CN201624377U

CN201624377U - Semiconductor warming-chip health-care bed-chair

Info

Publication number: CN201624377U
Application number: CN2009202147503U
Authority: CN
Inventors: 黄定宗
Original assignee: Individual
Current assignee: Individual
Priority date: 2009-12-02
Filing date: 2009-12-02
Publication date: 2010-11-10
Anticipated expiration: 2019-12-02

Abstract

The utility model relates to a semiconductor warming-chip health-care bed-chair, which comprises a bed-chair body and a plurality of semiconductor warming chips which can be respectively arranged on the bed-chair body for preset parts of a human body to contact and cling. Each semiconductor warming chip comprises a thin-type metal sheet, an insulating layer and an electric heating film, wherein the insulating layer is covered on the outer surface of the thin-type metal sheet; the electric heating film is coated on the outer surface of the insulating layer; the electric heating film, the thin-type metal sheet and the insulating layer can form a semi-conductive chip; and the electric heating film is connected and input with a direct-current power supply, thus leading the chip to have the effects of heating, resonation, optical energy wave radiation and the like so as to be a great help to the clinging parts and health condition of the human body.

Description

The warm chip health care bed of semiconductor chair

Technical field

The utility model system is relevant with a kind of semiconductor chip, more detailed it, being meant especially a kind ofly provides the human body predetermined position that the health care bed chair of most individual warm chips of semiconductor is installed by subsides place inside at it.

Background technology

Be full of many heating products at present on the market, as the heater made from the resistive conductor or the ceramic material of semiconduction, mainly be when utilizing resistive conductor or ceramic material energising, this mobile charge is subjected to resistance and disturbs and produce the electrical heat energy that converts to after electric mill is wiped in the resistive conductor of semiconductive or ceramic material, required heat effect is provided.

Above-mentioned known semiconduction product can only provide warm effect, and so warm effect is usually only used as industrial heating, promptly is used in the human body contact, and the also warming effect of tool only is for not too big help of human health status.

The utility model content

Main purpose of the present utility model provides the warm chip health care bed of a kind of semiconductor chair, and it produces greatly help to human body by pasting position and health status.

To achieve these goals, the warm chip health care bed of semiconductor of the present utility model chair is characterized in that it is to comprise:

A chair body;

A most warm chip of semiconductor are installed in respectively on this chair body and lean on subsides place for the contact of human body predetermined position, and it respectively comprises a thin type metallic plate, an insulating barrier and an electric-heating thin film; These insulation series of strata are coated in this thin type metallic plate outer surface; This electric-heating thin film system is coated on the insulating barrier outer surface, form the chip of a tool semiconduction jointly with this thin type metallic plate, insulating barrier, and connecting input on this electric-heating thin film has a direct current power supply, and this chip can be produced effects such as the helpful heating of human body, resonance and the radiation of luminous energy ripple.

This thin type metallic plate means low carbon steel plate or enamel steel plate.

These insulation series of strata are made of ceramic material.

This electric-heating thin film is made of conductive material, and this conductive material system mixes institute mutually by silica and aluminium oxide and forms.

This dc source comprises AC power and the AC/DC changeover switch that is connected with this AC power.

This dc source is a battery.

This chair body mean office chair, couch, chaise longue, leisure chaise longue, automotive seat, folding chair, legless type chair, folding seat bed chair and sick bed any one.

The warm chip health care bed of described semiconductor chair also comprises tramples device, is installed on this chair body, has a trample part for human foot storing contact on it, and the warm chip of this semiconductor system is arranged in this trample part.

This chair body comprises a seat cushion position and a backrest position, and this front end place, seat cushion position is provided with a storage tank; This is trampled device and comprises and trample body and two slide guide members, this is trampled the body top and is formed with this trample part, this slide guide member system is installed on this respectively and tramples between body two avris and this storage tank two relative edge's sides, makes this trample body and can be shifted out or push along the inward-outward direction pull of this storage tank slidably and fold.

This chair body comprises a seat cushion position and a backrest position; This is trampled device and comprises and trample body and at least one pivot member, this is trampled the body top and is formed with this trample part, this pivot member system is articulated in this respectively and tramples between body and this seat cushion position front end, making this trample body can be horizontal user mode by the expansion that pivots outward, or is vertical collapse state toward interior pivot.

By above structure, health care bed chair provided by the utility model, because of it provides the human body predetermined position, particularly buttocks, back and foot etc. are equipped with most the warm chips of semiconductor that can produce effects such as heating, resonance and the radiation of luminous energy ripple by pasting in the position, make human body can obtain very big help by pasting position and health status so can use.

Description of drawings

Fig. 1 is the health care bed chair outward appearance constitutional diagram of the utility model first embodiment.

Fig. 2 is the stereo appearance figure of the warm chip of the utility model semiconductor.

Fig. 3 is the partial side, cross-sectional view of the warm chip of the utility model semiconductor.

Fig. 4 is another stereo appearance figure of the warm chip of the utility model semiconductor.

Fig. 5 is another outward appearance constitutional diagram of health care bed chair of the utility model first embodiment.

Fig. 6 is the health care bed chair outward appearance constitutional diagram of the utility model second embodiment.

Fig. 7 is the health care bed chair outward appearance constitutional diagram of the utility model the 3rd embodiment.

Fig. 8 is the health care bed chair outward appearance constitutional diagram of the utility model the 4th embodiment.

The specific embodiment

Seeing also Fig. 1, is first embodiment of the warm chip health care bed of the utility model semiconductor chair, comprises that mainly a chair body 10, tramples device 20 and most the warm chips 30 of semiconductor; Wherein:

This chair body 10, present embodiment are a couch, and this couch has a seat cushion position 11 and a backrest position 12, and are provided with a storage tank 13 in the front end position at seat cushion position 11.

This tramples device 20, comprises trampling the slide guide member that body 21 and two can be slide rail 22; This is trampled body 21 tops and is formed with one and can puts contact and by the trample part 211 of subsides for human foot; This slide guide member system installs respectively and is positioned this and tramples between body 21 2 avris and above-mentioned bed chair body 10 storage tanks 13 2 relative edge's sides, makes this trample body 21 and can be shifted out expansion or push along these storage tank 13 inward-outward direction slidably and fold.

The warm chip 30 of this semiconductor, see also Fig. 2,3, can suitably be installed on above-mentioned bed chair body 10 on the position of human body predetermined position contact by subsides, present embodiment system is installed on this seat cushion position 11, backrest position 12 with most the warm chips 30 of semiconductor respectively and tramples on the trample part 211 of device 20; Wherein, the warm chip 30 of this semiconductor also comprises a thin type metallic plate 31, an insulating barrier 32 and an electric-heating thin film 33 respectively; This insulating barrier 32 is to be coated in this thin type metallic plate 31 outer surfaces; This electric-heating thin film 33 is to be coated on insulating barrier 32 outer surfaces, the chips that can form tool semiconductions with this thin type metallic plate 31, insulating barrier 32 jointly, and connect the dc source that input has a low-voltage on this electric-heating thin film 33, the dc source system of present embodiment converts alternating current to direct current by general AC power via an AC/DC changeover switch 34 to be provided, and this AC/DC changeover switch 34 can utilize an attaching plug 35 and general supply socket to electrically connect.Above-mentioned dc source also can directly be provided by general battery 36 or DC power supply, as Fig. 4.

Above-mentioned thin type metallic plate 31 mean low carbon steel plate and enamel steel plate any one.

Above-mentioned insulating barrier 32 is that the ceramic material by the tool insulation characterisitic is constituted.

Above-mentioned electric-heating thin film 33 is made of conductive material, this conductive material system by silica and aluminium oxide mix mutually form.

Above-mentioned dc source 34 can open (ON) or cut out (OFF) by the handover operation of a wired or wireless controller.

When the health care bed chair of above-mentioned first embodiment uses, the user only need ride on the couch, see through this controller and switch power-on, the warm chip 30 of this semiconductor is obtained after the direct current power supply, this being trampled device 20 pulls out outward again, and foot is seated on this trample part of trampling device 20 211, and make the back by being attached to this backrest position 12, at this moment, can see through this seat cushion position 11 respectively, most the heatings that the warm chip 30 of semiconductor is produced that are provided with on backrest position 12 and the trample part 211, resonance and effect such as luminous energy ripple radiation, to human body relatively by the buttocks of subsides, back and foot carry out cell activation and effect such as stimulate circulation.

The trample device 20 and the inside and outside slip expansion of 10 employings of this chair body and the mode that folds of above-mentioned first embodiment are assembled binding mutually; But, also can utilize the pivot member that can be pivot button 23 to assemble binding mutually, as shown in Figure 5 not as limit, during use, only need that this is trampled body 21 and can be pivoted by switchings outward and launch to be horizontal user mode, after finishing using, then can see through and be vertical collapse state toward interior switching.

The bed chair body 10 of above-mentioned first embodiment, its seat cushion position 11, backrest position 12 and trample and be provided with most the warm chips 30 of semiconductor on the device 20, but not as limit, can optionally on above-mentioned at least one position, be provided with.

The bed chair body 10 of above-mentioned first embodiment is to be embodiment with the couch, but not as limit, it also can be other chair, for example the bed chair body 10 of second embodiment promptly is embodiment with the office chair, as shown in Figure 6, its seat cushion position 11 respectively is provided with most the warm chips 30 of semiconductor with backrest position 12; For example the bed chair body 10 of the 3rd embodiment is embodiment with folding folding seat bed chair promptly, and as shown in Figure 7, its seat cushion position 11 is provided with most the warm chips 30 of semiconductor equally with backrest position 12; For example the bed chair body 10 of the 4th embodiment promptly is embodiment with the sick bed again, as shown in Figure 8, it is taken for human body or the mattress position 14 that lies low is provided with most the warm chips 30 of semiconductor.Certainly, all the other are as chaise longue, leisure chaise longue, automotive seat, folding seat, legless type chair etc., can be had the general knowledge person is simple and easy by this technical field too to practice.

What need special instruction is when the warm chip 30 of the utility model semiconductor passes to dc source, can produce following all multi-purposes for the health aspect:

1, can radiate the luminous energy ripple of 8-14 micron, this penetrable human tissue cell of luminous energy ripple is to excite bio-energy.

2, can produce 298000 times resonance each second, transfer to usefulness, make CBF increase by 2～5 times, use stimulating circulation and produce the resonance machine with human body.

3, can discharge energy, use and strengthen muscle power and passive protective physical fitness above 260ERG (joule).

4, has the effect of repairing with activating cell.

In sum, the utility model is real in like product its splendid progressive practicality, looks through domestic and international technical data about this class formation simultaneously, also finds no identical construction in the document and exists formerly.

Yet the above only is several preferable possible embodiments of the present utility model, so the equivalent structure that all acts application the utility model specification and claim are done changes, ought to be included in the claim of the present utility model.

Claims

1. the warm chip health care bed of semiconductor chair is characterized in that it is to comprise:

A chair body;

A most warm chip of semiconductor are installed in respectively on this chair body and lean on subsides place for the contact of human body predetermined position, and it respectively comprises a thin type metallic plate, an insulating barrier and an electric-heating thin film; These insulation series of strata are coated in this thin type metallic plate outer surface; This electric-heating thin film system is coated on the insulating barrier outer surface, forms the chip of a tool semiconduction jointly with this thin type metallic plate, insulating barrier, and connects input on this electric-heating thin film one direct current power supply is arranged.

2. the warm chip health care bed of semiconductor as claimed in claim 1 chair is characterized in that this thin type metallic plate means low carbon steel plate or enamel steel plate.

3. the warm chip health care bed of semiconductor as claimed in claim 1 chair is characterized in that this dc source comprises AC power and the AC/DC changeover switch that is connected with this AC power.

4. the warm chip health care bed of semiconductor as claimed in claim 1 chair is characterized in that this dc source is a battery.

5. the warm chip health care bed of semiconductor as claimed in claim 1 chair is characterized in that, this chair body mean office chair, couch, chaise longue, leisure chaise longue, automotive seat, folding chair, legless type chair, folding seat bed chair and sick bed any one.

6. the warm chip health care bed of semiconductor as claimed in claim 1 chair, it is characterized in that, also comprise and trample device, be installed on this chair body, have a trample part for human foot storing contact on it, the warm chip of this semiconductor system is arranged in this trample part.

7. the warm chip health care bed of semiconductor as claimed in claim 6 chair is characterized in that this chair body comprises a seat cushion position and a backrest position, and this front end place, seat cushion position is provided with a storage tank; This is trampled device and comprises and trample body and two slide guide members, and this is trampled the body top and is formed with this trample part, and this slide guide member system is installed on this respectively and tramples between body two avris and this storage tank two relative edge's sides.

8. the warm chip health care bed of semiconductor as claimed in claim 6 chair is characterized in that this chair body comprises a seat cushion position and a backrest position; This is trampled device and comprises and trample body and at least one pivot member, and this is trampled the body top and is formed with this trample part, and this pivot member system is articulated in this respectively and tramples between body and this seat cushion position front end.