat of electronic heating element 100 and becomes gaseous state from liquid state, and the working fluid of this gaseous state flows to heat transfer segment 22 with the direction of arrow towards Fig. 5 left then; Because heat transfer segment 22 is with the coating mode thermo-contact heat pipe 10 that curls, so in the heat transfer segment 22 working fluid of gaseous state with the heat release that absorbed to heat pipe 10 inside (as Fig. 5 central authorities a plurality of entad shown in the arrow), and then these heats are transmitted to radiating fin group 30, and then be emitted to the outside of heat pipe 10 by the working fluid of heat pipe 10 inside.
As shown in Figure 6,, can additionally set up the outside of fan 40, the heat on the radiating fin group 30 is emitted to the external world fast by the forced draft of fan 40 in radiating fin group 30 in order to quicken the radiating efficiency of radiating fin group 30.In this way, can be with the conductive force and the thermolysis of radiating fin group 30 and be emitted to the external world fast by temperature-uniforming plate 20 and heat pipe 10 of the heat of electronic heating element 100.
To Figure 10, it shows another embodiment of the present utility model with reference to figure 7, and the difference of present embodiment and previous embodiment is that the cross section of heat pipe 10 ' is flat ellipticity and is non-circular, and heat pipe 10 ' is bent into the S type but not the U type; For this reason, the heat transfer segment 22 of temperature-uniforming plate 20 can be bent into the ㄈ font and thermo-contact heat pipe 10 '.Certainly, well imagine that heat transfer segment 22 also can be bent into the C font shown in above-mentioned embodiment and curl coat heat pipe 10 '.
As previous embodiment, can smear a heat-conducting cream layer 50 ' on the contact site between heat transfer segment 22 and the heat pipe 10 ', increase heat transfer efficiency to reduce thermal resistance between the two.
As shown in figure 10, in the present embodiment, heat pipe 10 ' be bent into the S type and have an endotherm section 11 ', away from the heat release section 12 ' of endotherm section 11 ' and extend endotherm section 11 ' and heat release section 12 ' between an adiabatic section 13 '.The evaporation section 21 thermo-contact electronic heating elements 100 of temperature-uniforming plate 20, and the heat transfer segment 22 of temperature-uniforming plate 20 coats the adiabatic section 13 ' of heat pipe 10 ' to curl.Another electronic heating element 110 of endotherm section 11 ' thermo-contact of heat pipe 10 ', radiating fin group 30 then is connected to heat release section 12 '.Though Figure 10 shows the heat transfer segment 22 of temperature-uniforming plate 20 and coats the adiabatic section 13 ' of heat pipe 10 ' to curl, but also the endotherm section 11 ' that the heat transfer segment 22 of temperature-uniforming plate 20 can be coated heat pipe 10 ' to curl or even near heat release section 12 ', as long as the temperature of heat transfer segment 22 is higher than the temperature of heat pipe 10 ', then the heat that absorbed of heat transfer segment 22 is just understood naturally and be conducted towards heat pipe 10 ', conducts to the heat release section 12 ' of heat pipe 10 ' at last in the lump.
S type heat pipe 10 ' its advantage shown in Figure 10 is: the endotherm section 11 ' of heat pipe 10 ' can thermo-contact be positioned at another electronic heating element 110 of distant place, causes entire heat dissipation device 2 to dispel the heat at two electronic heating elements that separate 100 and 110.
As previous embodiment, the heat release section 12 ' of heat pipe 10 ' is connected with radiating fin group 30 so that contained heat in the heat release section 12 ' is emitted to fast the outside of heat pipe 10 '; In addition, cooperate the forced draft of fan 40, the heat of radiating fin group 30 can be emitted to the external world fast.
Compared to prior art, the utlity model has following effect:
In heat conduction module 1 of the present utility model, because having an evaporation section 21 of the described electronic heating element 100 of thermo-contact, temperature-uniforming plate 20 reaches away from this evaporation section 21 but with a curling heat transfer segment 22 that coats this heat pipe 10, by this heat transfer segment 22 of curling, can increase the contact area between temperature-uniforming plate 20 and the heat pipe 10, and strengthen heat-conducting effect between the two.
In heat abstractor 2 of the present utility model, because having an evaporation section 21 of the described electronic heating element 100 of thermo-contact, temperature-uniforming plate 20 reaches away from this evaporation section 21 but with a curling heat transfer segment 22 that coats this heat pipe 10, by this heat transfer segment 22 of curling, can increase the contact area between temperature-uniforming plate 20 and the heat pipe 10, add the heat release section 12 of utilizing a radiating fin group 30 to connect heat pipes 10, so both heats of temperature-uniforming plate 20 and heat pipe 10 can be dissipated to the external world fast.
To sum up institute is old, only is preferred embodiment of the present utility model, is not to be used for limiting the scope that the utility model is implemented.Be that all equalizations of being done according to the utility model claims change and modification, be all the utility model scope of patent protection and contain.
Claims (12)
1. a heat conduction module in order to an electronic heating element heat conduction to be provided, is characterized in that, comprising:
One heat pipe; And
One temperature-uniforming plate, the evaporation section with the described electronic heating element of thermo-contact reaches away from this evaporation section but with a curling heat transfer segment that coats this heat pipe.
2. heat conduction module as claimed in claim 1 is characterized in that, scribbles a heat-conducting cream layer between this heat transfer segment and this heat pipe.
3. heat conduction module as claimed in claim 2 is characterized in that the cross section of this heat pipe is rounded, and this heat transfer segment is curled into the C font to coat this heat pipe.
4. heat conduction module as claimed in claim 2 is characterized in that the cross section of this heat pipe is flat ellipse, and this heat transfer segment is curled into the ㄈ font to coat this heat pipe.
5. as claim 3 or 4 described heat conduction modules, it is characterized in that two heat release section that this heat pipe is bent into the U font and has an endotherm section and extend from this endotherm section two ends, this endotherm section that this heat transfer segment coats this heat pipe to curl and this heat release section arbitrary.
6. as claim 3 or 4 described heat conduction modules, it is characterized in that, this heat pipe be bent into the S font and have an endotherm section, away from a heat release section of this endotherm section and extend this endotherm section and this heat release section between an adiabatic section, this endotherm section that this heat transfer segment coats this heat pipe to curl, this heat release section, and this adiabatic section is arbitrary.
7. the heat abstractor with heat conduction module in order to an electronic heating element radiating to be provided, is characterized in that, comprising:
One heat conduction module, it comprises:
One heat pipe has an endotherm section and away from a heat release section of this endotherm section; And
One temperature-uniforming plate, the evaporation section with the described electronic heating element of thermo-contact reaches away from this evaporation section but with a curling heat transfer segment that coats this heat pipe; And
One radiating fin group is connected in this heat release section.
8. the heat abstractor with heat conduction module as claimed in claim 7 is characterized in that, scribbles a heat-conducting cream layer between this heat transfer segment and this heat pipe, and this radiating fin group is outside equipped with a fan.
9. the heat abstractor with heat conduction module as claimed in claim 8 is characterized in that the cross section of this heat pipe is rounded, and this heat transfer segment is curled into the C font to coat this heat pipe.
10. the heat abstractor with heat conduction module as claimed in claim 9 is characterized in that the cross section of this heat pipe is flat ellipse, and this heat transfer segment is curled into the ㄈ font to coat this heat pipe.
11. as claim 9 or 10 described heat abstractors with heat conduction module, it is characterized in that this heat pipe is bent into the U font, this heat transfer segment is arbitrary with this endotherm section of curl coating this heat pipe and this heat release section.
12. as claim 9 or 10 described heat abstractors with heat conduction module, it is characterized in that, this heat pipe is bent into the S font and has an adiabatic section that extends between this endotherm section and this heat release section in addition, this heat transfer segment with this endotherm section of curl coating this heat pipe, this heat release section, and this adiabatic section is arbitrary.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010201436320U CN201639911U (en) | 2010-03-29 | 2010-03-29 | Heat conducting module and radiating device with same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010201436320U CN201639911U (en) | 2010-03-29 | 2010-03-29 | Heat conducting module and radiating device with same |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201639911U true CN201639911U (en) | 2010-11-17 |
Family
ID=43084419
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010201436320U Expired - Fee Related CN201639911U (en) | 2010-03-29 | 2010-03-29 | Heat conducting module and radiating device with same |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201639911U (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103575144A (en) * | 2013-11-13 | 2014-02-12 | 四川九洲电器集团有限责任公司 | Array type micro channel flat plate type heat pipe |
| CN106774755A (en) * | 2017-02-16 | 2017-05-31 | 联想(北京)有限公司 | A kind of heat abstractor |
| CN111442675A (en) * | 2020-03-27 | 2020-07-24 | 奇鋐科技股份有限公司 | Composite heat radiation structure |
| CN112739153A (en) * | 2020-12-09 | 2021-04-30 | 合肥应为电子科技有限公司 | Space synthesis power amplifier and heat dissipation device thereof |
| US11598584B2 (en) | 2020-04-15 | 2023-03-07 | Asia Vital Components Co., Ltd. | Dual heat transfer structure |
-
2010
- 2010-03-29 CN CN2010201436320U patent/CN201639911U/en not_active Expired - Fee Related
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103575144A (en) * | 2013-11-13 | 2014-02-12 | 四川九洲电器集团有限责任公司 | Array type micro channel flat plate type heat pipe |
| CN103575144B (en) * | 2013-11-13 | 2017-06-16 | 四川九洲电器集团有限责任公司 | A kind of flat plate heat tube of array microchannel |
| CN106774755A (en) * | 2017-02-16 | 2017-05-31 | 联想(北京)有限公司 | A kind of heat abstractor |
| CN111442675A (en) * | 2020-03-27 | 2020-07-24 | 奇鋐科技股份有限公司 | Composite heat radiation structure |
| US11598584B2 (en) | 2020-04-15 | 2023-03-07 | Asia Vital Components Co., Ltd. | Dual heat transfer structure |
| CN112739153A (en) * | 2020-12-09 | 2021-04-30 | 合肥应为电子科技有限公司 | Space synthesis power amplifier and heat dissipation device thereof |
| CN112739153B (en) * | 2020-12-09 | 2023-06-23 | 合肥应为电子科技有限公司 | Space synthesis power amplifier and heat dissipation device thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20101117 Termination date: 20130329 |